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TRF372017IRGZT

Texas Instruments

TRF372017IRGZT by Texas Instruments

TRF372017IRGZT by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features power supplies of 3.3V and 5V, suitable for RF and baseband circuits in telecom applications. The package style includes chip carrier and heat sink/slug, with a terminal pitch of 0.5mm.

Median Price

$10.088

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 103 parts In-Stock

1+ parts

$9.369

100+ parts

$8.193

1k+ parts

-

10k+ parts

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103

$9.369

$8.193

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Arrow

USA . 103 parts In-Stock

1+ parts

$9.369

100+ parts

$8.193

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-

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103

$9.369

$8.193

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Chip1Stop

Japan . 103 parts In-Stock

1+ parts

$10.088

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$8.193

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-

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103

$10.088

$8.193

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Texas Instruments

USA . 4,966 parts In-Stock

1+ parts

$10.606

100+ parts

$9.264

1k+ parts

$6.389

10k+ parts

-

4,966

$10.606

$9.264

$6.389

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DigiKey

USA . 136 parts In-Stock

1+ parts

$14.010

100+ parts

$9.499

1k+ parts

$8.762

10k+ parts

-

136

$14.010

$9.499

$8.762

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 884 parts In-Stock

1+ parts

$8.901

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-

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884

$8.901

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$9.583

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100

$9.583

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Vyrian

USA . 915 parts In-Stock

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915

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MRC Electronics

USA . 831 parts In-Stock

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831

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 8,707 parts In-Stock

1+ parts

$2.690

100+ parts

$7.960

1k+ parts

$6.780

10k+ parts

-

8,707

$2.690

$7.960

$6.780

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Ampacity Inc.

Singapore . 463 parts In-Stock

1+ parts

$7.960

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463

$7.960

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Corphita

USA . 3,707 parts In-Stock

1+ parts

$8.432

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3,707

$8.432

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Parana Technologies

USA . 629 parts In-Stock

1+ parts

$9.398

100+ parts

-

1k+ parts

$10.017

10k+ parts

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629

$9.398

-

$10.017

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$9.583

100+ parts

$9.104

1k+ parts

-

10k+ parts

$8.529

800

$9.583

$9.104

-

$8.529

DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

$10.349

100+ parts

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516

$10.349

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ChromeModa Solutions

Germany . 1,405 parts In-Stock

1+ parts

$10.560

100+ parts

$8.659

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1,405

$10.560

$8.659

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

1+ parts

$10.560

100+ parts

$10.032

1k+ parts

$9.504

10k+ parts

-

1,155

$10.560

$10.032

$9.504

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Authorized Procurement Solutions

USA . 186,000 parts In-Stock

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186,000

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Perfect Parts

USA . 13,453 parts In-Stock

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13,453

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Lixinc

USA . 9,393 parts In-Stock

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9,393

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A-Z Elektronik GmbH

Germany . 7,470 parts In-Stock

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7,470

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Kepictronics

USA . 230 parts In-Stock

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230

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Overview

Elevate your cellphone performance with the TRF372017IRGZT by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This versatile IC is perfect for a wide range of applications, offering customers unparalleled value and benefits. With a sleek package design and advanced features like RF and baseband circuit capabilities, this product provides seamless integration and enhanced functionality. Trust Texas Instruments to deliver cutting-edge technology that meets all your needs effortlessly. Step up your game with the TRF372017IRGZT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy body material ensures durability and resistance to external elements, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy integration into various electronic devices, saving space and simplifying assembly processes.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows for flexibility in design and compatibility with a wide range of systems.

No. of Terminals: 48

Having a high number of terminals enables complex connections and functionality, making the product suitable for advanced applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments without issue.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of high-quality terminal finish materials enhances conductivity and corrosion resistance, ensuring optimal performance over time.

Terminal Position: QUAD

The quad terminal position offers improved connectivity and signal transmission capabilities, enhancing the overall functionality of the product.

Width: 7 mm

The compact width of the product makes it suitable for space-constrained applications, providing versatility in design.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes the risk of component damage during assembly, ensuring reliability and product longevity.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates a moderate level of sensitivity, allowing for safe handling and storage of the product.

Technical Specifications

Cellphone ICs TRF372017IRGZT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.25 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF372017IRGZT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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