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TRF4903PW

Texas Instruments

TRF4903PW by Texas Instruments

TRF4903PW by Texas Instruments is a cellphone IC with 24 terminals, operating voltage of 2.7V, and max supply current of 0.042mA. It features RF and baseband circuits for telecom applications, in a small outline package suitable for industrial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,853 parts In-Stock

1+ parts

-

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5,853

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Digiode

USA . 1,549 parts In-Stock

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1,549

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$4.900

100+ parts

-

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329

$4.900

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Parana Technologies

USA . 482 parts In-Stock

1+ parts

$9.575

100+ parts

-

1k+ parts

$10.171

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482

$9.575

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$10.171

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DigiPath Technology Company

USA . 79 parts In-Stock

1+ parts

$10.543

100+ parts

$9.699

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-

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79

$10.543

$9.699

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ChromeModa Solutions

Germany . 6,684 parts In-Stock

1+ parts

$10.758

100+ parts

$8.822

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-

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6,684

$10.758

$8.822

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$10.758

100+ parts

$10.220

1k+ parts

$9.682

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1,283

$10.758

$10.220

$9.682

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Ampacity Inc.

Singapore . 865 parts In-Stock

1+ parts

$54.000

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865

$54.000

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One Stop Electronics

USA . 997 parts In-Stock

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$924.000

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997

$924.000

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Corphita

USA . 940 parts In-Stock

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940

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Overview

Enhance the performance of your cellphone with the TRF4903PW by Texas Instruments. Crafted with precision and expertise, this innovative IC offers seamless integration in your device, providing superior connectivity and efficiency. Designed with high-quality materials and cutting-edge technology, this compact component guarantees reliability and durability. Whether you're a tech enthusiast or a mobile industry professional, the TRF4903PW is the perfect solution for optimizing your device's performance. Upgrade your cellphone experience today and unlock the endless possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Power Supplies (V): 2.7

The 2.7V power supply is suitable for low power applications, making the product energy efficient.

No. of Terminals: 24

Having 24 terminals provides flexibility and connectivity options for various circuit configurations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for a wide range of environmental conditions.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The product being designed for RF and Baseband circuits makes it ideal for cellphone applications, providing excellent signal processing capabilities.

Technical Specifications

Cellphone ICs TRF4903PW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.042 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRF4903PW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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