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CC2510F8RSP

Texas Instruments

CC2510F8RSP by Texas Instruments

Texas Instruments CC2510F8RSP is a cellphone IC with 36 terminals, operating at -40 to 85°C. It features a 3V supply voltage, CMOS technology, and RF/baseband circuit for telecom applications. The chip carrier package has a very thin profile, nickel palladium gold finish, and quad terminal position.

Median Price

$4.325

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 490 parts In-Stock

1+ parts

$2.880

100+ parts

$2.820

1k+ parts

$2.760

10k+ parts

-

490

$2.880

$2.820

$2.760

-

DigiKey

USA . 74 parts In-Stock

1+ parts

$5.770

100+ parts

$4.724

1k+ parts

-

10k+ parts

-

74

$5.770

$4.724

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 96 parts In-Stock

1+ parts

$6.470

100+ parts

-

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-

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96

$6.470

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-

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Bristol Electronics

USA . 122 parts In-Stock

1+ parts

$8.365

100+ parts

$3.932

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-

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122

$8.365

$3.932

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Vyrian

USA . 3,126 parts In-Stock

1+ parts

-

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3,126

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ACDS - Activité Composants Distribution Service

France . 122 parts In-Stock

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122

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Dan-Mar Components

USA . 122 parts In-Stock

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122

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 902 parts In-Stock

1+ parts

$1.879

100+ parts

-

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-

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902

$1.879

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Northwest PG Solutions

USA . 2,022 parts In-Stock

1+ parts

$2.067

100+ parts

-

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2,022

$2.067

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-

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Corphita

USA . 3,588 parts In-Stock

1+ parts

$6.129

100+ parts

-

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3,588

$6.129

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Component Stockers USA

USA . 108 parts In-Stock

1+ parts

$6.390

100+ parts

-

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108

$6.390

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Parana Technologies

USA . 1,615 parts In-Stock

1+ parts

$14.946

100+ parts

-

1k+ parts

$15.371

10k+ parts

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1,615

$14.946

-

$15.371

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DigiPath Technology Company

USA . 1,830 parts In-Stock

1+ parts

$16.457

100+ parts

$15.141

1k+ parts

-

10k+ parts

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1,830

$16.457

$15.141

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ChromeModa Solutions

Germany . 3,402 parts In-Stock

1+ parts

$16.793

100+ parts

$13.770

1k+ parts

-

10k+ parts

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3,402

$16.793

$13.770

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IDEA Electronic Components Group

UK . 1,676 parts In-Stock

1+ parts

$16.793

100+ parts

$15.953

1k+ parts

$15.114

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1,676

$16.793

$15.953

$15.114

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Lixinc

USA . 12,545 parts In-Stock

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12,545

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Perfect Parts

USA . 674 parts In-Stock

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674

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A-Z Elektronik GmbH

Germany . 660 parts In-Stock

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660

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Kepictronics

USA . 440 parts In-Stock

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440

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Cyclops Electronics Ltd (Excess)

UK . 301 parts In-Stock

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301

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

$14.321

1k+ parts

$13.261

10k+ parts

$13.261

100

-

$14.321

$13.261

$13.261

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$14.321

1k+ parts

$13.261

10k+ parts

$13.261

100

-

$14.321

$13.261

$13.261

Overview

Elevate your cellphone designs with the CC2510F8RSP by Texas Instruments, a cutting-edge Cellphone IC that guarantees top-notch quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, this innovative IC offers unrivaled performance and efficiency. Perfect for a wide range of applications, this IC is sure to impress with its advanced features and capabilities. Experience the value and benefits of the CC2510F8RSP today and take your cellphone designs to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for space-constrained applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows flexibility in design and compatibility with various systems.

No. of Terminals: 36

Having 36 terminals provides ample connectivity options for interfacing with other components in the system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish offers excellent corrosion resistance and ensures long-term reliability.

Width: 6 mm

With a width of 6mm, this product is suitable for compact device designs without compromising on performance.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high integration capabilities, making it energy-efficient.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has a moderate level of moisture resistance, suitable for typical operating environments.

Technical Specifications

Cellphone ICs CC2510F8RSP attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC2510F8RSP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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