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MAX2150ETI+T

Analog Devices

MAX2150ETI+T by Analog Devices

Analog Devices' MAX2150ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. It operates at -40 to 85 °C, with power supplies of 3/3.3V and max supply current of 0.107mA. Ideal for RF and baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MAX2150ETI+T by Analog Devices
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Anansix

USA . 2,200 parts In-Stock

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2,200

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Vyrian

USA . 2,175 parts In-Stock

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2,175

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Goldney Electronics S.L.

Spain . 2,166 parts In-Stock

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Digiode

USA . 678 parts In-Stock

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678

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Distributors (Availability)

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MARBEL Systems

Belgium . 1,000 parts In-Stock

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$8.322

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$8.322

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Texas Native Microelectronics

USA . 25 parts In-Stock

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$9.566

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$9.183

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$8.896

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$8.418

25

$9.566

$9.183

$8.896

$8.418

Kenton Components

USA . 41 parts In-Stock

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$11.479

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$10.102

41

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$10.102

AZTECH Wire

Italy . 487 parts In-Stock

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$15.973

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Qasali Group International

UK . 460 parts In-Stock

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$25.828

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$24.020

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$22.729

460

$25.828

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$24.020

$22.729

One Stop Electronics

USA . 1,854 parts In-Stock

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$313.000

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$313.000

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Semicontronic

India . 402 parts In-Stock

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$670.000

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$653.250

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$649.900

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402

$670.000

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$649.900

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Perfect Parts

USA . 14,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,095 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,209 parts In-Stock

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Corphita

USA . 1,687 parts In-Stock

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1,687

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Overview

Enhance the performance of your cellphone with the MAX2150ETI+T by Analog Devices. Known for their top-quality manufacturing, Analog Devices delivers reliable and innovative solutions in the field of cellphone ICs. This versatile chip carrier is designed to meet industrial standards, offering a very thin profile and high thermal conductivity. With a nominal supply voltage of 3V and a low supply current, this RF and baseband circuit ensures optimal efficiency and power management. Upgrade your device today with the MAX2150ETI+T and experience superior connectivity and performance like never before.

Feature Benefit Bullets

Surface Mount: YES

This makes the product easy to install and saves space on the PCB, making it suitable for compact devices.

Power Supplies (V): 3/3.3

The dual power supply option provides flexibility in system design and compatibility with different voltage requirements.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile allows for efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in a variety of environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and the annealed quality ensures long-term durability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the product suitable for rugged applications and harsh environments.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuitry in a single IC enhances communication performance and reduces component count.

Technical Specifications

Cellphone ICs MAX2150ETI+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.107 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2150ETI+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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