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TRF4903PWR

Texas Instruments

TRF4903PWR by Texas Instruments

TRF4903PWR by Texas Instruments is a cellphone IC with 24 terminals, operating voltage of 2.7V, and low supply current of 0.043mA. It features RF and baseband circuits for telecom applications. The package is small outline, thin profile, suitable for surface mount with a rectangular shape made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,717 parts In-Stock

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8,717

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Digiode

USA . 152 parts In-Stock

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152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 206 parts In-Stock

1+ parts

$8.416

100+ parts

$781.538

1k+ parts

$7.574

10k+ parts

-

206

$8.416

$781.538

$7.574

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DigiPath Technology Company

USA . 300 parts In-Stock

1+ parts

$9.267

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300

$9.267

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ChromeModa Solutions

Germany . 2,883 parts In-Stock

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$9.456

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$7.754

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2,883

$9.456

$7.754

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IDEA Electronic Components Group

UK . 1,072 parts In-Stock

1+ parts

$9.456

100+ parts

$8.983

1k+ parts

$8.510

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1,072

$9.456

$8.983

$8.510

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AZTECH Wire

Italy . 688 parts In-Stock

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$18.578

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688

$18.578

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Ampacity Inc.

Singapore . 707 parts In-Stock

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$447.000

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707

$447.000

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One Stop Electronics

USA . 1,292 parts In-Stock

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$652.000

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$652.000

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Semicontronic

India . 1,496 parts In-Stock

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$755.000

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$736.125

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$732.350

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1,496

$755.000

$736.125

$732.350

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Corohmni

South Africa . 232 parts In-Stock

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Corphita

USA . 119 parts In-Stock

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Overview

Upgrade your cellphone performance with the TRF4903PWR from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are designed to enhance your mobile experience. This versatile IC is perfect for a wide range of applications, offering reliable performance and efficiency. With its small outline and thin profile, the TRF4903PWR is easy to integrate into your device while providing exceptional power and connectivity. Trust Texas Instruments to provide you with cutting-edge technology that brings value and benefits to your everyday life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the cellphone ICs easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling high-density designs.

Power Supplies (V): 2.7

Operating at a low voltage of 2.7 V helps in reducing power consumption and extending battery life in mobile devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, these cellphone ICs can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85°C allows these ICs to function in extreme temperature environments without any issues.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and reliable electrical connections, enhancing the overall performance and reliability of the ICs.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7 V ensures efficient power management and compatibility with various electronic devices.

Technical Specifications

Cellphone ICs TRF4903PWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.043 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRF4903PWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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