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MAX2046ETJ+T

Analog Devices

MAX2046ETJ+T by Analog Devices

MAX2046ETJ+T by Analog Devices is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features a nominal voltage of 5V and is ideal for baseband circuit applications.

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,699 parts In-Stock

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Digiode

USA . 1,823 parts In-Stock

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Anansix

USA . 390 parts In-Stock

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390

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AZTECH Wire

Italy . 511 parts In-Stock

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$6.426

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MARBEL Systems

Belgium . 752 parts In-Stock

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$7.643

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Texas Native Microelectronics

USA . 817 parts In-Stock

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$8.785

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$8.434

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$8.170

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$7.731

817

$8.785

$8.434

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$7.731

Kenton Components

USA . 2,542 parts In-Stock

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$10.542

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$9.277

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Qasali Group International

UK . 200 parts In-Stock

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$23.720

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$22.059

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$20.873

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One Stop Electronics

USA . 2,219 parts In-Stock

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$75.000

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Semicontronic

India . 1,358 parts In-Stock

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$411.000

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$400.725

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$398.670

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Corphita

USA . 874 parts In-Stock

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Overview

Enhance the performance of your cellphone with the MAX2046ETJ+T by Analog Devices. Known for their superior quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that cater to a wide range of applications. With a sleek square package design and industrial-grade temperature rating, this product offers unmatched value and benefits for customers seeking top-notch telecom ICs. Upgrade your device today and experience the difference that Analog Devices can make in your technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 32

Having 32 terminals provides a high degree of connectivity and functionality, making the IC versatile for various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer enhanced thermal performance and space-saving benefits.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this IC suitable for a wide range of operating conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and solderability, while the annealed nature ensures long-term reliability of the terminals.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connection to the circuit board, minimizing the risk of connectivity issues.

Maximum Seated Height: 0.8 mm

Low maximum seated height saves space in the overall design, making it ideal for compact devices or applications with limited space constraints.

Width: 5 mm

The 5mm width provides a compact form factor, contributing to overall space efficiency and ease of integration into the system.

Length: 5 mm

The 5mm length complements the package shape and width, resulting in a balanced and space-optimized design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature resilience ensures reliable operation in harsh environments commonly encountered in industrial applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates potential lead-related hazards and complies with environmental regulations, contributing to a safer and eco-friendly product.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit type is essential for processing and managing communication signals in telecom applications, making this IC suitable for telecommunications equipment.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5V, which is a common and standardized voltage level in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and precise connectivity, enabling intricate circuit design and functionality.

Technical Specifications

Cellphone ICs MAX2046ETJ+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MAX2046ETJ+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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