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MAX2059ETL+T

Analog Devices

MAX2059ETL+T by Analog Devices

MAX2059ETL+T by Analog Devices is a 40-terminal cellphone IC with BICMOS tech. Operating temp range -40 to 85 °C, peak reflow temp 260°C. Used in RF and baseband circuits for telecom applications due to its compact square chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,994 parts In-Stock

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7,994

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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Anansix

USA . 2,199 parts In-Stock

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Digiode

USA . 1,040 parts In-Stock

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MARBEL Systems

Belgium . 10 parts In-Stock

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$6.035

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10

$6.035

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Texas Native Microelectronics

USA . 5,929 parts In-Stock

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$6.937

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$6.660

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$6.451

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$6.105

5,929

$6.937

$6.660

$6.451

$6.105

Kenton Components

USA . 828 parts In-Stock

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$8.324

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$7.325

828

$8.324

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$7.325

Advanced Electronics

New Zealand . 40 parts In-Stock

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$8.734

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$7.948

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$7.162

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40

$8.734

$7.948

$7.162

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AZTECH Wire

Italy . 537 parts In-Stock

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$12.775

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537

$12.775

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Qasali Group International

UK . 10 parts In-Stock

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$18.730

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$17.419

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$16.482

10

$18.730

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$16.482

One Stop Electronics

USA . 2,718 parts In-Stock

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$134.000

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Semicontronic

India . 686 parts In-Stock

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$672.000

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$655.200

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$651.840

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$672.000

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RC Electronics

USA . 47,782 parts In-Stock

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$1.740

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$1.590

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$1.540

47,782

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$1.540

QUARKTWIN TECHNOLOGY LTD

USA . 9,652 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Kepictronics

USA . 5,360 parts In-Stock

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Metaverse IC Inc.

Canada . 4,780 parts In-Stock

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4,780

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Glotronic Ltd.

UK . 2,117 parts In-Stock

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Corphita

USA . 1,121 parts In-Stock

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Overview

Enhance the performance of your cellphone with the MAX2059ETL+T by Analog Devices, a top-quality RF and baseband circuit that delivers unparalleled reliability and precision. Manufactured with cutting-edge BICMOS technology, this telecom IC boasts a sleek square package shape and a very thin profile for seamless integration. With a wide operating temperature range and matte tin finish, this surface-mount chip carrier guarantees optimal functionality in industrial environments. Elevate your cellphone's capabilities and experience superior connectivity with the MAX2059ETL+T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape provides for efficient use of space on the PCB, enabling a compact design of the overall device.

No. of Terminals: 40

Having 40 terminals allows for connectivity to various components within the device, enabling versatile functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding operational environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and reliability, essential for long-term performance of the device.

Terminal Position: QUAD

Quad terminal position facilitates easy connection and integration of the IC into the circuit, simplifying assembly process.

Maximum Seated Height: 0.8 mm

Low seated height enables slim and compact device designs, important for modern smartphones and other portable devices.

Width: 6 mm

Narrow width allows for space-efficient placement on the PCB, contributing to overall compact device design.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering of the IC during assembly, enhancing reliability of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh environmental conditions, making it suitable for a wide range of applications.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high performance and low power consumption for efficient operation.

Nominal Supply Voltage: 5 V

5V supply voltage is a widely used standard in the industry, making it compatible with various other components and systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and interconnection, maximizing functionality in a compact space.

Technical Specifications

Cellphone ICs MAX2059ETL+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX2059ETL+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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