Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
AT86RF233-ZF by Microchip is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 125°C, suitable for automotive applications. It features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3V.
Median Price
$4.560
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
Microchip Technology
1+ parts
100+ parts
$3.910
1k+ parts
$3.500
10k+ parts
$3.290
Mouser Electronics
$4.140
$4.130
-
DigiKey
$4.138
Digiode
$4.332
Nova Conductors
$4.604
NAC Semi
$4.870
$4.410
$4.040
Vyrian
VNN
Martec Srl
Ampacity Inc.
$3.480
Semicontronic
$3.393
$3.376
Corphita
$4.104
Corohmni
$4.207
Continental Prestige Electronics
$4.512
Aztec Data Supply Inc.
$10.016
Advanced Electronics
$16.722
$15.217
$13.712
Kepictronics
Lixinc
Marpe Global Electronics
QualityLine Systems
XL Components Corporation
Argo Parts USA
Supply Digital
Robosynatics
$10.690
$9.899
Lucentia Tech
Netroflash
$4.374
$4.282
Surface mount technology allows for easy installation and saving of board space, making it a convenient choice for compact electronic devices.
The square package shape provides symmetry and efficient use of space on the circuit board, aiding in a tidy and organized layout.
The high number of terminals allows for a versatile range of connections and functionalities, making it suitable for complex cellphone applications.
The combination of chip carrier, heat sink/slug, and very thin profile package styles offer enhanced thermal management and compact design, ideal for cellphone ICs where space and heat dissipation are crucial.
With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising performance, ensuring reliability in various operating conditions.
The low minimum operating temperature range allows the IC to function effectively even in harsh colder environments, enhancing its versatility and usability.
The matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection for an extended period.
The quad terminal position offers improved stability and ease of soldering during assembly, contributing to the overall durability and quality of the product.
The low maximum seated height allows for a slim and compact design, enabling the IC to be used in thin cellphones without compromising on performance.
The narrow width of 5 mm contributes to space-saving and efficient layout of the circuit board, making it suitable for compact cellphone designs.
The short length of 5 mm further enhances the compactness and flexibility in positioning the IC within the cellphone, optimizing space utilization.
Designed for automotive applications, this IC meets stringent temperature and performance requirements, making it a reliable choice for cellphone usage in various environments.
The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, ensuring efficient operation and longer battery life in cellphones.
The no lead terminal form eliminates the risk of lead contamination and ensures compliance with environmental regulations, promoting sustainability and safety in cellphone manufacturing.
Combining both RF and baseband circuits in a single IC simplifies the design and enhances the performance of cellphones, offering seamless connectivity and communication capabilities.
The nominal supply voltage of 3 V is commonly used in cellphone applications, ensuring compatibility and reliable operation with other components in the device.
The fine terminal pitch of 0.5 mm allows for denser packing of terminals on the IC, enabling more functionality in a compact package, suitable for advanced cellphone features.
Cellphone ICs AT86RF233-ZF attributes and parameters. Explore more Cellphone ICs devices from Microchip Technology
JESD-30 Code:
JESD-609 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
AT86RF233-ZF Telecommunications trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Marking Chgs 11/Jul/2017
PCN Assembly/Origin - AT86RF233 Test Site Add 16/Nov/2018
PCN Packaging - MBB/Label Chgs 16/Nov/2018
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
LM358M
Raytheon Semiconductor
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
BSS123,215
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Meritek Electronics
LM2931Z-5.0RPG
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Lite-on Semiconductor
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
TOBY-L210-03S
U-blox Ag
TOBY-L210-03S by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits at 3.8V supply voltage. Ideal for compact mobile devices due to its small dimensions of 24.8mm width and 35.6mm length.
AD6688BBPZRL-3000
Analog Devices
AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.
MAX2607EUT+
MAX2607EUT+ by Analog Devices is a cellphone IC with 6 terminals, operating from -40 to 85 °C. It has a small outline package style, matte tin terminal finish, and nominal voltage of 2.75V. Ideal for baseband circuits in telecom applications due to its low profile design and industrial temperature grade suitability.
