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GC5316IZED

Texas Instruments

GC5316IZED by Texas Instruments

GC5316IZED by Texas Instruments is a Cellphone IC with 388 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.5V and 3.3V. This RF and baseband circuit has a terminal pitch of 1mm, making it ideal for telecom applications.

Median Price

$230.282

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 233 parts In-Stock

1+ parts

$211.750

100+ parts

$199.050

1k+ parts

$186.340

10k+ parts

-

233

$211.750

$199.050

$186.340

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DigiKey

USA . 233 parts In-Stock

1+ parts

-

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233

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Verical

USA . 233 parts In-Stock

1+ parts

-

100+ parts

$248.813

1k+ parts

$232.925

10k+ parts

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233

-

$248.813

$232.925

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 156 parts In-Stock

1+ parts

$233.567

100+ parts

-

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156

$233.567

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DigiKey Marketplace

USA . 233 parts In-Stock

1+ parts

$255.690

100+ parts

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233

$255.690

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Vyrian

USA . 5,604 parts In-Stock

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5,604

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,122 parts In-Stock

1+ parts

$12.792

100+ parts

-

1k+ parts

$13.258

10k+ parts

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2,122

$12.792

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$13.258

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ChromeModa Solutions

Germany . 4,008 parts In-Stock

1+ parts

$14.373

100+ parts

$11.786

1k+ parts

-

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4,008

$14.373

$11.786

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$14.373

100+ parts

$13.654

1k+ parts

$12.936

10k+ parts

-

1,542

$14.373

$13.654

$12.936

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Corphita

USA . 516 parts In-Stock

1+ parts

$221.274

100+ parts

-

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516

$221.274

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QUARKTWIN TECHNOLOGY LTD

USA . 10,661 parts In-Stock

1+ parts

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10,661

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Northwest PG Solutions

USA . 1,489 parts In-Stock

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1,489

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DigiPath Technology Company

USA . 848 parts In-Stock

1+ parts

-

100+ parts

$12.959

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848

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$12.959

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Native Components

USA . 209 parts In-Stock

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Overview

Unlock the potential of your cellphone with the Texas Instruments GC5316IZED, a high-quality Cellphone IC that guarantees top-notch performance and reliability. With Texas Instruments' reputation for excellence in the industry, you can trust that this product delivers unmatched value and benefits to meet your needs. Whether you're looking to enhance your phone's RF and baseband circuit capabilities or optimize its power supplies, this IC is the perfect solution. Upgrade your device today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the cellphone IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the cellphone IC onto the circuit board, making it a convenient choice for manufacturers.

Power Supplies (V): 1.5, 3.3

The availability of multiple power supply options (1.5V, 3.3V) allows for versatility in design and compatibility with various voltage requirements in cellphones.

No. of Terminals: 388

With a high number of terminals, this cellphone IC can accommodate multiple connections and functions, making it suitable for complex applications in cellphones.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures (-40°C) ensures reliable performance in diverse environmental conditions, making it ideal for use in mobile devices.

Maximum Seated Height: 2.5 mm

The compact size and low seated height of 2.5mm make this cellphone IC suitable for slim and sleek designs in smartphones.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The combination of RF and Baseband circuits in one IC provides integrated functionality for handling communication signals efficiently in cellphones.

Technical Specifications

Cellphone ICs GC5316IZED attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA388,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Trade Compliance

GC5316IZED Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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