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AT86RF231-ZU

Microchip Technology

AT86RF231-ZU by Microchip Technology

AT86RF231-ZU by Microchip Technology is a cellphone IC with 32 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8V and 3V. This RF and baseband circuit has a terminal pitch of 0.5mm, making it ideal for telecom applications.

Median Price

$4.120

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 140 parts In-Stock

1+ parts

$1.606

100+ parts

-

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140

$1.606

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DigiKey

USA . 1,235 parts In-Stock

1+ parts

$4.120

100+ parts

$3.775

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-

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1,235

$4.120

$3.775

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Mouser Electronics

USA . 302 parts In-Stock

1+ parts

$4.120

100+ parts

$3.870

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302

$4.120

$3.870

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Master Electronics

USA . 2,450 parts In-Stock

1+ parts

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$3.400

1k+ parts

$3.250

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2,450

-

$3.400

$3.250

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Verical

USA . 2,450 parts In-Stock

1+ parts

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100+ parts

$4.266

1k+ parts

$3.874

10k+ parts

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2,450

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$4.266

$3.874

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Distributors (In-Stock)

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Vyrian

USA . 93 parts In-Stock

1+ parts

$3.700

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93

$3.700

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Digiode

USA . 510 parts In-Stock

1+ parts

$3.851

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510

$3.851

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American Microsemiconductor Inc.

USA . 17 parts In-Stock

1+ parts

$5.590

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17

$5.590

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Maritex

Poland . 5,400 parts In-Stock

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$5.620

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5,400

$5.620

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Chip Stock

USA . 31,100 parts In-Stock

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31,100

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Semi Source

USA . 2,940 parts In-Stock

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2,940

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VNN

France . 2,690 parts In-Stock

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2,690

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Electro Sonic

Canada . 2,450 parts In-Stock

1+ parts

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100+ parts

$4.140

1k+ parts

$3.820

10k+ parts

$3.710

2,450

-

$4.140

$3.820

$3.710

IBS Electronics

USA . 2,450 parts In-Stock

1+ parts

-

100+ parts

$4.769

1k+ parts

$4.558

10k+ parts

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2,450

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$4.769

$4.558

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Bristol Electronics

USA . 2,421 parts In-Stock

1+ parts

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2,421

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Atlantic Semiconductor

USA . 2,421 parts In-Stock

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2,421

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ComSIT Distribution GmbH

Germany . 1,140 parts In-Stock

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1,140

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Nova Conductors

Japan . 450 parts In-Stock

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450

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ACDS - Activité Composants Distribution Service

France . 283 parts In-Stock

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283

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ComSIT USA

USA . 189 parts In-Stock

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189

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SPM Sales

USA . 60 parts In-Stock

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60

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Prism Electronics

USA . 43 parts In-Stock

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43

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 132 parts In-Stock

1+ parts

$3.649

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132

$3.649

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Component Stockers USA

USA . 574 parts In-Stock

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$4.000

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$4.000

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574

$4.000

$4.000

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Ampacity Inc.

Singapore . 915 parts In-Stock

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$7.090

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915

$7.090

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Authorized Procurement Solutions

USA . 409,400 parts In-Stock

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Perfect Parts

USA . 31,627 parts In-Stock

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31,627

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Lixinc

USA . 13,686 parts In-Stock

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13,686

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Futuretech Components

Singapore . 9,800 parts In-Stock

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9,800

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A-Z Elektronik GmbH

Germany . 5,508 parts In-Stock

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5,508

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Alle Elektronik GmbH

Germany . 3,672 parts In-Stock

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3,672

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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West Coast Incorporated

USA . 2,805 parts In-Stock

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2,805

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Supply Digital

USA . 2,698 parts In-Stock

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2,698

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Revolutionize your cellphone experience with the AT86RF231-ZU by Microchip Technology. Known for their top-quality products, Microchip Technology delivers reliable Cellphone ICs that are designed to enhance performance and efficiency. The AT86RF231-ZU offers customers unparalleled value, with its surface mount feature, versatile package shape, and industrial-grade temperature grade. Whether you're looking to upgrade your smartphone's connectivity or improve overall functionality, this Telecom IC Type RF and Baseband Circuit is the perfect solution. Trust Microchip Technology to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and convenient installation on a circuit board, saving time and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape provides stability and efficient use of space on the board, making it ideal for compact electronic devices.

Power Supplies (V): 1.8,3

The availability of multiple power supply voltage options allows for flexibility in design and compatibility with various systems.

No. of Terminals: 32

The higher number of terminals allows for more connections and functionalities within the integrated circuit, enhancing its capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles offer versatility in mounting options and heat dissipation, catering to different design requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments without compromising functionality.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability, ensuring secure connections and reliable performance.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and signal paths, optimizing signal integrity and performance.

Maximum Seated Height: 1 mm

The low seated height facilitates a slim and compact design, making it suitable for thin electronic devices.

Width: 5 mm

The compact width contributes to space-saving on the circuit board and enables the integration of the IC in tight layouts.

Length: 5 mm

The small length dimensions further enhance the compactness of the IC, ideal for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures durability and reliability in harsh industrial environments, making it a robust choice for various applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed performance, making the IC energy-efficient and effective in operation.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joints breaking and improves thermal performance, enhancing the overall reliability of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit type allows for seamless integration in telecommunications systems, providing reliable communication capabilities.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is a common and stable power source for the IC, ensuring consistent performance and compatibility with standard systems.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density integration of components on the circuit board, enhancing functionality and reducing footprint.

Technical Specifications

Cellphone ICs AT86RF231-ZU attributes and parameters. Explore more Cellphone ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8,3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AT86RF231-ZU Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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