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MAX5863E/D

Analog Devices

MAX5863E/D by Analog Devices

Analog Devices' MAX5863E/D is a cellphone IC with CMOS technology, operating b/w -40 °C to 85°C. It features a 3V supply voltage, suitable for RF and baseband circuits. This surface-mount chip has tin-lead finish and is ideal for industrial telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,041 parts In-Stock

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Digiode

USA . 1,206 parts In-Stock

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Anansix

USA . 226 parts In-Stock

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AZTECH Wire

Italy . 897 parts In-Stock

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$6.542

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MARBEL Systems

Belgium . 3,758 parts In-Stock

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$7.300

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Texas Native Microelectronics

USA . 21,367 parts In-Stock

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$8.391

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$8.055

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$7.804

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$7.384

21,367

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$8.055

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$7.384

Kenton Components

USA . 1,315 parts In-Stock

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$10.069

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$8.861

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$8.861

Qasali Group International

UK . 3,231 parts In-Stock

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$22.656

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$21.070

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$19.937

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Semicontronic

India . 766 parts In-Stock

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$755.000

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$736.125

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$732.350

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One Stop Electronics

USA . 2,421 parts In-Stock

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Corphita

USA . 2,570 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the MAX5863E/D by Analog Devices. As a leading manufacturer in the industry, Analog Devices brings you cellphone ICs that deliver unmatched performance and reliability. Ideal for a wide range of applications, this surface mount chip offers exceptional value, benefits, and advantages to customers. With a temperature grade of industrial and a nominal supply voltage of 3V, the MAX5863E/D is designed to meet your highest expectations. Elevate your devices to the next level with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.

Package Style (Meter): UNCASED CHIP

The unencased chip package style is compact and lightweight, making it suitable for mobile devices where space is at a premium.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperature conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this product to function reliably even in harsh environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring a reliable electrical connection.

Terminal Position: UPPER

The upper terminal position simplifies PCB layout and can help improve signal integrity in the circuit design.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets higher reliability and performance standards required in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in digital signal processing.

Terminal Form: NO LEAD

The absence of lead terminals reduces the risk of environmental contamination and aligns with modern environmental regulations.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This product integrates both RF and baseband circuits, providing comprehensive functionality for cellular communication systems.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is common in mobile devices, ensuring compatibility and seamless integration with existing power systems.

Technical Specifications

Cellphone ICs MAX5863E/D attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

X-XUUC-N

JESD-609 Code:

e0

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MAX5863E/D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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