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AD6655BCPZ-105

Analog Devices

AD6655BCPZ-105 by Analog Devices

AD6655BCPZ-105 by Analog Devices is a Cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, has a nominal voltage of 1.8V, and terminal pitch of 0.5mm. Ideal for baseband circuit applications due to its industrial temperature grade and compact size.

Median Price

$114.550

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 768 parts In-Stock

1+ parts

-

100+ parts

$106.140

1k+ parts

$94.970

10k+ parts

$89.380

768

-

$106.140

$94.970

$89.380

DigiKey

USA . 768 parts In-Stock

1+ parts

-

100+ parts

$122.960

1k+ parts

$122.960

10k+ parts

$122.960

768

-

$122.960

$122.960

$122.960

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 71 parts In-Stock

1+ parts

$112.318

100+ parts

-

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-

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71

$112.318

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-

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Vyrian

USA . 762 parts In-Stock

1+ parts

$118.230

100+ parts

-

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-

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762

$118.230

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 4,607 parts In-Stock

1+ parts

$14.870

100+ parts

-

1k+ parts

$13.829

10k+ parts

-

4,607

$14.870

-

$13.829

-

IDEA Electronic Components Group

UK . 833 parts In-Stock

1+ parts

$15.989

100+ parts

$15.190

1k+ parts

$15.190

10k+ parts

-

833

$15.989

$15.190

$15.190

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DigiPath Technology Company

USA . 4,607 parts In-Stock

1+ parts

$24.943

100+ parts

$23.945

1k+ parts

-

10k+ parts

$23.945

4,607

$24.943

$23.945

-

$23.945

Native Components

USA . 539 parts In-Stock

1+ parts

$33.060

100+ parts

-

1k+ parts

-

10k+ parts

$31.738

539

$33.060

-

-

$31.738

Northwest PG Solutions

USA . 1,787 parts In-Stock

1+ parts

$36.366

100+ parts

-

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1,787

$36.366

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-

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Semicontronic

India . 586 parts In-Stock

1+ parts

$100.500

100+ parts

$97.988

1k+ parts

$97.485

10k+ parts

-

586

$100.500

$97.988

$97.485

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Ampacity Inc.

Singapore . 468 parts In-Stock

1+ parts

$100.500

100+ parts

-

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468

$100.500

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Corphita

USA . 382 parts In-Stock

1+ parts

$106.407

100+ parts

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382

$106.407

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QUARKTWIN TECHNOLOGY LTD

USA . 27,369 parts In-Stock

1+ parts

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100+ parts

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27,369

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RC Electronics

USA . 3,260 parts In-Stock

1+ parts

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100+ parts

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3,260

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Kepictronics

USA . 810 parts In-Stock

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810

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Overview

Enhance the performance of your cellphone with the AD6655BCPZ-105 by Analog Devices. Known for their superior quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that elevate user experience. With surface mount capability and a compact square package shape, this IC is versatile and easy to integrate. Whether it's optimizing baseband circuits or enhancing telecom functionality, this Industrial-grade IC offers unmatched value, efficiency, and precision. Upgrade your device today and enjoy seamless connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto the circuit board, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape provides efficient use of space on the circuit board, allowing for compact and sleek designs.

No. of Terminals: 64

Having 64 terminals allows for a high level of connectivity and functionality in the cell phone IC, enabling advanced features and capabilities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers good thermal management with the heat sink/slug, while the very thin profile helps in maintaining a slim and lightweight design for the cellphone IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the cellphone IC can withstand various environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the cellphone IC remains functional even in extremely cold temperatures.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability of the cellphone IC.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and conductivity for the cellphone IC, improving overall performance.

Maximum Seated Height: 1 mm

With a low seated height, the cellphone IC can be integrated into slim and compact devices without compromising on performance or functionality.

Width: 9 mm

The compact width of the cellphone IC helps in saving space on the circuit board and allows for a more streamlined design.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering during assembly, improving the reliability and durability of the cellphone IC.

Length: 9 mm

The compact length of the cellphone IC contributes to a smaller overall footprint, making it ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the cellphone IC can operate reliably in harsh industrial environments, making it suitable for a wide range of applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, making the cellphone IC a sustainable choice.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit type, the cellphone IC is optimized for handling communication processing tasks efficiently, ensuring smooth and reliable performance.

Nominal Supply Voltage: 1.8 V

With a nominal supply voltage of 1.8V, the cellphone IC helps in achieving power efficiency and extends battery life in the mobile device.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packaging and increased connectivity in the cellphone IC, enabling advanced functionalities.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the cellphone IC can withstand moderate exposure to moisture during storage and handling, ensuring reliability and performance.

Technical Specifications

Cellphone ICs AD6655BCPZ-105 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

AD6655BCPZ-105 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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