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TRF6900PT

Texas Instruments

TRF6900PT by Texas Instruments

TRF6900PT by Texas Instruments is a cellphone IC with 48 terminals, operating at -20 to 60°C. It features a CMOS technology, 0.5mm terminal pitch, and RF/baseband circuit for telecom applications. The package is low profile, square-shaped, and surface-mountable in plastic/epoxy material.

Median Price

$3.945

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 219 parts In-Stock

1+ parts

$23.400

100+ parts

$11.500

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$23.400

$11.500

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Rochester

USA . 8,171 parts In-Stock

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-

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$3.280

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$2.930

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$2.760

8,171

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$3.280

$2.930

$2.760

DigiKey

USA . 8,171 parts In-Stock

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$3.790

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$3.790

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Verical

USA . 6,005 parts In-Stock

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$4.100

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$3.663

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$3.450

6,005

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$4.100

$3.663

$3.450

Distributors (In-Stock)

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Digiode

USA . 4,149 parts In-Stock

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$3.458

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$3.458

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Vyrian

USA . 1,347 parts In-Stock

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$3.640

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$3.640

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Cyclops Electronics Ltd

UK . 9,000 parts In-Stock

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DigiKey Marketplace

USA . 8,171 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,022 parts In-Stock

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LWI Electronics Inc

India . 499 parts In-Stock

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499

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Touchstone Systems

USA . 222 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 171 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,933 parts In-Stock

1+ parts

$3.276

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$3.276

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Component Stockers USA

USA . 10,770 parts In-Stock

1+ parts

$3.680

100+ parts

$3.460

1k+ parts

$3.130

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10,770

$3.680

$3.460

$3.130

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Parana Technologies

USA . 1,731 parts In-Stock

1+ parts

$13.393

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$13.909

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1,731

$13.393

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$13.909

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DigiPath Technology Company

USA . 1,761 parts In-Stock

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$14.747

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1,761

$14.747

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ChromeModa Solutions

Germany . 5,230 parts In-Stock

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$15.048

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$12.339

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5,230

$15.048

$12.339

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IDEA Electronic Components Group

UK . 1,466 parts In-Stock

1+ parts

$15.048

100+ parts

$14.296

1k+ parts

$13.543

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1,466

$15.048

$14.296

$13.543

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GreenTree Electronics

Israel . 200,000 parts In-Stock

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Kepictronics

USA . 57,663 parts In-Stock

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Lixinc

USA . 17,548 parts In-Stock

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Emar International I/E

Canada . 16,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,074 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6,022 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Glotronic Ltd.

UK . 818 parts In-Stock

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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Overview

Unlock the full potential of your cellphone with the TRF6900PT by Texas Instruments. Designed with precision and expertise, this high-quality Cellphone IC offers seamless integration and exceptional performance. From improved connectivity to enhanced signal processing, this product is a game-changer for your device. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your cellphone experience today with the TRF6900PT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and insulation, making the product more reliable in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs in manufacturing.

Package Shape: SQUARE

Square package shape offers uniformity and space efficiency in circuit board layout, optimizing overall design aesthetics and functionality.

Power Supplies (V): 2.2/3.6

Multiple power supply options provide flexibility in voltage requirements, catering to different system configurations and power management needs.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity and signal transmission, enabling comprehensive integration with other components in the cellphone IC system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits, ensuring efficient use of board real estate and enhancing overall product compactness.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60°C, the product demonstrates good thermal tolerance, ensuring stable performance even under demanding environmental conditions.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20°C showcases the product's reliability and functionality in extreme cold environments without compromising performance.

Terminal Position: QUAD

Quad terminal positioning enables efficient signal routing and connectivity, facilitating seamless integration within the overall circuit design for optimal performance.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6 mm ensures a low-profile design, which is beneficial for compact electronic devices such as cellphones where space is limited.

Width: 7 mm

A width of 7 mm offers a balanced form factor for the package, allowing for easy integration into the cell phone circuit layout without occupying excessive space.

Length: 7 mm

A length of 7 mm complements the square package shape, providing a symmetrical and compact design that is ideal for cellphone IC applications where space optimization is crucial.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that the product meets industry standards for reliable performance in typical operating environments, making it a suitable choice for mainstream cellphone applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital devices, enhancing the efficiency and reliability of the cellphone IC.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and efficient soldering connections, ensuring secure attachment to the PCB and reliable signal transmission within the cellphone IC system.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit capabilities in a single IC enhances the performance and functionality of the cellphone, enabling seamless communication and data processing for a superior user experience.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm offers precise signal routing and connectivity, facilitating high-speed data transmission and integration with other components in the cellphone IC system for enhanced overall performance.

Technical Specifications

Cellphone ICs TRF6900PT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.2/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TRF6900PT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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