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AT86RF233-ZFR

Microchip Technology

AT86RF233-ZFR by Microchip Technology

AT86RF233-ZFR by Microchip is a 32-terminal cellphone IC in a square package with a max operating temperature of 125°C. It features CMOS technology, matte tin terminal finish, and operates at a nominal voltage of 3V. This RF and baseband circuit is ideal for automotive applications due to its very thin profile and quad terminal position.

Median Price

$4.640

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 10,000 parts In-Stock

1+ parts

$4.640

100+ parts

$4.000

1k+ parts

$3.570

10k+ parts

$3.360

10,000

$4.640

$4.000

$3.570

$3.360

Mouser Electronics

USA . 3,333 parts In-Stock

1+ parts

$4.640

100+ parts

$4.330

1k+ parts

-

10k+ parts

-

3,333

$4.640

$4.330

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DigiKey

USA . 4,675 parts In-Stock

1+ parts

$5.170

100+ parts

-

1k+ parts

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10k+ parts

$4.225

4,675

$5.170

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-

$4.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 886 parts In-Stock

1+ parts

$4.085

100+ parts

-

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886

$4.085

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NAC Semi

USA . 10,000 parts In-Stock

1+ parts

$4.970

100+ parts

$4.510

1k+ parts

$4.120

10k+ parts

-

10,000

$4.970

$4.510

$4.120

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Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$5.070

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51

$5.070

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Sensible Micro Corp

USA . 166,500 parts In-Stock

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166,500

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Vyrian

USA . 3,830 parts In-Stock

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3,830

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ComSIT Distribution GmbH

Germany . 1,572 parts In-Stock

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1,572

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VNN

France . 32 parts In-Stock

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32

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,524 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

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10k+ parts

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3,524

$3.650

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Semicontronic

India . 3,371 parts In-Stock

1+ parts

$3.650

100+ parts

$3.559

1k+ parts

$3.540

10k+ parts

-

3,371

$3.650

$3.559

$3.540

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Corphita

USA . 89 parts In-Stock

1+ parts

$3.870

100+ parts

-

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89

$3.870

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Corohmni

South Africa . 24 parts In-Stock

1+ parts

$4.785

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24

$4.785

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Continental Prestige Electronics

USA . 3,200 parts In-Stock

1+ parts

$5.070

100+ parts

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10k+ parts

$4.969

3,200

$5.070

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$4.969

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.070

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100

$5.070

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Aztec Data Supply Inc.

USA . 1,869 parts In-Stock

1+ parts

$15.383

100+ parts

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1,869

$15.383

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Authorized Procurement Solutions

USA . 1,280,200 parts In-Stock

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1,280,200

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Kepictronics

USA . 20,406 parts In-Stock

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20,406

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Perfect Parts

USA . 15,679 parts In-Stock

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15,679

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Lixinc

USA . 12,738 parts In-Stock

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12,738

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LOOK Integrated Logistics

Peru . 6,299 parts In-Stock

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6,299

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Ledger Components

France . 3,897 parts In-Stock

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3,897

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Argo Parts USA

USA . 3,097 parts In-Stock

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3,097

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Supply Digital

USA . 1,977 parts In-Stock

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1,977

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NIA Electronics

USA . 1,728 parts In-Stock

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1,728

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Montano Global Distributors

Canada . 1,563 parts In-Stock

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1,563

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LMD Electronica

Estonia . 748 parts In-Stock

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748

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Glotronic Ltd.

UK . 308 parts In-Stock

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308

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Overview

Enhance your cellphone technology with the AT86RF233-ZFR by Microchip Technology. This high-quality Cellphone IC boasts a range of impressive features, including a compact SQUARE package shape, 32 terminals, and an operating temperature range of -40°C to 125°C. With a focus on Automotive-grade performance, this RF and baseband circuit provides reliable connectivity and seamless communication. Trust in Microchip Technology's expertise to deliver cutting-edge solutions that elevate your mobile device experience. Don't settle for less when you can have the best with the AT86RF233-ZFR. Elevate your technology game today!

Feature Benefit Bullets

Surface Mount: YES

This product can easily be mounted on the surface of a circuit board, making it efficient for manufacturing and assembly processes.

Package Shape: SQUARE

The square shape of the package provides stability and efficient use of space on the circuit board.

No. of Terminals: 32

With 32 terminals, this product offers a wide range of connectivity options and functionalities for the cellphone ICs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures proper heat dissipation, compact design, and efficient performance in a cellphone IC.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand rigorous usage and provide reliable performance even in harsh conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively in varying environmental conditions.

Terminal Finish: MATTE TIN

The matte tin finish ensures good electrical conductivity and durability for the terminals of the cellphone IC.

Terminal Position: QUAD

The quad terminal position provides stability and efficient connectivity for the cellphone IC within the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact and space-saving design for the cellphone IC.

Width: 5 mm

The compact width of 5mm enables the cellphone IC to be integrated into various devices without taking up too much space.

Length: 5 mm

The small length of 5mm complements the compact design of the cellphone IC, making it suitable for modern devices.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the cellphone IC can withstand the temperature fluctuations typically experienced in automotive applications.

Technology: CMOS

The CMOS technology utilized in this product provides low power consumption and high-speed operation for efficient performance in cellphone ICs.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and ensures environmental safety for the cellphone IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This product is designed to support RF and baseband circuits in telecommunications applications, making it versatile and suitable for a wide range of uses.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard power sources and efficient power management in the cellphone IC.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and efficient space utilization on the circuit board.

Technical Specifications

Cellphone ICs AT86RF233-ZFR attributes and parameters. Explore more Cellphone ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AT86RF233-ZFR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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