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CC1020RUZR

Texas Instruments

CC1020RUZR by Texas Instruments

The Texas Instruments CC1020RUZR is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,224 parts In-Stock

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Digiode

USA . 2,111 parts In-Stock

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Sensible Micro Corp

USA . 262 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 82 parts In-Stock

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Parana Technologies

USA . 1,847 parts In-Stock

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$5.735

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$6.528

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1,847

$5.735

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$6.528

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Native Components

USA . 808 parts In-Stock

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$5.991

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808

$5.991

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IDEA Electronic Components Group

UK . 2,001 parts In-Stock

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$6.444

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$5.800

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2,001

$6.444

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$5.800

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ChromeModa Solutions

Germany . 858 parts In-Stock

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$6.444

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$5.284

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858

$6.444

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AZTECH Wire

Italy . 253 parts In-Stock

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$16.256

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One Stop Electronics

USA . 221 parts In-Stock

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$532.000

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S.R.D Solutions

India . 50,000 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Lixinc

USA . 11,201 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,694 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,796 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Northwest PG Solutions

USA . 1,949 parts In-Stock

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$5.872

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GreenTree Electronics

Israel . 1,800 parts In-Stock

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Corphita

USA . 1,334 parts In-Stock

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DigiPath Technology Company

USA . 1,238 parts In-Stock

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$5.810

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Assy Fe

Spain . 1,000 parts In-Stock

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Futuretech Components

Singapore . 381 parts In-Stock

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Computer Components Inc. - USA

USA . 23 parts In-Stock

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Overview

Unlock the power of seamless wireless communication with the CC1020RUZR by Texas Instruments. Crafted with precision and expertise, this cellphone IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers exceptional performance and efficiency. Experience the value and benefits of cutting-edge technology with the CC1020RUZR, designed to elevate your connectivity experience. Trust Texas Instruments to provide innovative solutions that exceed expectations. Elevate your device with the CC1020RUZR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the cellphone ICs.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the ICs onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape helps optimize space on the circuit board and allows for efficient placement of multiple ICs in a compact design.

Power Supplies (V): 3

Operating at a voltage supply of 3V makes these cellphone ICs suitable for low power consumption applications, contributing to energy efficiency.

No. of Terminals: 32

With 32 terminals, these ICs offer versatile connectivity options and can accommodate various input and output signals for enhanced functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environmental conditions, making the ICs suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, these ICs are designed to withstand extreme cold environments, providing reliability in diverse temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: QUAD

The quad terminal position allows for stable and secure connection of the ICs to the circuit board, minimizing the risk of signal interference or disconnection.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1mm, these ICs can be installed in slim and compact devices, saving space and enabling sleek product designs.

Width: 7 mm

The compact width of 7mm makes these ICs suitable for use in small electronic devices where space constraints are a concern, without compromising on performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of thermal damage during assembly, ensuring the long-term reliability of the ICs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering of the ICs onto the circuit board, creating strong and durable connections for optimal performance.

Length: 7 mm

The compact length of 7mm enables these ICs to be integrated into small form factor devices without compromising on functionality, making them ideal for portable electronics.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that these ICs can operate reliably in harsh industrial environments with varying temperature conditions, making them suitable for rugged applications.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of soldering defects and ensures a reliable connection between the ICs and the circuit board, enhancing overall product quality.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit compatibility of these ICs makes them suitable for telecommunications applications, providing integrated functionality for efficient signal processing and communication.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with standard voltage configurations, making these ICs easy to integrate into existing electronic systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting of the ICs on the circuit board, enabling the creation of complex electronic systems in a compact footprint.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, these ICs can withstand moderate exposure to moisture during handling and assembly processes, ensuring long-term reliability in humid environments.

Technical Specifications

Cellphone ICs CC1020RUZR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC1020RUZR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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