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GC5016-PBZ

Texas Instruments

GC5016-PBZ by Texas Instruments

Texas Instruments GC5016-PBZ is a Cellphone IC with 252 terminals in a GRID ARRAY package. Operating at -40 to 85°C, it has power supplies of 1.8V and 3.3V for RF and baseband circuits. With PLASTIC/EPOXY body material, it's ideal for telecom applications requiring high performance in industrial settings.

Median Price

$40.376

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 77,418 parts In-Stock

1+ parts

-

100+ parts

$35.890

1k+ parts

$32.110

10k+ parts

$30.220

77,418

-

$35.890

$32.110

$30.220

DigiKey

USA . 77,418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77,418

-

-

-

-

Verical

USA . 73,695 parts In-Stock

1+ parts

-

100+ parts

$44.862

1k+ parts

$40.138

10k+ parts

$37.775

73,695

-

$44.862

$40.138

$37.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,577 parts In-Stock

1+ parts

$37.886

100+ parts

-

1k+ parts

-

10k+ parts

-

4,577

$37.886

-

-

-

Vyrian

USA . 3,683 parts In-Stock

1+ parts

$39.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3,683

$39.880

-

-

-

DigiKey Marketplace

USA . 78,840 parts In-Stock

1+ parts

$41.480

100+ parts

-

1k+ parts

-

10k+ parts

-

78,840

$41.480

-

-

-

Bristol Electronics

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

9

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Prism Electronics

USA . 4 parts In-Stock

1+ parts

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-

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4

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Lantek

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

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3

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 843 parts In-Stock

1+ parts

$0.047

100+ parts

-

1k+ parts

-

10k+ parts

$0.045

843

$0.047

-

-

$0.045

Parana Technologies

USA . 2,347 parts In-Stock

1+ parts

$14.738

100+ parts

-

1k+ parts

$15.180

10k+ parts

-

2,347

$14.738

-

$15.180

-

IDEA Electronic Components Group

UK . 1,374 parts In-Stock

1+ parts

$16.559

100+ parts

$15.731

1k+ parts

$14.903

10k+ parts

-

1,374

$16.559

$15.731

$14.903

-

ChromeModa Solutions

Germany . 1,292 parts In-Stock

1+ parts

$16.559

100+ parts

$13.578

1k+ parts

-

10k+ parts

-

1,292

$16.559

$13.578

-

-

Corphita

USA . 4,965 parts In-Stock

1+ parts

$35.892

100+ parts

-

1k+ parts

-

10k+ parts

-

4,965

$35.892

-

-

-

A-Z Elektronik GmbH

Germany . 5,357 parts In-Stock

1+ parts

-

100+ parts

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5,357

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-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

-

-

-

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DigiPath Technology Company

USA . 1,098 parts In-Stock

1+ parts

-

100+ parts

$14.930

1k+ parts

-

10k+ parts

-

1,098

-

$14.930

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,000

-

-

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Lixinc

USA . 675 parts In-Stock

1+ parts

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100+ parts

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675

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Northwest PG Solutions

USA . 403 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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403

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Perfect Parts

USA . 172 parts In-Stock

1+ parts

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-

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172

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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50

-

-

-

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Speed Components Ltd (Excess)

Israel . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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20

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-

-

-

Overview

Discover the cutting-edge GC5016-PBZ by Texas Instruments, a top-of-the-line Cellphone IC that promises unparalleled quality and performance. With Texas Instruments' reputation for excellence in technology, this product offers customers reliability and innovation in a compact square package. Perfect for telecom applications requiring RF and baseband circuitry, this IC boasts a wide operating temperature range and high-grade terminal finish. Elevate your products with the value and benefits of the GC5016-PBZ - trust in Texas Instruments for superior solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good protection and durability for the cellphone IC, making it a reliable choice.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration of the IC onto the circuit board, saving space and simplifying the assembly process.

Power Supplies (V): 1.8,3.3

With support for multiple power supply voltages, this IC can be compatible with various systems and applications, providing flexibility in design.

No. of Terminals: 252

The high number of terminals allows for more connectivity options and functionality, making the cellphone IC versatile and capable of handling complex tasks.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even under demanding conditions, enhancing the reliability of the cellphone IC.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature extends the usability of the IC to colder environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishes ensures good conductivity and resistance to corrosion, maintaining the performance of the IC over time.

Width: 17 mm

The compact width of the IC makes it suitable for space-constrained designs, allowing for integration into smaller devices without compromising functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that the IC can operate reliably in harsh industrial environments, making it suitable for robust applications.

Technical Specifications

Cellphone ICs GC5016-PBZ attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B252

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

252

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.02 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

GC5016-PBZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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