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MAX5866ETM+

Analog Devices

MAX5866ETM+ by Analog Devices

Analog Devices' MAX5866ETM+ is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

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MAX5866ETM+ by Analog Devices
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Vyrian

USA . 3,422 parts In-Stock

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Digiode

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Anansix

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MARBEL Systems

Belgium . 363 parts In-Stock

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$10.327

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AZTECH Wire

Italy . 233 parts In-Stock

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$11.278

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Texas Native Microelectronics

USA . 1,279 parts In-Stock

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$11.870

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$11.395

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$11.039

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$10.446

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Kenton Components

USA . 3,035 parts In-Stock

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$14.244

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Qasali Group International

UK . 2,436 parts In-Stock

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$32.049

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$29.806

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$28.203

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Microchip USA

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Semicontronic

India . 639 parts In-Stock

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One Stop Electronics

USA . 1,778 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Overview

Elevate your cellphone's performance with the MAX5866ETM+ from Analog Devices. Known for their top-quality manufacturing, Analog Devices delivers cutting-edge Cellphone ICs that ensure optimal functionality and reliability. With a sleek square package shape and a high terminal count of 48, this IC is designed to meet the demands of modern communication devices. Experience seamless integration and improved efficiency with the MAX5866ETM+, making it the perfect choice for telecommunications applications. Choose Analog Devices for superior quality and unmatched performance in every product.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product a convenient choice for manufacturers.

Package Shape: SQUARE

The square package shape can help in optimizing space on the circuit board, making it a suitable choice for compact designs.

No. of Terminals: 48

Having 48 terminals provides flexibility in connection options for various functions, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environments and ensure reliable performance under stress.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme cold conditions, making this product suitable for a variety of environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a reliable and durable connection, ensuring long-term performance of the product.

Maximum Seated Height: 0.8 mm

The low seated height helps in reducing the overall profile of the product, making it suitable for slim and compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time helps in efficient manufacturing processes, ensuring quick and reliable assembly of the product.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the reflow soldering process without degrading, ensuring robust solder joints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments, making it a durable choice for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in data processing.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with RoHS regulations, making it a sustainable choice for manufacturers.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V makes this product compatible with a wide range of systems and power sources, ensuring versatility in applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting, making it suitable for applications where space is limited and multiple connections are required.

Technical Specifications

Cellphone ICs MAX5866ETM+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MAX5866ETM+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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