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ADF4360-9BCPZ

Analog Devices

ADF4360-9BCPZ by Analog Devices

Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.

Median Price

$9.880

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 225 parts In-Stock

1+ parts

$8.790

100+ parts

$5.510

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-

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225

$8.790

$5.510

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DigiKey

USA . 446 parts In-Stock

1+ parts

$9.880

100+ parts

$7.158

1k+ parts

$5.963

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446

$9.880

$7.158

$5.963

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Newark

USA . 129 parts In-Stock

1+ parts

$10.180

100+ parts

$6.670

1k+ parts

$6.280

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129

$10.180

$6.670

$6.280

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Analog Devices Inc

USA . 555 parts In-Stock

1+ parts

$10.630

100+ parts

$6.365

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$4.350

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555

$10.630

$6.365

$4.350

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Farnell

UK . 129 parts In-Stock

1+ parts

$10.660

100+ parts

$6.860

1k+ parts

$6.420

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129

$10.660

$6.860

$6.420

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Element14

Singapore . 129 parts In-Stock

1+ parts

$16.840

100+ parts

$9.000

1k+ parts

$7.740

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129

$16.840

$9.000

$7.740

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RS (Exports)

UK . 423 parts In-Stock

1+ parts

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$7.216

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$6.813

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423

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$7.216

$6.813

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Verical

USA . 125 parts In-Stock

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$5.686

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125

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$5.686

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Rochester

USA . 18 parts In-Stock

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100+ parts

$5.440

1k+ parts

$4.870

10k+ parts

$4.580

18

-

$5.440

$4.870

$4.580

Distributors (In-Stock)

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Digiode

USA . 552 parts In-Stock

1+ parts

$8.350

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552

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Vyrian

USA . 7,033 parts In-Stock

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7,033

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Chip Stock

USA . 3,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 324 parts In-Stock

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324

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Bristol Electronics

USA . 45 parts In-Stock

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45

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Atlantic Semiconductor

USA . 29 parts In-Stock

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PC Components Company LLC

USA . 16 parts In-Stock

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Rebound Electronics

UK . 4 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 207 parts In-Stock

1+ parts

$4.830

100+ parts

$4.709

1k+ parts

$4.685

10k+ parts

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207

$4.830

$4.709

$4.685

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Vigor

Singapore . 4,745 parts In-Stock

1+ parts

$7.740

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4,745

$7.740

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Corphita

USA . 198 parts In-Stock

1+ parts

$7.911

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198

$7.911

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Continental Prestige Electronics

USA . 134 parts In-Stock

1+ parts

$8.430

100+ parts

$6.310

1k+ parts

$4.790

10k+ parts

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134

$8.430

$6.310

$4.790

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Parana Technologies

USA . 3,588 parts In-Stock

1+ parts

$10.819

100+ parts

-

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$10.061

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3,588

$10.819

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$10.061

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IDEA Electronic Components Group

UK . 2,121 parts In-Stock

1+ parts

$11.633

100+ parts

$11.051

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$11.051

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2,121

$11.633

$11.051

$11.051

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DigiPath Technology Company

USA . 1,932 parts In-Stock

1+ parts

$18.147

100+ parts

$17.422

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-

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$17.422

1,932

$18.147

$17.422

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$17.422

Microchip USA

USA . 1,949 parts In-Stock

1+ parts

$28.110

100+ parts

$27.710

1k+ parts

$27.510

10k+ parts

$27.310

1,949

$28.110

$27.710

$27.510

$27.310

QUARKTWIN TECHNOLOGY LTD

USA . 11,624 parts In-Stock

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Alle Elektronik GmbH

Germany . 5,049 parts In-Stock

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Perfect Parts

USA . 3,665 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,489 parts In-Stock

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2,489

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Lixinc

USA . 974 parts In-Stock

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974

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Native Components

USA . 857 parts In-Stock

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Northwest PG Solutions

USA . 723 parts In-Stock

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723

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Metaverse IC Inc.

Canada . 434 parts In-Stock

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434

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Infinite Electronics LLP (Excess)

. 39 parts In-Stock

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Kepictronics

USA . 34 parts In-Stock

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Overview

Enhance the performance of your cellphone with the ADF4360-9BCPZ by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality Cellphone ICs that provide unmatched reliability and efficiency. This compact and versatile product is designed for various applications, ensuring seamless integration and superior functionality. Upgrade your device today and experience the value and benefits that only Analog Devices can offer. Trust in Analog Devices to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

Square package shape provides better thermal and electrical performance compared to other shapes.

Power Supplies (V): 3.3

Operates at a standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 24

Sufficient number of terminals for connecting various circuits and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options for different application requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position: QUAD

Quad terminal position offers improved stability and mechanical strength.

Maximum Seated Height: 1 mm

Low seated height for space-constrained designs.

Width: 4 mm

Compact width for integration into small form factor devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature to prevent component damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints during assembly.

Length: 4 mm

Compact length for fitting into tight spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade for rugged and reliable performance.

Technology: BICMOS

BiCMOS technology combines the benefits of CMOS and bipolar technologies for high performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly manufacturing.

Telecom IC Type: BASEBAND CIRCUIT

Designed for baseband processing in telecommunications applications.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with other components.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and improved electrical performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity, suitable for most environments.

Technical Specifications

Cellphone ICs ADF4360-9BCPZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-9BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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