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CC1070RSQ

Texas Instruments

CC1070RSQ by Texas Instruments

The Texas Instruments CC1070RSQ is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.

Median Price

$7.052

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 90 parts In-Stock

1+ parts

$8.103

100+ parts

$5.915

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90

$8.103

$5.915

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 3,857 parts In-Stock

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3,857

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Digiode

USA . 907 parts In-Stock

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907

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TME

Poland . 490 parts In-Stock

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$6.000

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490

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$6.000

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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90

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Dan-Mar Components

USA . 90 parts In-Stock

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 753 parts In-Stock

1+ parts

$0.907

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753

$0.907

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Northwest PG Solutions

USA . 1,192 parts In-Stock

1+ parts

$0.998

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1,192

$0.998

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AZTECH Wire

Italy . 627 parts In-Stock

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$7.572

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627

$7.572

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Parana Technologies

USA . 966 parts In-Stock

1+ parts

$12.705

100+ parts

$1,179.829

1k+ parts

$11.434

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966

$12.705

$1,179.829

$11.434

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DigiPath Technology Company

USA . 575 parts In-Stock

1+ parts

$13.990

100+ parts

$12.870

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575

$13.990

$12.870

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ChromeModa Solutions

Germany . 3,158 parts In-Stock

1+ parts

$14.275

100+ parts

$11.706

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3,158

$14.275

$11.706

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IDEA Electronic Components Group

UK . 337 parts In-Stock

1+ parts

$14.275

100+ parts

$13.561

1k+ parts

$12.848

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337

$14.275

$13.561

$12.848

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One Stop Electronics

USA . 812 parts In-Stock

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$613.000

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812

$613.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 938 parts In-Stock

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938

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Perfect Parts

USA . 438 parts In-Stock

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438

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Overview

Unlock the potential of your cellphone with the Texas Instruments CC1070RSQ, a high-quality RF and baseband circuit designed to enhance your mobile experience. Manufactured by industry leader Texas Instruments, this cellphone IC boasts reliability and performance like no other. Whether you're looking to improve signal reception, optimize power efficiency, or enhance data transmission, the CC1070RSQ is the perfect solution. With its compact square package shape and advanced CMOS technology, this IC offers exceptional value and benefits to customers seeking superior connectivity in their devices. Experience the difference with the CC1070RSQ and take your cellphone capabilities to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount technology allows for easy and efficient assembly, making this product suitable for high volume production.

Package Shape: SQUARE

Square package shape provides efficient use of space and allows for easy placement on circuit boards.

Power Supplies (V): 2.5/3.3

Support for multiple power supply options allows for flexibility in design and compatibility with various systems.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for different functions within the cellphone IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles available offer options for thermal management and space-saving in cellphone designs.

Maximum Operating Temperature: 105 °C

High maximum operating temperature enables reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in a wide range of temperature conditions.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections and signal paths within the IC.

Maximum Seated Height: 1 mm

Low seated height makes this product suitable for compact and slim cellphone designs.

Width: 5 mm

Compact width allows for space-efficient placement on circuit boards.

Length: 5 mm

Compact length enables efficient use of space on the PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance for efficient operation.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and also offers better electrical performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and Baseband circuit types provides versatile functionality for cellphone communications.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is commonly used in cellphone systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for high density connections and efficient use of space on the IC.

Technical Specifications

Cellphone ICs CC1070RSQ attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Length:

5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

CC1070RSQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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