Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Analog Devices' ADRF5549BCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
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Surface mount technology enables easy and efficient assembly onto circuit boards, making this IC suitable for high volume production and compact designs.
The square shape allows for efficient use of space on the circuit board, making it ideal for designs where space is limited.
With a high number of terminals, this IC can handle complex functions and connectivity requirements, making it versatile for various cellphone applications.
The combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and compact packaging, ideal for space-constrained cellphone designs.
The high maximum operating temperature allows this IC to withstand demanding operating conditions, ensuring reliable performance in mobile phone applications.
The low minimum operating temperature ensures this IC can function in a wide range of environmental conditions, making it suitable for mobile devices used in various climates.
The quad terminal position facilitates easy soldering and connection to the circuit board, simplifying the assembly process and ensuring reliable electrical connections.
The low seated height allows for a slim and compact design, making this IC ideal for thin mobile devices where space is limited.
The compact width dimension enables efficient use of space on the PCB, contributing to a more streamlined and space-saving cellphone design.
The high peak reflow temperature ensures the IC can withstand the soldering process during assembly, contributing to its reliability and durability.
The compact length dimension contributes to a space-saving design, particularly beneficial for mobile devices that require compact and slim form factors.
The industrial temperature grade ensures this IC can operate reliably in a wide range of temperature environments, making it suitable for industrial and commercial cellphone applications.
The no-lead terminal form offers improved electrical performance and reliability, making this IC a dependable choice for critical functionalities in mobile devices.
Combining RF and baseband circuit functionalities in a single IC offers a compact and integrated solution for cellphone communications, streamlining design and enhancing performance.
The nominal supply voltage of 5V is common in cellphone applications, making this IC compatible with existing power systems in mobile devices.
The small terminal pitch of 0.5mm allows for high-density packaging on the PCB, enabling more features and functionality to be integrated within a limited space.
The MSL 3 rating indicates that this IC has a moderate level of moisture sensitivity, suitable for cellphone applications where exposure to varying humidity levels may occur.
Cellphone ICs ADRF5549BCPZN-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
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Package Body Material:
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ADRF5549BCPZN-RL Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.
CEO
Vincent Roche
Interim CFO
James Mollica
CAO
Michael Sondel
Limerick Fab
Fabrication
Fab Initiation
1977
Ireland
Limerick
Wafer Capacity
30,000
Hillview Fab
2001
USA
Milpitas
15,000
Wilmington Fab
1967
Wilmington
50,000
Camas Fab
1997
Camas
18,000
Beaverton-Portland
1987
Beaverton
14,000
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADW
Texas Instruments
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
INA826AIDGKR
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WT
Bytesonic Electronics
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Diodes Incorporated
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
Diotec Semiconductor Ag
1N4148WSF-7
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
LM358AN
M24308/2-1F
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
AD6673BCPZRL7-250
AD6673BCPZRL7-250 by Analog Devices is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and consumes 0.282mA current. This CMOS technology baseband circuit comes in a square chip carrier package suitable for industrial applications.
LMV225TLX/NOPB
LMV225TLX/NOPB by Texas Instruments is a cellphone IC with 4 terminals, operating b/w -40 to 85°C. It features a very thin profile grid array package style and requires 2.7V nominal voltage. Ideal for RF and baseband circuits in telecom applications due to its low max supply current of 8mA.
BGS14MPA9E6327XTSA1
Infineon Technologies
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 1;
TLV320AC57IPT
TLV320AC57IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage, operating from -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a low-profile flatpack with gull wing terminals, suitable for industrial temperature grades.
CC1050PWR
CC1050PWR by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures from -40 to 85°C, with supply voltages of 2.5/3.3V for RF and baseband circuits. The terminal finish is nickel palladium gold, making it suitable for industrial telecom applications.
HMC900LP5E
Analog Devices' HMC900LP5E is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Features include matte tin finish, no-lead terminal form, and nominal voltage of 5V.
SARA-R422-01B
U-blox Ag
RF AND BASEBAND CIRCUIT;
RFFM6903TR13
Qorvo
RFFM6903TR13 by Qorvo is a cellphone IC with 28 terminals in a square grid array package. It operates b/w -40°C to 85°C, with peak reflow temperature of 260°C for 30s. This RF and baseband circuit has a nominal voltage of 3.6V, making it ideal for industrial telecom applications.
CC1021RUZR
The Texas Instruments CC1021RUZR is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a 3V supply voltage for telecom applications.
AT86RF233-ZUR
Atmel
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CC1000
The Texas Instruments CC1000 is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch and gull wing terminals for surface mount assembly.
RYZ024A000FZ00#HD0
Renesas Electronics
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
ADL5387ACPZ-R2
ADL5387ACPZ-R2 by Analog Devices is a 24-terminal cellphone IC with 5V power supply, operating from -40 to 85°C. It features a square surface mount package style and matte tin terminal finish. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.
MAX4003EBL
Maxim Integrated
MAX4003EBL by Maxim Integrated is a CELLPHONE IC with 8 terminals in a SQUARE package. It features GRID ARRAY style, operates b/w -40 to 85°C, and has RF & BASEBAND CIRCUIT applications. The IC has a very thin profile of 0.67mm, uses TIN LEAD finish, and requires 3V supply voltage for operation.
