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MAX5866ETM+T

Analog Devices

MAX5866ETM+T by Analog Devices

Analog Devices' MAX5866ETM+T is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features RF and baseband circuits, CMOS technology, and nominal voltage of 3V for telecom applications.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 5,162 parts In-Stock

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Digiode

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Anansix

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MARBEL Systems

Belgium . 6,657 parts In-Stock

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$10.491

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Texas Native Microelectronics

USA . 40 parts In-Stock

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$12.059

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$11.577

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$11.215

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$10.612

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Kenton Components

USA . 5,003 parts In-Stock

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AZTECH Wire

Italy . 315 parts In-Stock

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Qasali Group International

UK . 4,235 parts In-Stock

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$28.652

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Semicontronic

India . 657 parts In-Stock

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One Stop Electronics

USA . 2,235 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Corphita

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Microchip USA

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Overview

Elevate your cellphone's performance with the MAX5866ETM+T by Analog Devices. Known for its high-quality manufacturing, Analog Devices delivers top-notch Cellphone ICs that are designed to optimize your phone's capabilities. With a sleek surface mount design and advanced technology, this IC promises seamless integration and enhanced functionality. Whether you're looking to improve RF and baseband circuits or upgrade overall performance, the MAX5866ETM+T offers unmatched value and benefits for all your cellphone needs. Experience the difference with Analog Devices today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards, maximizing component placement and minimizing wasted area.

No. of Terminals: 48

Provides ample connectivity options for various functions and features within the cellphone IC.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme conditions, increasing versatility and reliability of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of package styles offers thermal management and space-saving benefits, ensuring efficient performance in a compact form factor.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of disconnection or signal interference.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of component damage during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering connections, reducing the risk of intermittent failures.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures consistent performance in demanding environments, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration, providing efficiency and performance benefits in cellphone applications.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is standard and widely compatible with various handset designs, ensuring broad compatibility.

Terminal Pitch: 0.5 mm

Small terminal pitch enables high-density integration and compact design, allowing for efficient use of space in the PCB layout.

Technical Specifications

Cellphone ICs MAX5866ETM+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MAX5866ETM+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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