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HMC686LP4E

Analog Devices

HMC686LP4E by Analog Devices

Analog Devices' HMC686LP4E is a 24-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features BICMOS technology for RF and baseband circuits, with a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,333 parts In-Stock

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3,333

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Chip Stock

USA . 3,166 parts In-Stock

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3,166

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Digiode

USA . 473 parts In-Stock

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473

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Martec Srl

Italy . 8 parts In-Stock

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8

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Distributors (Availability)

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AZTECH Wire

Italy . 511 parts In-Stock

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$10.192

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511

$10.192

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Parana Technologies

USA . 465 parts In-Stock

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$16.277

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$15.137

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465

$16.277

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$15.137

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IDEA Electronic Components Group

UK . 2,108 parts In-Stock

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$17.502

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$16.627

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$16.627

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$16.627

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DigiPath Technology Company

USA . 490 parts In-Stock

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$27.303

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$26.211

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$26.211

490

$27.303

$26.211

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$26.211

Ampacity Inc.

Singapore . 431 parts In-Stock

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$677.000

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431

$677.000

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Semicontronic

India . 202 parts In-Stock

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$723.000

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$704.925

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$701.310

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202

$723.000

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One Stop Electronics

USA . 716 parts In-Stock

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$821.000

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Corphita

USA . 772 parts In-Stock

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Overview

Enhance the performance of your cellphone devices with the HMC686LP4E by Analog Devices. This top-quality Cellphone IC offers unparalleled reliability and efficiency, thanks to its innovative technology and precision engineering. From RF to baseband circuits, this versatile component delivers seamless functionality for a wide range of applications. With a compact square package body and surface mount design, the HMC686LP4E is the perfect solution for maximizing space and minimizing power consumption. Trust Analog Devices to provide cutting-edge solutions that elevate your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, perfect for mobile devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving time and effort during manufacturing.

No. of Terminals: 24

Having 24 terminals allows for a greater level of connectivity and functionality within the device, enabling it to perform a wider range of tasks.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand demanding usage conditions without risking overheating or malfunctioning.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can function reliably even in extremely cold environments.

Technology: BICMOS

BICMOS technology offers the advantages of both bipolar and CMOS technologies, providing high performance, low power consumption, and versatility in circuit design.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, the product can be easily integrated into existing electronic systems and power supplies.

Technical Specifications

Cellphone ICs HMC686LP4E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC686LP4E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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