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MAX2306ETI

Analog Devices

MAX2306ETI by Analog Devices

Analog Devices' MAX2306ETI is a cellphone IC with 28 terminals, operating at -40 to 85 °C. It has a supply voltage of 3/3.3V and low current draw of 0.0415mA. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package design.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,619 parts In-Stock

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Anansix

USA . 2,524 parts In-Stock

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Digiode

USA . 2,185 parts In-Stock

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AZTECH Wire

Italy . 641 parts In-Stock

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$10.441

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641

$10.441

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MARBEL Systems

Belgium . 200 parts In-Stock

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$12.084

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Texas Native Microelectronics

USA . 779 parts In-Stock

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$13.890

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$13.334

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$12.918

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$12.223

779

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Kenton Components

USA . 724 parts In-Stock

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$16.668

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724

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Qasali Group International

UK . 50 parts In-Stock

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$37.503

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$34.878

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$33.003

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One Stop Electronics

USA . 1,469 parts In-Stock

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$342.000

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Semicontronic

India . 1,157 parts In-Stock

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$641.000

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$624.975

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$621.770

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Glotronic Ltd.

UK . 2,117 parts In-Stock

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Corphita

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Overview

Unlock the potential of your cellphone with the MAX2306ETI by Analog Devices. Designed by a trusted manufacturer in the industry, this Cellphone IC offers unrivaled performance and reliability. With its small form factor and advanced technology, this IC is perfect for a wide range of applications. Experience seamless connectivity and enhanced functionality with the MAX2306ETI, providing you with the value and benefits you deserve. Elevate your mobile experience today with this cutting-edge solution.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape helps with space-saving on the circuit board and ensures efficient use of available surface area.

Power Supplies (V): 3/3.3

Support for multiple power supplies gives flexibility in design and compatibility with a range of voltage requirements in cellphone applications.

No. of Terminals: 28

Having a high number of terminals allows for more connectivity options and functionality in the device.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact design of the IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in a wide range of environments and climates.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easy placement on the circuit board and enables efficient routing of connections.

Maximum Seated Height: 0.8 mm

Low maximum seated height helps in maintaining a slim profile of the device, making it suitable for compact cellphone designs.

Width: 5 mm

Compact width enables space-efficient integration within the cellphone layout.

Length: 5 mm

Short length helps in saving space on the circuit board and facilitates a streamlined design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh temperature conditions typically encountered in industrial settings.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and is environmentally friendly.

Maximum Supply Current: 0.0415 mA

Low maximum supply current helps in reducing power consumption and extending battery life in cellphones.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit type is essential for processing communication signals in cellphones, ensuring reliable call and data transmission.

Nominal Supply Voltage: 2.75 V

Stable nominal supply voltage of 2.75 V provides consistent power to the IC for reliable performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting and efficient use of space on the circuit board.

Technical Specifications

Cellphone ICs MAX2306ETI attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0415 mA

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MAX2306ETI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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