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HMC689LP4

Analog Devices

HMC689LP4 by Analog Devices

Analog Devices' HMC689LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Features include tin/lead terminal finish, 5V supply voltage, and compact 4x4mm dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,911 parts In-Stock

1+ parts

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6,911

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Digiode

USA . 846 parts In-Stock

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846

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,654 parts In-Stock

1+ parts

$12.847

100+ parts

-

1k+ parts

$11.948

10k+ parts

-

1,654

$12.847

-

$11.948

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IDEA Electronic Components Group

UK . 2,324 parts In-Stock

1+ parts

$13.814

100+ parts

$13.123

1k+ parts

$13.123

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2,324

$13.814

$13.123

$13.123

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AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$15.212

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745

$15.212

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DigiPath Technology Company

USA . 457 parts In-Stock

1+ parts

$21.550

100+ parts

$20.688

1k+ parts

-

10k+ parts

$20.688

457

$21.550

$20.688

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$20.688

One Stop Electronics

USA . 317 parts In-Stock

1+ parts

$103.000

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317

$103.000

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Semicontronic

India . 631 parts In-Stock

1+ parts

$241.000

100+ parts

$234.975

1k+ parts

$233.770

10k+ parts

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631

$241.000

$234.975

$233.770

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Corphita

USA . 202 parts In-Stock

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202

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Overview

Enhance your cellphone's performance with the HMC689LP4 by Analog Devices. Crafted with precision and expertise, this innovative Cellphone IC offers exceptional quality and reliability. With a package style that includes a chip carrier and heat sink/slug, this product ensures optimal functionality in various applications. Experience the benefits of seamless communication and enhanced signal processing with this top-of-the-line Telecom IC. Upgrade your device today and enjoy the unmatched value and advantages that only Analog Devices can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making this product suitable for mobile devices which need to be portable and robust.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the circuit board, making this product efficient in terms of design and assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand heat better than standard ICs, ensuring reliability in various environments.

Technology: BICMOS

Being built on BICMOS technology, this product combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Nominal Supply Voltage: 5 V

Operates at a standard 5V supply voltage, making it compatible with many existing systems and reducing the need for additional components.

Technical Specifications

Cellphone ICs HMC689LP4 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC689LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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