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CC1100-RTR1

Texas Instruments

CC1100-RTR1 by Texas Instruments

CC1100-RTR1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and CMOS technology. This surface-mount chip carrier is ideal for telecom applications requiring a compact form factor and industrial temperature grade reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,003 parts In-Stock

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Prism Electronics

USA . 2,347 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 2,060 parts In-Stock

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Bristol Electronics

USA . 2,060 parts In-Stock

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Digiode

USA . 1,883 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 273 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 323 parts In-Stock

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$9.367

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$9.988

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323

$9.367

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$9.988

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DigiPath Technology Company

USA . 2,306 parts In-Stock

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$10.314

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$9.489

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$10.314

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IDEA Electronic Components Group

UK . 2,346 parts In-Stock

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$10.525

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$9.999

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$9.472

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ChromeModa Solutions

Germany . 966 parts In-Stock

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$10.525

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$8.630

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AZTECH Wire

Italy . 249 parts In-Stock

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$19.210

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One Stop Electronics

USA . 680 parts In-Stock

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$488.000

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Metaverse IC Inc.

Canada . 28,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,981 parts In-Stock

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Lixinc

USA . 13,295 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 4,684 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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GreenTree Electronics

Israel . 3,250 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,907 parts In-Stock

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Perfect Parts

USA . 2,629 parts In-Stock

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Northwest PG Solutions

USA . 1,810 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,188 parts In-Stock

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Native Components

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Overview

Unlock the power of seamless communication with the CC1100-RTR1 by Texas Instruments. Crafted with precision and expertise, this cellphone IC offers unparalleled quality and reliability. From its surface mount design to its wide operating temperature range, this product is built to exceed expectations. Perfect for a variety of applications, this RF and baseband circuit delivers exceptional performance in industrial settings. Experience the value and benefits of Texas Instruments technology with the CC1100-RTR1, where innovation meets excellence.

Feature Benefit Bullets

Surface Mount: YES

The ability to be surface mounted makes this product easily integrable into circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space and easier alignment during assembly.

Power Supplies (V): 1.8/3.6

The dual power supply options provide flexibility in designing circuits with different voltage requirements.

No. of Terminals: 20

Having a higher number of terminals allows for more connectivity options and functionality within the circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature indicates the product can function in a wide range of environments, including extreme cold.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good solderability and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for easier routing of connections and can potentially optimize signal integrity.

Maximum Seated Height: 0.95 mm

The low maximum seated height helps in achieving a compact design and minimizes the overall profile of the product.

Width: 4 mm

The narrow width of the package allows for high-density mounting and space-saving on the circuit board.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates the product can withstand typical soldering processes without damage.

Terminal Pitch: 0.5 mm

The small terminal pitch enables fine-pitch mounting, improving the overall circuit density and performance.

Technical Specifications

Cellphone ICs CC1100-RTR1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.95 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC1100-RTR1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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