Loading...

1166

Texas Instruments

1166 by Texas Instruments

The Texas Instruments 1166 is a cellphone IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications at 3V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

PEI Genesis

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Verical

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,828

-

-

-

-

Digiode

USA . 3,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,625

-

-

-

-

Electronic Expediters

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$9.444

100+ parts

$9.349

1k+ parts

$8.972

10k+ parts

-

50

$9.444

$9.349

$8.972

-

Parana Technologies

USA . 1,414 parts In-Stock

1+ parts

$14.914

100+ parts

-

1k+ parts

$15.338

10k+ parts

-

1,414

$14.914

-

$15.338

-

DigiPath Technology Company

USA . 1,429 parts In-Stock

1+ parts

$16.422

100+ parts

$15.108

1k+ parts

-

10k+ parts

-

1,429

$16.422

$15.108

-

-

IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$16.757

100+ parts

$15.919

1k+ parts

$15.081

10k+ parts

-

2,087

$16.757

$15.919

$15.081

-

Native Components

USA . 844 parts In-Stock

1+ parts

$43.965

100+ parts

-

1k+ parts

-

10k+ parts

$42.206

844

$43.965

-

-

$42.206

Northwest PG Solutions

USA . 1,983 parts In-Stock

1+ parts

$48.362

100+ parts

-

1k+ parts

-

10k+ parts

-

1,983

$48.362

-

-

-

Corphita

USA . 1,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,705

-

-

-

-

Overview

Elevate your cellphone performance with the 1166 by Texas Instruments, a top-tier Cellphone IC that exceeds expectations. With a cutting-edge design and advanced technology, this surface-mountable chip carrier is perfect for telecom applications requiring RF and baseband circuits. Its industrial-grade temperature tolerance of -40 to 85°C ensures optimal performance in any environment. Trust Texas Instruments for quality and reliability, and experience the unmatched value and benefits that the 1166 brings to your device. Boost your cellphone's capabilities today with the 1166.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient soldering onto circuit boards, making installation and assembly process faster.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the circuit board and allowing for higher density integration.

No. of Terminals: 20

Sufficient number of terminals for connecting various components and interfaces, offering versatility in functionality.

Maximum Operating Temperature: 85 °C

Capable of operating at higher temperatures ensures reliability and stability under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Able to function in low-temperature environments, suitable for a wider range of applications and climates.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Diverse package styles provide flexibility in design options, catering to different requirements and preferences.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections, reducing signal interference and improving performance.

Maximum Seated Height: 0.95 mm

Low height profile enables slim and compact device designs, making it suitable for thin and lightweight electronics.

Width: 4 mm

Compact width dimension contributes to the overall space-saving design, ideal for applications where size constraints are critical.

Length: 4 mm

Short length dimension further enhances the compactness of the product, facilitating integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and durability in harsh operating environments, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency and performance of the device.

Terminal Form: NO LEAD

Lead-free terminal form conforms to RoHS regulations, promoting environmental sustainability and compliance with industry standards.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuitry provides comprehensive communication capabilities, suitable for advanced cellphone functionalities.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources, facilitating easy integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density connections, enabling complex circuit designs and maximizing functionality within limited space.

Technical Specifications

Cellphone ICs 1166 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Length:

4 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.95 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

1166 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

2910-15-002-7467, 2910150027467, 3110-00-156-7651, 3110001567651, 3120-01-106-0161, 3120011060161, 3120-01-584-6498, 3120015846498, 3465-01-071-3561, 3465010713561, 3895-99-755-7849, 3895997557849, 4210-99-412-7511, 4210994127511, 4240-01-353-4813, 4240013534813, 4510-21-864-8600, 4510218648600, 4720-21-891-4269, 4720218914269, 4730-01-535-7372, 4730015357372, 4730-21-899-6009, 4730218996009, 4820-66-073-9012, 4820660739012, 4930-00-400-5407, 4930004005407, 5120-00-228-9510, 5120002289510, 5120-01-425-9083, 5120014259083, 5120-21-808-6807, 5120218086807, 5120-01-367-0092, 5120013670092, 5120-01-509-1320, 5120015091320, 5120-12-131-2899, 5120121312899, 5305-00-370-0030, 5305003700030, 5306-01-161-2566, 5306011612566, 5310-33-002-3810, 5310330023810, 5330-00-953-5888, 5330009535888, 5330-14-206-3271, 5330142063271, 5330-99-254-0593, 5330992540593, 5355-00-284-5659, 5355002845659, 5365-01-501-1193, 5365015011193, 5365-99-554-0711, 5365995540711, 5905-14-222-7692, 5905142227692, 5910-99-647-6691, 5910996476691, 5940-01-516-4754, 5940015164754, 5940-14-521-3708, 5940145213708, 5945-00-510-0550, 5945005100550, 5961-00-760-7184, 5961007607184, 5975-14-445-0380, 5975144450380, 5999-01-146-7149, 5999011467149, 5999-14-297-0193, 5999142970193, 6510-12-221-0017, 6510122210017, 6515-00-300-4596, 6515003004596, 6530-33-189-7925, 6530331897925, 6640-12-193-0102, 6640121930102, 6760-00-411-7126, 6760004117126, 6910-99-225-0351, 6910992250351, 6810-99-220-1879, 6810992201879, 6930-99-930-5825, 6930999305825, 7420-00-137-5635, 7420001375635, 7530-01-161-2002, 7530011612002, 5975-00-423-6709, 5975004236709, 8010-14-384-3417, 8010143843417, 8915-01-415-9080, 8915014159080

NIIN

150027467, 001567651, 011060161, 015846498, 010713561, 997557849, 994127511, 013534813, 218648600, 218914269, 015357372, 218996009, 660739012, 004005407, 002289510, 014259083, 218086807, 013670092, 015091320, 121312899, 003700030, 011612566, 330023810, 009535888, 142063271, 992540593, 002845659, 015011193, 995540711, 142227692, 996476691, 015164754, 145213708, 005100550, 007607184, 144450380, 011467149, 142970193, 122210017, 003004596, 331897925, 121930102, 004117126, 992250351, 992201879, 999305825, 001375635, 011612002, 004236709, 143843417, 014159080

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7