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AD6657ABBCZ

Analog Devices

AD6657ABBCZ by Analog Devices

AD6657ABBCZ by Analog Devices is a Cellphone IC with 144 terminals in a square package. It operates at -40 to 85°C, with a supply voltage of 1.8V and max current of 0.51mA. This RF and baseband circuit is ideal for telecom applications due to its low profile, fine pitch design.

Median Price

$196.670

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$94.240

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-

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1

$94.240

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Chip1Stop

Japan . 4 parts In-Stock

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$193.000

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4

$193.000

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Rochester

USA . 5,775 parts In-Stock

1+ parts

$196.670

100+ parts

$184.870

1k+ parts

$173.070

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5,775

$196.670

$184.870

$173.070

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Analog Devices Inc

USA . 934 parts In-Stock

1+ parts

$250.620

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$164.420

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934

$250.620

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$164.420

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DigiKey

USA . 3 parts In-Stock

1+ parts

$271.380

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$228.822

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3

$271.380

$228.822

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Verical

USA . 933 parts In-Stock

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933

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Distributors (In-Stock)

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Digiode

USA . 850 parts In-Stock

1+ parts

$46.598

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850

$46.598

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Vyrian

USA . 2,460 parts In-Stock

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2,460

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Bristol Electronics

USA . 8 parts In-Stock

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8

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 4,768 parts In-Stock

1+ parts

$16.326

100+ parts

-

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$15.183

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4,768

$16.326

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$15.183

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IDEA Electronic Components Group

UK . 954 parts In-Stock

1+ parts

$17.555

100+ parts

$16.677

1k+ parts

$16.677

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954

$17.555

$16.677

$16.677

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DigiPath Technology Company

USA . 4,768 parts In-Stock

1+ parts

$27.386

100+ parts

$26.290

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$26.290

4,768

$27.386

$26.290

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$26.290

Semicontronic

India . 810 parts In-Stock

1+ parts

$41.690

100+ parts

$40.648

1k+ parts

$40.439

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810

$41.690

$40.648

$40.439

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Ampacity Inc.

Singapore . 406 parts In-Stock

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$41.690

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406

$41.690

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Corphita

USA . 577 parts In-Stock

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$44.145

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577

$44.145

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Native Components

USA . 937 parts In-Stock

1+ parts

$1,769.590

100+ parts

$1,734.198

1k+ parts

$1,716.502

10k+ parts

$1,698.806

937

$1,769.590

$1,734.198

$1,716.502

$1,698.806

Northwest PG Solutions

USA . 1,053 parts In-Stock

1+ parts

$1,946.549

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1,053

$1,946.549

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QUARKTWIN TECHNOLOGY LTD

USA . 19,337 parts In-Stock

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19,337

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RC Electronics

USA . 3,725 parts In-Stock

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3,725

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Metaverse IC Inc.

Canada . 229 parts In-Stock

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229

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Futuretech Components

Singapore . 129 parts In-Stock

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129

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Perfect Parts

USA . 7 parts In-Stock

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7

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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2

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Overview

Elevate your cellphone performance with the AD6657ABBCZ by Analog Devices. Crafted with precision and expertise, Analog Devices is renowned for producing high-quality Cellphone ICs that deliver exceptional results. This versatile IC is designed to optimize your device's RF and baseband circuit, offering unparalleled efficiency and reliability. With a compact form factor and innovative features, the AD6657ABBCZ is the perfect solution for enhancing your cellphone's capabilities. Trust Analog Devices to provide cutting-edge technology that exceeds expectations. Elevate your cellphone experience today with the AD6657ABBCZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount compatibility allows for easier and more efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 1.8

Operates at a low voltage of 1.8V, making it energy-efficient and suitable for mobile devices with limited power capabilities.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures of up to 85°C, ensuring stable performance even in demanding conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combines RF and baseband circuit functionalities in one package, simplifying design and integration for telecommunications applications.

Technical Specifications

Cellphone ICs AD6657ABBCZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.51 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

AD6657ABBCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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