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HMC785LP4ETR

Analog Devices

HMC785LP4ETR by Analog Devices

Analog Devices' HMC785LP4ETR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

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2

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1k+

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Vyrian

USA . 8,835 parts In-Stock

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Digiode

USA . 186 parts In-Stock

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Parana Technologies

USA . 4,247 parts In-Stock

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$6.542

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$6.084

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$6.084

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IDEA Electronic Components Group

UK . 779 parts In-Stock

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$7.034

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$6.682

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779

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AZTECH Wire

Italy . 531 parts In-Stock

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$10.063

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DigiPath Technology Company

USA . 1,174 parts In-Stock

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$10.973

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$10.534

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$10.534

Semicontronic

India . 1,089 parts In-Stock

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$75.000

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$73.125

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$72.750

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Component Stockers USA

USA . 664 parts In-Stock

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$99.990

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One Stop Electronics

USA . 1,178 parts In-Stock

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$148.000

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Ampacity Inc.

Singapore . 1,162 parts In-Stock

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$185.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,211 parts In-Stock

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Corphita

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Overview

Elevate your cellphone’s performance with the HMC785LP4ETR by Analog Devices. Known for their top-notch quality, Analog Devices brings you a cutting-edge Cellphone IC that promises seamless connectivity and enhanced functionality. From RF to baseband circuits, this versatile chip carrier is designed for industrial-grade applications, offering reliability and precision. With a compact and heat sink profile, this Quad terminal package ensures optimal performance even in extreme temperatures. Upgrade your device today with the HMC785LP4ETR and experience the difference Analog Devices can make in your technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices like cellphones.

Surface Mount: YES

Surface mount technology makes the installation of the IC easier and provides a more compact design for the cellphone.

Package Shape: SQUARE

The square package shape allows for easier integration into the design of the cellphone's circuitry and layout.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and functionality in the cellphone IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances the thermal management and overall performance of the cellphone IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the IC can operate reliably even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in various environments, including colder temperatures.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance for the terminals, ensuring long-term reliability.

Terminal Position: QUAD

Having quad terminal positions offers more stable and secure connections for the cellphone IC.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a thinner profile design in the cellphone, saving space and improving the overall aesthetics.

Width: 4 mm

The compact width of 4 mm enables the IC to fit seamlessly within the cellphone's design without compromising on functionality.

Length: 4 mm

The small length of 4 mm contributes to the overall compactness of the IC, making it suitable for modern slim cellphones.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can withstand harsh conditions and industrial environments, making it highly durable.

Technology: BICMOS

The use of BICMOS technology allows for high-speed performance, low power consumption, and integration of analog and digital functions in the cellphone IC.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failure and provides better electrical performance for the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Being designed for RF and baseband circuit applications ensures that the IC can handle the complex communication requirements of a modern cellphone.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in cellphone electronics, providing compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for a higher density of connections, improving the functionality and performance of the cellphone IC.

Technical Specifications

Cellphone ICs HMC785LP4ETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC785LP4ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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