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MAX2903ETI+

Analog Devices

MAX2903ETI+ by Analog Devices

MAX2903ETI+ by Analog Devices is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, operates at 4.5V, and has a compact size of 5x5mm for telecom applications.

Median Price

$9.692

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MAX2903ETI+ by Analog Devices
Compare Share

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,190 parts In-Stock

1+ parts

$9.443

100+ parts

-

1k+ parts

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10k+ parts

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2,190

$9.443

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Vyrian

USA . 1,456 parts In-Stock

1+ parts

$9.940

100+ parts

-

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-

10k+ parts

-

1,456

$9.940

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Anansix

USA . 146 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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146

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ACDS - Activité Composants Distribution Service

France . 130 parts In-Stock

1+ parts

-

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1k+ parts

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130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 24 parts In-Stock

1+ parts

$8.260

100+ parts

$8.054

1k+ parts

$8.012

10k+ parts

-

24

$8.260

$8.054

$8.012

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Component Stockers USA

USA . 1,794 parts In-Stock

1+ parts

$8.420

100+ parts

$6.360

1k+ parts

$4.190

10k+ parts

-

1,794

$8.420

$6.360

$4.190

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Corphita

USA . 1,747 parts In-Stock

1+ parts

$8.946

100+ parts

-

1k+ parts

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1,747

$8.946

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MARBEL Systems

Belgium . 1,000 parts In-Stock

1+ parts

$15.473

100+ parts

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1k+ parts

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1,000

$15.473

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Texas Native Microelectronics

USA . 18 parts In-Stock

1+ parts

$17.785

100+ parts

-

1k+ parts

$16.540

10k+ parts

$15.651

18

$17.785

-

$16.540

$15.651

Kenton Components

USA . 50 parts In-Stock

1+ parts

$21.342

100+ parts

-

1k+ parts

-

10k+ parts

$18.781

50

$21.342

-

-

$18.781

Qasali Group International

UK . 3,081 parts In-Stock

1+ parts

$48.020

100+ parts

-

1k+ parts

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3,081

$48.020

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Perfect Parts

USA . 451 parts In-Stock

1+ parts

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451

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Cyclops Electronics Ltd (Excess)

UK . 130 parts In-Stock

1+ parts

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130

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Glotronic Ltd.

UK . 104 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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104

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Overview

Unlock the potential of your cellphone with the MAX2903ETI+ by Analog Devices. With a reputation for excellence in manufacturing and a focus on innovation, Analog Devices delivers cutting-edge Cellphone ICs that redefine connectivity. Perfect for a wide range of applications, this surface mount component offers unparalleled performance and reliability. Experience the seamless integration, enhanced efficiency, and superior functionality that the MAX2903ETI+ brings to your device. Elevate your mobile experience today with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on printed circuit boards, making this product suitable for mass production.

Package Shape: SQUARE

The square package shape helps in maximizing space utilization on the PCB, making it ideal for compact design requirements.

No. of Terminals: 28

With 28 terminals, this IC provides sufficient connectivity options for various functions and features, enhancing its versatility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal efficiency, compact size, and improved performance, making it a high-quality choice.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can operate reliably under harsh environmental conditions, ensuring longevity and durability.

Nominal Supply Voltage: 4.5 V

The nominal supply voltage of 4.5 V is ideal for ensuring stable and efficient power consumption in various operating conditions.

Technical Specifications

Cellphone ICs MAX2903ETI+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2903ETI+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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