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HMC687LP4TR

Analog Devices

HMC687LP4TR by Analog Devices

Analog Devices' HMC687LP4TR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Package style includes heat sink/slug, very thin profile, ideal for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,814 parts In-Stock

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5,814

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Digiode

USA . 722 parts In-Stock

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722

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Distributors (Availability)

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Parana Technologies

USA . 917 parts In-Stock

1+ parts

$10.336

100+ parts

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$9.612

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917

$10.336

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$9.612

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IDEA Electronic Components Group

UK . 1,159 parts In-Stock

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$11.114

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$10.558

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$10.558

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1,159

$11.114

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$10.558

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DigiPath Technology Company

USA . 1,507 parts In-Stock

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$17.338

100+ parts

$16.644

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$16.644

1,507

$17.338

$16.644

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$16.644

AZTECH Wire

Italy . 702 parts In-Stock

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$17.449

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702

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Semicontronic

India . 1,371 parts In-Stock

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$60.000

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$58.500

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$58.200

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1,371

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$58.200

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One Stop Electronics

USA . 1,540 parts In-Stock

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$437.000

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$437.000

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Corphita

USA . 145 parts In-Stock

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Overview

Elevate your cellphone technology with the Analog Devices HMC687LP4TR, a top-tier RF and baseband circuit designed to enhance your mobile experience. Manufactured by industry leader Analog Devices, this chip carrier boasts a very thin profile and heat sink/slug package style for optimal performance. With a wide operating temperature range and innovative BICMOS technology, this product offers unbeatable quality and reliability. Upgrade your smartphone with the HMC687LP4TR and enjoy faster data speeds, improved signal reception, and overall enhanced functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good mechanical strength and protection for the internal components of the IC, making it durable and reliable.

Surface Mount: YES

Surface mount technology makes the IC easier to assemble onto circuit boards, improving efficiency and reducing production costs.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, maximizing component density and design flexibility.

No. of Terminals: 24

Having 24 terminals provides connectivity for a wide range of functions and features, making the IC versatile and capable of handling various tasks.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers thermal management through the heat sink/slug and a compact design with the very thin profile, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environments and maintain reliable performance under demanding conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures the IC can function in both extreme cold and hot conditions, increasing its versatility.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections on the PCB, simplifying the layout and assembly process.

Maximum Seated Height: 1 mm

Low seated height helps in reducing the overall profile of the device, making it suitable for slim and compact designs.

Width: 4 mm

Compact width dimension enables easy integration into tight spaces, enhancing the flexibility of placement in various electronic devices.

Length: 4 mm

Short length dimension contributes to a small form factor, ideal for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability of the IC in harsh industrial environments, making it suitable for rugged applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption in a single IC.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and helps in reducing the overall carbon footprint of the product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry in a single IC simplifies system design, reduces component count, and enhances overall performance in communication applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V allows for compatibility with standard electronic systems and power sources, making integration easier.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm enables high-density mounting on the PCB, facilitating miniaturization and enhancing design flexibility.

Technical Specifications

Cellphone ICs HMC687LP4TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC687LP4TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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