AD8348ARU-REEL7
AD8348ARU-REEL7 by Analog Devices is a Cellphone IC with 28 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. Package style is SMALL OUTLINE, THIN PROFILE, SHRINK PITCH made of PLASTIC/EPOXY material.
AD7005AS
AD7005AS by Analog Devices is a Cellphone IC with 44 terminals in a square package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features CMOS technology, GULL WING terminals, and BASEBAND CIRCUIT telecom IC type.
HMC682LP6CE
Analog Devices' HMC682LP6CE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at a nominal 5V supply voltage. The compact design features a very thin profile, making it ideal for space-constrained environments.
AD6655BCPZ-105
AD6655BCPZ-105 by Analog Devices is a Cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, has a nominal voltage of 1.8V, and terminal pitch of 0.5mm. Ideal for baseband circuit applications due to its industrial temperature grade and compact size.
TCM8002FR
Texas Instruments
Texas Instruments TCM8002FR is a cellphone IC with 44 terminals, operating at -40 to 85°C. It features a supply voltage of 3.3V/5V and CMOS technology, suitable for baseband circuit applications in the telecom industry. The package is a square flatpack measuring 10x10mm with Gull Wing terminals, ideal for surface mount assembly.
MAX2306ETI
Analog Devices' MAX2306ETI is a cellphone IC with 28 terminals, operating at -40 to 85 °C. It has a supply voltage of 3/3.3V and low current draw of 0.0415mA. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package design.
TCM320AC56CDW
TCM320AC56CDW by Texas Instruments is a 20-terminal cellphone IC with 5V power supply, operating b/w 0-70°C. It features a compact rectangular package style, companding law MU-LAW, and telecom IC type BASEBAND CIRCUIT. Ideal for applications requiring small outline packages and high gain tolerance.
SARA-G350-02S-00
SARA-G350-02S-00 by U-blox Ag is a Cellphone IC with 96 terminals, RF & baseband circuit type, and 3.8V supply voltage. It operates b/w -30°C to 85°C, measures 26mm x 16mm x 2.65mm, and can withstand peak reflow at 245°C for up to 60s. Ideal for compact mobile devices requiring reliable cellular connectivity.
AT86RF233-ZF
CC1021RUZR
The Texas Instruments CC1021RUZR is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a 3V supply voltage for telecom applications.
MPCI-L200-03S-00
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
TRF3701CRHCR
TRF3701CRHCR by Texas Instruments is a cellphone IC with 16 terminals, operating at 5V. It features RF and baseband circuits in a square chip carrier package. Ideal for telecom applications, it has a temperature range of 0-70°C and terminal pitch of 0.8mm.
LMV228URX/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
TRF6901PT
TRF6901PT by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 2/3.3V and low profile flatpack package style. Ideal for RF and baseband circuits in industrial telecom applications.
AD6655ABCPZ-125
AD6655ABCPZ-125 by Analog Devices is a cellphone IC with 64 terminals in a square package. Operating b/w -40 to 85°C, it has a supply voltage of 1.8V and max current of 0.705mA. Ideal for baseband circuits, this IC is surface mountable and has a terminal pitch of 0.5mm.
LMH6522SQE
LMH6522SQE by Texas Instruments is a 54-terminal cellphone IC with a rectangular package style. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits in telecom applications. With a low profile of 0.8mm, it features a terminal pitch of 0.5mm and nominal voltage of 5V.
CC2400-STB1
CC2400-STB1 by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.8V, making it ideal for telecom applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
AT86RF233-ZU
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
Atmel
AT86RF233-ZUR
AT86RF233-ZUR by Microchip Technology is a cellphone IC with 32 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier has a compact square shape ideal for telecom applications.
AT86RF231-ZF
AT86RF231-ZF by Microchip Technology is a cellphone IC with surface mount capability. It has 1 function and comes in a square package shape. With a temperature range of -40 to 85 °C, it is suitable for industrial applications as an RF and baseband circuit.
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
AT86RF233-ZFR
AT86RF212-ZU
AT86RF212-ZUR
AT86RF231-ZU
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved