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HMC702LP6CE

Analog Devices

HMC702LP6CE by Analog Devices

HMC702LP6CE by Analog Devices is a cellphone IC with 1 function, operating temperature range of -40 to 85°C, and a package size of 6x6mm. It is used for RF and baseband circuits in the telecom industry.

Median Price

$30.880

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$30.880

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700

$30.880

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Vyrian

USA . 8,690 parts In-Stock

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8,690

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Digiode

USA . 65 parts In-Stock

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65

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Distributors (Availability)

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Parana Technologies

USA . 2,182 parts In-Stock

1+ parts

$12.734

100+ parts

-

1k+ parts

$11.843

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2,182

$12.734

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$11.843

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$13.693

100+ parts

$13.008

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$13.008

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2,267

$13.693

$13.008

$13.008

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AZTECH Wire

Italy . 639 parts In-Stock

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$18.615

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639

$18.615

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DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

$21.361

100+ parts

$20.507

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$20.507

1,910

$21.361

$20.507

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$20.507

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$30.880

100+ parts

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1k+ parts

$29.336

10k+ parts

$28.719

2,000

$30.880

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$29.336

$28.719

Microchip USA

USA . 275 parts In-Stock

1+ parts

$83.099

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275

$83.099

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Semicontronic

India . 208 parts In-Stock

1+ parts

$203.000

100+ parts

$197.925

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$196.910

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208

$203.000

$197.925

$196.910

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One Stop Electronics

USA . 144 parts In-Stock

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$848.000

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144

$848.000

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Ampacity Inc.

Singapore . 1,012 parts In-Stock

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$946.000

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1,012

$946.000

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Lixinc

USA . 19,614 parts In-Stock

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19,614

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Corphita

USA . 253 parts In-Stock

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253

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Authorized Procurement Solutions

USA . 3 parts In-Stock

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Overview

Discover the HMC702LP6CE, a game-changing cellphone IC manufactured by Analog Devices. Designed with utmost quality and precision, this innovative chip offers unparalleled performance and reliability. With a wide range of applications in the telecom industry, from RF to baseband circuits, this product is truly versatile. But what sets it apart? Its value lies in its compact design, low-profile package shape, and surface mount capability. With a terminal finish of matte tin and a nominal supply voltage of 3.3V, the HMC702LP6CE ensures seamless integration and efficient operation. Experience the benefits of cutting-edge technology with this top-of-the-line cellphone IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and cost-effective, making the product easy to handle and affordable for consumers.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, increasing productivity and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the circuit board and enabling denser integration of components.

No. of Terminals: 40

Having 40 terminals allows for more connectivity options and capabilities within the IC, increasing its versatility and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal performance and minimizes the overall size of the IC, improving efficiency and reducing form factor.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand demanding environmental conditions and maintain reliable performance in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the IC remains operational even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections and longevity of the IC.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals and power within the IC, optimizing performance and maintaining signal integrity.

Maximum Seated Height: 0.9 mm

A maximum seated height of 0.9 mm enables the IC to be installed in compact devices with limited space, expanding its applicability across a wide range of products.

Width: 6 mm

The narrow width of 6 mm contributes to the IC's compact design, facilitating integration into small electronic devices without compromising functionality.

Length: 6 mm

The short length of 6 mm complements the square package shape, further enhancing the IC's space-saving capabilities and suitability for densely populated circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in harsh industrial environments, making it a robust and durable choice for industrial applications.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation, low power consumption, and enhanced performance for the IC.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and reduces the risk of lead contamination, making the IC environmentally friendly and safe for use.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Including both RF and baseband circuitry in the IC enables seamless integration of wireless communication functionalities, making it suitable for telecom applications that require both signal processing and wireless connectivity.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is a common standard in electronic devices, ensuring compatibility with existing systems and simplifying integration of the IC into various applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for precise positioning of terminals on the IC, facilitating accurate soldering and reliable connections, which are critical for optimal performance.

Technical Specifications

Cellphone ICs HMC702LP6CE attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC702LP6CE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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