Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CC1000YZR by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
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Plastic material offers durability and is lightweight, making it ideal for portable electronic devices like cellphones.
Surface mount technology enables easy installation onto circuit boards, saving space and allowing for automated assembly processes.
Rectangular shape provides a compact design that fits well within the constraints of cellphone circuit layouts.
Compatible with common voltage requirements in cellphone applications, offering flexibility in power management.
Sufficient number of terminals for connecting various components within the cellphone IC, facilitating seamless operation.
Grid array package style with thin profile and fine pitch enhances signal integrity and reduces overall footprint for compact cellphone designs.
High maximum operating temperature ensures reliable performance even under demanding conditions.
Low minimum operating temperature allows the IC to function effectively in a wide range of environmental settings.
Bottom terminal position eases routing of connections and enhances thermal management within the cellphone IC.
Low seated height enables slim profile designs for cellphones without sacrificing performance or functionality.
Narrow width enhances space efficiency and compatibility with standard circuit board layouts in cellphone applications.
Moderate length provides a balanced form factor for cellphone ICs, accommodating necessary components and connections.
Industrial temperature grade ensures stable operation across varying temperature conditions encountered in real-world use cases.
CMOS technology offers low power consumption and high speed operation, making it well-suited for energy-efficient cellphone designs.
Ball terminal form provides reliable connections and facilitates soldering processes during cellphone IC assembly.
Combination of RF and baseband circuitry supports wireless communication capabilities in cellphones, ensuring seamless connectivity.
Standard nominal supply voltage of 3V is compatible with various cellphone components, simplifying power management.
Fine terminal pitch allows for high-density integration, enabling complex circuitry within the limited space of cellphones.
Cellphone ICs CC1000YZR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
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Sub-Category:
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Telecom IC Type:
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CC1000YZR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
L7805CV
STMicroelectronics
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Rugao Dachang Electronic
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
LM317LMX/NOPB
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
Nexperia
HMC786LP4ETR
Hittite Microwave
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
TCM320AC57CPT
Texas Instruments
TCM320AC57CPT by Texas Instruments is a 48-terminal cellphone IC with 5V power supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a square flatpack with low profile and fine pitch, suitable for surface mount assembly.
SARA-R410M-02B-04
U-blox Ag
SARA-R410M-02B-04 by U-blox Ag is a Cellphone IC with 96 terminals, RF and baseband circuit for telecom applications. It operates b/w -20 to 65°C, has a supply voltage of 3.8V, and measures 16mm in width and 26mm in length. Suitable for surface mount with a rectangular package style.
TCM320AC56IPT
TCM320AC56IPT by Texas Instruments is a Cellphone IC with 48 terminals, operating at temperatures from -40 to 85°C. It features a 13-bit linear codec, companding law MU-LAW, and telecom IC type BASEBAND CIRCUIT. This low-profile flatpack package has a terminal pitch of 0.5mm and is ideal for industrial applications requiring fine-pitch technology.
CC1020-RTB1
CC1020-RTB1 by Texas Instruments is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit technology has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.
GC5016-PB
GC5016-PB by Texas Instruments is a Cellphone IC with 252 terminals in a square GRID ARRAY package. It operates b/w -40 to 85°C, with power supplies of 1.8V and 3.3V for RF and baseband circuits. The PLASTIC/EPOXY body material and TIN LEAD terminal finish make it suitable for industrial telecom applications.
MAX4003EUA+T
Maxim Integrated
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
CC1100RTKR
CC1100RTKR by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. With RF and baseband circuit technology, it has a supply voltage of 3V and terminal pitch of 0.5mm, making it ideal for telecommunications applications.
SI4721-B20-GMR
Silicon Labs
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
MAX19995ETX+
Analog Devices
MAX19995ETX+ by Analog Devices is a 36-terminal cellphone IC with BICMOS technology. It operates b/w -40 to 85 °C, has a package style of chip carrier, and matte tin terminal finish. Ideal for RF front end circuits in telecom applications due to its compact square shape and industrial temperature grade.
LMV228URX
LMV228URX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.
TC5584IUF#TRPBF
Analog Devices' TC5584IUF#TRPBF is a cellphone IC with 24 terminals in a square chip carrier package. It features RF and baseband circuit for telecom applications, operates at 5V supply voltage, and has a terminal pitch of 0.5mm. Ideal for compact mobile devices due to its very thin profile and surface mount capability.
ADF7020BCPZ
Analog Devices' ADF7020BCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a terminal pitch of 0.5mm. Ideal for telecom applications requiring industrial temperature grade performance in a compact square package.
LMV228TLX
LMV228TLX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.
CC1131QRHBRG4Q1
CC1131QRHBRG4Q1 by Texas Instruments is a Cellphone IC with 32 terminals, operating at -40 to 125 °C. It features a supply voltage of 3V, data rate of 0.25 Mbps, and is suitable for RF and baseband circuits in automotive applications.
TLV320AC56IDWR
TLV320AC56IDWR by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, 3V supply voltage, and Gull Wing terminal form. Ideal for baseband circuit applications in the telecom industry due to its small outline package style.
CC1070-RTR1
CC1070-RTR1 by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC2591RGVT
The Texas Instruments CC2591RGVT is a cellphone IC with 16 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and max current of 4mA. This RF front end circuit has a terminal pitch of 0.65mm and is suitable for industrial applications requiring very thin profile components.
TRF4000PWP
TRF4000PWP by Texas Instruments is a cellphone IC with 14 terminals, operating temperature range of -30 to 80°C. It features RF and baseband circuits, suitable for telecom applications. The package is small outline, heat sink/slug, with gull wing terminals and 0.65mm pitch.
SARA-G350-02S-00
SARA-G350-02S-00 by U-blox Ag is a Cellphone IC with 96 terminals, RF & baseband circuit type, and 3.8V supply voltage. It operates b/w -30°C to 85°C, measures 26mm x 16mm x 2.65mm, and can withstand peak reflow at 245°C for up to 60s. Ideal for compact mobile devices requiring reliable cellular connectivity.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC1000PW
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
CC1000PWR
CC1000PWRG3
CC1000PWRG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with gull wing terminals suitable for industrial applications.
CC1020RSSR
The Texas Instruments CC1020RSSR is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature range of -40 to 85°C, CMOS technology, and RF & baseband circuit type make it ideal for industrial telecom applications. With a nominal voltage of 3V and data rate of 0.1536 Mbps, it offers high performance in a compact form factor.
CC1000-RWP2
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR;
CC1020RSST
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CC1020-RTR1
CC1000/T&R
CC1020RUZ
CC1000_UCSP/T&R
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 28; Package Code: BGA; Package Shape: RECTANGULAR;
CC1000YZ
CC1000-RTB1
CC1000-RTR2
CC1020RSS
CC1000
CC1000PWG3
CC1000-RTR1
CC1020RSSG4
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