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TLV321AC37CPT

Texas Instruments

TLV321AC37CPT by Texas Instruments

TLV321AC37CPT by Texas Instruments is a 48-terminal cellphone IC with CMOS technology. It operates b/w 0-70°C, has a nominal voltage of 3V, and features a low-profile flatpack package style. Ideal for baseband circuits in telecom applications due to its fine pitch and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,829 parts In-Stock

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8,829

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Digiode

USA . 4,865 parts In-Stock

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4,865

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,880 parts In-Stock

1+ parts

$7.646

100+ parts

-

1k+ parts

$8.165

10k+ parts

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1,880

$7.646

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$8.165

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DigiPath Technology Company

USA . 506 parts In-Stock

1+ parts

$8.419

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506

$8.419

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ChromeModa Solutions

Germany . 5,666 parts In-Stock

1+ parts

$8.591

100+ parts

$7.045

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5,666

$8.591

$7.045

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IDEA Electronic Components Group

UK . 1,480 parts In-Stock

1+ parts

$8.591

100+ parts

$8.161

1k+ parts

$7.732

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1,480

$8.591

$8.161

$7.732

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AZTECH Wire

Italy . 868 parts In-Stock

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$11.609

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868

$11.609

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One Stop Electronics

USA . 208 parts In-Stock

1+ parts

$391.000

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208

$391.000

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Corphita

USA . 3,379 parts In-Stock

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3,379

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Overview

Enhance the performance of your cellphone with the TLV321AC37CPT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that are designed to optimize your device's functionality. With its advanced technology and reliable performance, this product is perfect for various applications in the telecommunications sector. Experience seamless connectivity and improved efficiency with the TLV321AC37CPT, providing exceptional value and benefits for all customers looking for superior cellphone ICs. Upgrade your device today and unlock a world of possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, which is ideal for mobile devices like cellphones.

Surface Mount: YES

Surface mount technology allows for efficient and compact placement of the IC on the circuit board, saving space and enabling smaller cellphone designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC is suitable for use in cellphones without overheating, ensuring reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable for cellphone applications.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is common in cellphone circuits, ensuring compatibility and efficient power usage for the device.

Technical Specifications

Cellphone ICs TLV321AC37CPT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLV321AC37CPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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