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AD6655ABCPZ-150

Analog Devices

AD6655ABCPZ-150 by Analog Devices

AD6655ABCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V and max current of 0.805mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.

Median Price

$230.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 226 parts In-Stock

1+ parts

$179.510

100+ parts

$168.740

1k+ parts

$157.970

10k+ parts

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226

$179.510

$168.740

$157.970

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Analog Devices Inc

USA . 334 parts In-Stock

1+ parts

$230.500

100+ parts

-

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$150.070

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334

$230.500

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$150.070

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$260.180

100+ parts

$206.160

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-

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2

$260.180

$206.160

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Verical

USA . 333 parts In-Stock

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333

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Distributors (In-Stock)

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Digiode

USA . 357 parts In-Stock

1+ parts

$177.868

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357

$177.868

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Vyrian

USA . 5,961 parts In-Stock

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5,961

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ComSIT Distribution GmbH

Germany . 37 parts In-Stock

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37

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Distributors (Availability)

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Corohmni

South Africa . 225 parts In-Stock

1+ parts

$11.322

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-

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225

$11.322

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$14.807

100+ parts

$13.474

1k+ parts

$12.142

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500

$14.807

$13.474

$12.142

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Parana Technologies

USA . 1,701 parts In-Stock

1+ parts

$15.944

100+ parts

-

1k+ parts

$14.828

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1,701

$15.944

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$14.828

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$17.144

100+ parts

$16.287

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$16.287

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1,729

$17.144

$16.287

$16.287

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DigiPath Technology Company

USA . 840 parts In-Stock

1+ parts

$26.745

100+ parts

$25.675

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-

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$25.675

840

$26.745

$25.675

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$25.675

Semicontronic

India . 189 parts In-Stock

1+ parts

$165.970

100+ parts

$161.821

1k+ parts

$160.991

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189

$165.970

$161.821

$160.991

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Corphita

USA . 973 parts In-Stock

1+ parts

$168.507

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973

$168.507

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Native Components

USA . 901 parts In-Stock

1+ parts

$456.151

100+ parts

$447.028

1k+ parts

$442.466

10k+ parts

$437.905

901

$456.151

$447.028

$442.466

$437.905

Northwest PG Solutions

USA . 239 parts In-Stock

1+ parts

$501.766

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239

$501.766

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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RC Electronics

USA . 2,183 parts In-Stock

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A-Z Elektronik GmbH

Germany . 240 parts In-Stock

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240

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Kepictronics

USA . 210 parts In-Stock

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210

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Discover the AD6655ABCPZ-150 by Analog Devices, a cutting-edge Cellphone IC that sets new industry standards for performance and reliability. With Analog Devices' reputation for excellence in semiconductor manufacturing, this innovative product offers unparalleled value to customers seeking top-tier telecom ICs. From its compact square package shape to its precise terminal finish, the AD6655ABCPZ-150 boasts superior quality and efficiency. Elevate your device's capabilities with this Industrial-grade baseband circuit, delivering optimal power supplies and temperature management for seamless operation. Experience the difference with Analog Devices and unleash the full potential of your technology.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Square packages are known for their good thermal properties, ensuring efficient heat dissipation and improving overall product reliability.

Power Supplies (V): 1.8

Operates at a low voltage, reducing power consumption and making it suitable for portable devices like cellphones.

No. of Terminals: 64

Provides sufficient connectivity options for the device, enabling various functions and features to be supported.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of different package styles offers a versatile solution for different design requirements and space constraints.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high-temperature conditions, offering durability and stability for the device.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environmental conditions, providing flexibility and reliability in various usage scenarios.

Terminal Finish: MATTE TIN

Provides a corrosion-resistant finish, ensuring long-term reliability and maintaining signal integrity for the device.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and robustness, reducing the risk of signal interference and improving overall performance.

Maximum Seated Height: 1 mm

Low-profile design saves space and facilitates compact product designs, ideal for slim and sleek cellphone designs.

Width: 9 mm

Compact width dimension allows for efficient board layout and space utilization, suitable for designing compact and portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate reflow time ensures proper soldering of the IC during manufacturing, leading to reliable electrical connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder joint quality, increasing the reliability and longevity of the product.

Length: 9 mm

Optimal length dimension facilitates integration into compact and space-constrained devices, improving overall design flexibility.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the IC suitable for a wide range of environmental conditions, ensuring consistent performance in various applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and improves the product's sustainability profile.

Maximum Supply Current: 0.805 mA

Low supply current consumption minimizes power usage, extending battery life and enhancing energy efficiency of the device.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for baseband processing in telecommunications, ensuring efficient and reliable communication performance in cellphones.

Nominal Supply Voltage: 1.8 V

Stable supply voltage ensures consistent operation and performance, meeting the voltage requirements of modern cellphone systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting, allowing for more functionality in a limited PCB space, suitable for compact cellphone designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly, ensuring long-term reliability.

Technical Specifications

Cellphone ICs AD6655ABCPZ-150 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.805 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

AD6655ABCPZ-150 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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