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TRF6903PT

Texas Instruments

TRF6903PT by Texas Instruments

TRF6903PT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with power supplies of 2.5/3.3V. This RF and baseband circuit has a low profile flatpack style for industrial telecom applications.

Median Price

$4.620

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,895 parts In-Stock

1+ parts

-

100+ parts

$4.000

1k+ parts

$3.580

10k+ parts

$3.370

5,895

-

$4.000

$3.580

$3.370

DigiKey

USA . 5,895 parts In-Stock

1+ parts

-

100+ parts

$4.620

1k+ parts

-

10k+ parts

-

5,895

-

$4.620

-

-

Verical

USA . 5,895 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

$4.475

10k+ parts

$4.213

5,895

-

$5.000

$4.475

$4.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,792 parts In-Stock

1+ parts

$4.218

100+ parts

-

1k+ parts

-

10k+ parts

-

1,792

$4.218

-

-

-

Vyrian

USA . 1,007 parts In-Stock

1+ parts

$4.440

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$4.440

-

-

-

DigiKey Marketplace

USA . 5,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,895

-

-

-

-

Global Solutions Electronics Company

USA . 1,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,151

-

-

-

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ACDS - Activité Composants Distribution Service

France . 49 parts In-Stock

1+ parts

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-

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49

-

-

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Connector Distribution Corp

USA . 33 parts In-Stock

1+ parts

-

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-

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33

-

-

-

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Right Parts Inc.

USA . 33 parts In-Stock

1+ parts

-

100+ parts

-

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33

-

-

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LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,824 parts In-Stock

1+ parts

$3.996

100+ parts

-

1k+ parts

-

10k+ parts

-

3,824

$3.996

-

-

-

Parana Technologies

USA . 990 parts In-Stock

1+ parts

$5.407

100+ parts

-

1k+ parts

$6.104

10k+ parts

-

990

$5.407

-

$6.104

-

ChromeModa Solutions

Germany . 6,108 parts In-Stock

1+ parts

$6.075

100+ parts

$4.982

1k+ parts

-

10k+ parts

-

6,108

$6.075

$4.982

-

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IDEA Electronic Components Group

UK . 2,086 parts In-Stock

1+ parts

$6.075

100+ parts

-

1k+ parts

$5.468

10k+ parts

-

2,086

$6.075

-

$5.468

-

Advanced Electronics

New Zealand . 87 parts In-Stock

1+ parts

$18.238

100+ parts

$16.597

1k+ parts

$14.955

10k+ parts

-

87

$18.238

$16.597

$14.955

-

Lixinc

USA . 7,152 parts In-Stock

1+ parts

-

100+ parts

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7,152

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A-Z Elektronik GmbH

Germany . 413 parts In-Stock

1+ parts

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413

-

-

-

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DigiPath Technology Company

USA . 62 parts In-Stock

1+ parts

-

100+ parts

$5.477

1k+ parts

-

10k+ parts

-

62

-

$5.477

-

-

Cyclops Electronics Ltd (Excess)

UK . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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49

-

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Kepictronics

USA . 25 parts In-Stock

1+ parts

-

100+ parts

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25

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-

Overview

Elevate your cellphone performance with the TRF6903PT by Texas Instruments. Known for their cutting-edge technology and superior quality, Texas Instruments has crafted this Cellphone IC to enhance your device's functionality. From improved signal processing to efficient power management, this versatile component offers unmatched value and benefits. Whether you're looking to boost your phone's connectivity or optimize its battery life, the TRF6903PT is the solution you've been searching for. Trust Texas Instruments to deliver top-of-the-line products that elevate your user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is commonly used in electronic components due to its durability and resistance to heat, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of electronic circuits, making this product suitable for high volume production.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows flexibility in design and compatibility with different system requirements.

Package Shape: SQUARE

Square package shape provides efficient use of board space and facilitates easier placement and routing of traces, improving overall system layout.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even under demanding conditions, making this product suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish on terminals provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Width: 7 mm

Compact width allows for more components to be placed in a limited space, enabling smaller and more efficient electronic devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and assembly of the component, making it suitable for automated mass production processes.

Nominal Supply Voltage: 2.7 V

Close matching of nominal supply voltage to common battery voltages simplifies power management in portable devices and extends battery life.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high density mounting of components on the PCB, enabling compact and lightweight designs for cellphones and other electronic devices.

Technical Specifications

Cellphone ICs TRF6903PT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF6903PT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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