ADF4360-6BCPZRL
Analog Devices' ADF4360-6BCPZRL is a Cellphone IC with 24 terminals, operating at -40 to 85 °C. It features a 3.3V supply, BICMOS technology, and matte tin finish. This square chip carrier is ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade.
TCM320AC56DWR
TCM320AC56DWR by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features Gull Wing terminal form, 5V supply voltage, and is used in Baseband Circuit for telecom applications.
ADL5387ACPZ-R7
ADL5387ACPZ-R7 by Analog Devices is a 24-terminal cellphone IC with 5V power supply, operating from -40 to 85°C. It features a square surface mount package style and is ideal for baseband circuit applications in the telecom industry.
ME310G1WW01T010100
Telit Communications Plc
Telit ME310G1WW01T010100 is a 94-terminal RF & baseband circuit IC with 3.8V supply voltage, ideal for cellphone applications. With a compact size of 15x18mm and seated height of 2.6mm, it operates b/w -40°C to 85°C temperature range efficiently. The no-lead terminal form in MICROELECTRONIC ASSEMBLY package makes it suitable for modern mobile devices.
TLV321AC36CN
TLV321AC36CN by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It has a rectangular package style, suitable for baseband circuits in commercial temperature grades. Dimensions are 7.62mm width, 24.325mm length, and 5.08mm seated height for through-hole mounting at temperatures ranging from 0 to 70°C.
TLV320AC57DW
TLV320AC57DW by Texas Instruments is a cellphone IC with 20 terminals, operating b/w -40 to 85°C. It has a small outline package style and gull wing terminal form, suitable for baseband circuits in telecom applications. The package dimensions are 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact designs.
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ADPA7005CHIP
ADPA7005CHIP by Analog Devices is a wide band medium power RF amplifier with 11.5 dB gain, operating from 20-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -55 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
ADN4693E-1BCPZ
ADN4693E-1BCPZ by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V nominal voltage. It features a max transmit delay of 2.4ns and differential output for EIA/TIA-899 interface standard applications in industrial settings.
ADMV8420ACPZ-R5
ADMV8420ACPZ-R5 by Analog Devices is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50 OHM. It operates b/w -40 to 85 °C and is ideal for applications requiring precise frequency filtering in electronic circuits.
ADPA7005AEHZ-R7
ADPA7005AEHZ-R7 by Analog Devices is a wide band medium power RF amplifier with 12 dB gain, operating from 18-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -40 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
ADMV8420ACPZ
Analog Devices' ADMV8420ACPZ is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50Ω. Operating b/w -40°C to 85°C, it's ideal for applications requiring precise filtering in electronic systems.
ADPA7005AEHZ
ADPA7005AEHZ by Analog Devices is a wide band medium power RF amplifier with 12 dB gain. It operates b/w 18-44 GHz, handling up to 27 dBm CW input power. Ideal for applications requiring high frequency amplification in temperatures ranging from -40 to 85°C.
AD3542RBCPZ16-RL7
AD3542RBCPZ16-RL7 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V, 0.006103% linearity error, and 0.1us settling time. Ideal for applications requiring precise analog signal generation in temperature-sensitive environments.
ADN4693E-1BCPZ-RL7
ADN4693E-1BCPZ-RL7 by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V. It offers a max transmit delay of 2.4ns and max supply current of 24mA. Ideal for applications requiring differential output and EIA/TIA interface standards compliance in tight spaces due to its very thin profile chip carrier package style.
ADAQ23876BBCZ
Analog Devices' ADAQ23876BBCZ is a 16-bit ADC with 0.00125% EL, 15 MHz sample rate, and 2'S COMPLEMENT BINARY output. Ideal for wireless data acquisition applications due to its compact GRID ARRAY package and fast 0.063 us conversion time. Operating from -40 to 85 °C, it offers precise analog-to-digital conversion in a small form factor.
AD3542RBCPZ16
AD3542RBCPZ16 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V and linearity error of 0.006103%. It features a nominal settling time of 0.1us, making it ideal for applications requiring precise analog signal generation in temperature-sensitive environments. With a compact square package shape and surface mount capability, this chip carrier is suitable for space-constrained designs where high performance is essential.
ADRF5515ABCPZN
RF FRONT END CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
ADRF5515ABCPZN-R7
RF FRONT END CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
ADRF6620ACPZ-R7
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
ADRF5515BCPZN-R7
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
ADRF5547BCPZN-R7
RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
ADRF6602ACPZ-R7
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
ADRF5545ABCPZN-RL
ADRF6650ACPZ
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
ADRF5515BCPZN-RL
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
ADRF5547BCPZN-RL
ADRF5549BCPZN
ADRF6601ACPZ-R7
ADRF5545ABCPZN-R7
ADRF6603ACPZ-R7
ADRF5515BCPZN
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
ADRF5547BCPZN
ADRF5549BCPZN-R7
ADRF5515ABCPZN-RL
RF FRONT END CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
ADRF5545ABCPZN
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