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ADF7025BCPZ

Analog Devices

ADF7025BCPZ by Analog Devices

Analog Devices' ADF7025BCPZ is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. Ideal for baseband circuits, it has a very thin profile and matte tin finish for industrial telecom applications.

Median Price

$4.140

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

$3.860

100+ parts

-

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120

$3.860

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Analog Devices Inc

USA . 2,860 parts In-Stock

1+ parts

$5.010

100+ parts

-

1k+ parts

$3.320

10k+ parts

-

2,860

$5.010

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$3.320

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Mouser Electronics

USA . 39 parts In-Stock

1+ parts

$9.810

100+ parts

$6.090

1k+ parts

$5.220

10k+ parts

$4.940

39

$9.810

$6.090

$5.220

$4.940

Rochester

USA . 9,931 parts In-Stock

1+ parts

-

100+ parts

$4.140

1k+ parts

$3.710

10k+ parts

$3.490

9,931

-

$4.140

$3.710

$3.490

Verical

USA . 2,860 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.106

10k+ parts

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2,860

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$4.106

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Distributors (In-Stock)

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Digiode

USA . 93 parts In-Stock

1+ parts

$3.667

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93

$3.667

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Vyrian

USA . 5,185 parts In-Stock

1+ parts

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5,185

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Bristol Electronics

USA . 761 parts In-Stock

1+ parts

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761

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Inventory MP

USA . 142 parts In-Stock

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142

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Quantum Digital Technology

USA . 49 parts In-Stock

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49

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Dan-Mar Components

USA . 42 parts In-Stock

1+ parts

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42

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 10,004 parts In-Stock

1+ parts

$2.160

100+ parts

$1.840

1k+ parts

$3.410

10k+ parts

-

10,004

$2.160

$1.840

$3.410

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Semicontronic

India . 3,095 parts In-Stock

1+ parts

$3.280

100+ parts

$3.198

1k+ parts

$3.182

10k+ parts

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3,095

$3.280

$3.198

$3.182

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Corphita

USA . 130 parts In-Stock

1+ parts

$3.474

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130

$3.474

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Parana Technologies

USA . 2,282 parts In-Stock

1+ parts

$7.593

100+ parts

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1k+ parts

$7.061

10k+ parts

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2,282

$7.593

-

$7.061

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IDEA Electronic Components Group

UK . 964 parts In-Stock

1+ parts

$8.164

100+ parts

-

1k+ parts

$7.756

10k+ parts

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964

$8.164

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$7.756

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Native Components

USA . 540 parts In-Stock

1+ parts

$12.350

100+ parts

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540

$12.350

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DigiPath Technology Company

USA . 666 parts In-Stock

1+ parts

$12.736

100+ parts

$12.226

1k+ parts

-

10k+ parts

$12.226

666

$12.736

$12.226

-

$12.226

Northwest PG Solutions

USA . 2,364 parts In-Stock

1+ parts

$13.585

100+ parts

$12.227

1k+ parts

-

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2,364

$13.585

$12.227

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Perfect Parts

USA . 671 parts In-Stock

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671

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Source4Electronics, LLC

USA . 37 parts In-Stock

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37

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Overview

Elevate your cellphone's performance with the ADF7025BCPZ by Analog Devices. Known for their top-notch quality and innovative technology, Analog Devices delivers cutting-edge solutions for the telecommunications industry. This Cellphone IC boasts a sleek square package shape and surface mount design, making it ideal for a wide range of applications. With a nominal supply voltage of 3V and industrial-grade temperature tolerance, this IC ensures reliable and efficient operation. Upgrade your device with the ADF7025BCPZ and experience enhanced functionality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto the circuit board, saving time and effort during manufacturing.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the PCB and allowing for denser layouts in cellphone applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for compatibility with different cellphone models and ensures stable operation under varying conditions.

No. of Terminals: 48

The high number of terminals enables the IC to handle complex functions and connections within the cellphone circuit, enhancing its performance.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier style, heat sink/slug, and very thin profile design allows for efficient heat dissipation and space-saving in the cellphone.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand heat stress during prolonged use in cellphones, ensuring reliability and performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables the IC to function in cold environments, making it suitable for use in a wide range of conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring stable connections and long-term reliability of the IC in the cellphone.

Terminal Position: QUAD

Quad terminal position allows for easy mounting and secure connection to the PCB, enhancing the durability and stability of the IC in cellphone applications.

Maximum Seated Height: 1 mm

The low seated height of 1mm allows for slim and compact cellphone designs, enabling thinner form factors and sleek aesthetics.

Width: 7 mm

The compact width of 7mm contributes to space-saving on the PCB, enabling efficient layout and integration of the IC in the cellphone circuit.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures reliable solder joints during assembly, improving the overall quality and durability of the cellphone IC.

Length: 7 mm

The short length of 7mm contributes to the compact design of the IC, allowing for flexible placement and layout within the limited space of cellphones.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliability and performance of the IC under harsh operating conditions, making it suitable for cellphone applications.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and solder joint issues, enhancing the environmental friendliness and reliability of the IC in cellphones.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit type is optimized for processing communication signals in cellphones, providing efficient data transmission and reception capabilities.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent performance and power efficiency of the IC in cellphones, maximizing battery life and overall operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and precise connections on the PCB, allowing for intricate circuit designs in cellphones.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates low moisture sensitivity, ensuring reliable performance of the IC in cellphones even in humid or damp environments.

Technical Specifications

Cellphone ICs ADF7025BCPZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF7025BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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