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ADRF5549BCPZN-RL

Analog Devices

ADRF5549BCPZN-RL by Analog Devices

Analog Devices' ADRF5549BCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

$16.611

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 15,000 parts In-Stock

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$16.611

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$16.611

Distributors (In-Stock)

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Digiode

USA . 806 parts In-Stock

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$19.864

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806

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Vyrian

USA . 6,245 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,120 parts In-Stock

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$13.340

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Semicontronic

India . 28,436 parts In-Stock

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$16.310

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$15.902

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$15.821

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Parana Technologies

USA . 1,098 parts In-Stock

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$16.397

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$15.249

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IDEA Electronic Components Group

UK . 1,975 parts In-Stock

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$17.631

100+ parts

$16.749

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$16.749

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$16.749

$16.749

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Corphita

USA . 842 parts In-Stock

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$18.819

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DigiPath Technology Company

USA . 657 parts In-Stock

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$27.504

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$26.404

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$26.404

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$26.404

Native Components

USA . 50 parts In-Stock

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$47.074

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$45.191

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Northwest PG Solutions

USA . 492 parts In-Stock

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$51.781

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Component Stockers USA

USA . 23,269 parts In-Stock

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Overview

Elevate your cellphone IC performance with the ADRF5549BCPZN-RL from Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge solutions for telecommunications. This surface mount chip carrier offers a maximum operating temperature of 105 °C, making it ideal for industrial applications. With a nominal supply voltage of 5V and very thin profile, this RF and baseband circuit is a game-changer in the industry. Experience superior performance and efficiency with the ADRF5549BCPZN-RL, designed to take your cellphone technology to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto circuit boards, making this IC suitable for high volume production and compact designs.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, making it ideal for designs where space is limited.

No. of Terminals: 40

With a high number of terminals, this IC can handle complex functions and connectivity requirements, making it versatile for various cellphone applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and compact packaging, ideal for space-constrained cellphone designs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows this IC to withstand demanding operating conditions, ensuring reliable performance in mobile phone applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures this IC can function in a wide range of environmental conditions, making it suitable for mobile devices used in various climates.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection to the circuit board, simplifying the assembly process and ensuring reliable electrical connections.

Maximum Seated Height: 1 mm

The low seated height allows for a slim and compact design, making this IC ideal for thin mobile devices where space is limited.

Width: 6 mm

The compact width dimension enables efficient use of space on the PCB, contributing to a more streamlined and space-saving cellphone design.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the IC can withstand the soldering process during assembly, contributing to its reliability and durability.

Length: 6 mm

The compact length dimension contributes to a space-saving design, particularly beneficial for mobile devices that require compact and slim form factors.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures this IC can operate reliably in a wide range of temperature environments, making it suitable for industrial and commercial cellphone applications.

Terminal Form: NO LEAD

The no-lead terminal form offers improved electrical performance and reliability, making this IC a dependable choice for critical functionalities in mobile devices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit functionalities in a single IC offers a compact and integrated solution for cellphone communications, streamlining design and enhancing performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is common in cellphone applications, making this IC compatible with existing power systems in mobile devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density packaging on the PCB, enabling more features and functionality to be integrated within a limited space.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this IC has a moderate level of moisture sensitivity, suitable for cellphone applications where exposure to varying humidity levels may occur.

Technical Specifications

Cellphone ICs ADRF5549BCPZN-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

ADRF5549BCPZN-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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