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ADS58C23IPFPR

Texas Instruments

ADS58C23IPFPR by Texas Instruments

Texas Instruments ADS58C23IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. Ideal for RF and baseband circuits, this IC has a compact square package style with gull wing terminals suitable for surface mount applications.

Median Price

$102.351

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,269 parts In-Stock

1+ parts

$102.351

100+ parts

$99.273

1k+ parts

$76.956

10k+ parts

-

1,269

$102.351

$99.273

$76.956

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,787 parts In-Stock

1+ parts

$97.233

100+ parts

-

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-

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2,787

$97.233

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Vyrian

USA . 1,978 parts In-Stock

1+ parts

-

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1,978

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,749 parts In-Stock

1+ parts

$11.718

100+ parts

-

1k+ parts

$12.110

10k+ parts

-

1,749

$11.718

-

$12.110

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DigiPath Technology Company

USA . 348 parts In-Stock

1+ parts

$12.903

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-

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348

$12.903

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-

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IDEA Electronic Components Group

UK . 1,852 parts In-Stock

1+ parts

$13.166

100+ parts

$12.508

1k+ parts

$11.849

10k+ parts

-

1,852

$13.166

$12.508

$11.849

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ChromeModa Solutions

Germany . 1,703 parts In-Stock

1+ parts

$13.166

100+ parts

$10.796

1k+ parts

-

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1,703

$13.166

$10.796

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AZTECH Wire

Italy . 827 parts In-Stock

1+ parts

$13.550

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827

$13.550

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Corphita

USA . 2,112 parts In-Stock

1+ parts

$92.116

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-

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2,112

$92.116

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A-Z Elektronik GmbH

Germany . 4,581 parts In-Stock

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4,581

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Authorized Procurement Solutions

USA . 3,400 parts In-Stock

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3,400

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Alle Elektronik GmbH

Germany . 3,054 parts In-Stock

1+ parts

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3,054

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Lixinc

USA . 861 parts In-Stock

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861

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Native Components

USA . 522 parts In-Stock

1+ parts

-

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$4.734

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522

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-

$4.734

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Northwest PG Solutions

USA . 384 parts In-Stock

1+ parts

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$4.782

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384

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$4.782

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Kepictronics

USA . 242 parts In-Stock

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242

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Overview

Unlock the full potential of your cellphone with the ADS58C23IPFPR by Texas Instruments. Known for their unparalleled quality and reliability, Texas Instruments delivers cutting-edge solutions in the telecommunications industry. This versatile Cellphone IC offers outstanding performance and efficiency, making it ideal for a wide range of applications. Experience seamless connectivity, improved functionality, and enhanced user experience with this innovative product. Upgrade your device today and enjoy the advantages of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation and removal of the IC, saving time and effort during assembly.

No. of Terminals: 80

With a high number of terminals, this IC can support a complex circuit design, enabling efficient performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the IC can function reliably even in demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the IC.

Width: 12 mm

The compact width of the IC allows for space-saving installation in a variety of devices, making it versatile and efficient.

Maximum Analog Input: 3.45 V

The high maximum analog input voltage allows for accurate signal processing and improved performance in analog applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures that the IC can withstand harsh conditions, making it suitable for a wide range of applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting of the IC, facilitating compact circuit design and efficient use of space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC has a moderate sensitivity to moisture, allowing for safe handling and storage without risk of damage.

Technical Specifications

Cellphone ICs ADS58C23IPFPR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Maximum Analog Input:

3.45 V

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

ADS58C23IPFPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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