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MAX5865E/D

Analog Devices

MAX5865E/D by Analog Devices

Analog Devices' MAX5865E/D is a cellphone IC with CMOS technology, operating b/w -40 °C to 85°C. It features an unencased chip package, tin lead finish, and 3V supply voltage. Ideal for RF and baseband circuits in industrial-grade telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,883 parts In-Stock

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Digiode

USA . 1,012 parts In-Stock

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Anansix

USA . 71 parts In-Stock

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MARBEL Systems

Belgium . 529 parts In-Stock

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$6.925

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AZTECH Wire

Italy . 580 parts In-Stock

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$6.953

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Texas Native Microelectronics

USA . 1,834 parts In-Stock

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$7.960

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$7.642

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$7.403

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$7.005

1,834

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Kenton Components

USA . 5,924 parts In-Stock

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$9.552

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$8.406

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Qasali Group International

UK . 868 parts In-Stock

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$21.492

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$19.988

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$18.913

868

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One Stop Electronics

USA . 1,832 parts In-Stock

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$707.000

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Semicontronic

India . 1,547 parts In-Stock

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$850.000

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$828.750

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$824.500

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Corphita

USA . 1,231 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the MAX5865E/D by Analog Devices. As a leader in cellphone ICs, Analog Devices delivers unparalleled quality and reliability in every product. This surface mount device is designed for industrial-grade applications, ensuring optimal performance in a wide range of operating conditions. With advanced CMOS technology and RF and baseband circuit capabilities, this innovative solution offers customers exceptional value, efficiency, and versatility. Trust Analog Devices to provide the perfect solution for your cellphone IC needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Style (Meter): UNCASED CHIP

The unencased chip design is compact and efficient, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures means this product can function in various environments, including extreme cold conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and electrical conductivity, ensuring reliable connections in the circuit.

Terminal Position: UPPER

The upper terminal position makes it easier to integrate this product into circuit designs and allows for better routing of connections.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is suitable for use in rugged industrial environments where temperature fluctuations are common.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and makes this product more environmentally friendly.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit integration in this product simplifies the design of telecommunications systems and improves overall performance.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V, this product is compatible with a wide range of devices and battery-powered applications.

Technical Specifications

Cellphone ICs MAX5865E/D attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

X-XUUC-N

JESD-609 Code:

e0

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MAX5865E/D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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