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MAX2609EUT+

Analog Devices

MAX2609EUT+ by Analog Devices

MAX2609EUT+ by Analog Devices is a Cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Telecom IC type: Baseband Circuit, with nominal voltage of 2.75V for cellphone applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MAX2609EUT+ by Analog Devices
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Analog Devices Inc

USA . 2,961 parts In-Stock

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Vyrian

USA . 2,891 parts In-Stock

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Anansix

USA . 819 parts In-Stock

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Digiode

USA . 816 parts In-Stock

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816

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Cyclops Electronics Ltd

UK . 500 parts In-Stock

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500

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MARBEL Systems

Belgium . 4,448 parts In-Stock

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$11.848

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$11.848

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Texas Native Microelectronics

USA . 15,767 parts In-Stock

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$13.618

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$13.073

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$12.665

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$11.984

15,767

$13.618

$13.073

$12.665

$11.984

AZTECH Wire

Italy . 198 parts In-Stock

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$15.373

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Kenton Components

USA . 1,672 parts In-Stock

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$16.342

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$14.381

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$14.381

Qasali Group International

UK . 50 parts In-Stock

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$36.769

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$34.195

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$32.356

50

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One Stop Electronics

USA . 2,354 parts In-Stock

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$515.000

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Semicontronic

India . 679 parts In-Stock

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$648.000

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$631.800

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$628.560

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679

$648.000

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A-Z Elektronik GmbH

Germany . 6,642 parts In-Stock

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Corphita

USA . 1,148 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Unlock the full potential of your cellphone with the Analog Devices MAX2609EUT+. Crafted by a renowned manufacturer, this cutting-edge Cellphone IC offers unparalleled quality and reliability. Whether you're looking to enhance signal reception, improve call clarity, or boost data speeds, this product delivers exceptional performance. With its compact design and wide operating temperature range, the MAX2609EUT+ is perfect for a variety of telecom applications. Upgrade your device today and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for mobile devices to prevent damage from drops or impacts.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of space on the circuit board, maximizing functionality in compact electronic devices.

No. of Terminals: 6

Having 6 terminals provides ample connectivity options for the cellphone IC, allowing for various functions and features to be integrated.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even under demanding conditions, making the IC suitable for a wide range of applications.

Nominal Supply Voltage: 2.75 V

Stable supply voltage of 2.75 V ensures consistent and efficient power delivery to the IC, contributing to overall performance and reliability.

Technical Specifications

Cellphone ICs MAX2609EUT+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

MAX2609EUT+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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