Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The U-blox Ag MAX-7W-0 is a CELLPHONE IC with AEC-Q100 screening, INDUSTRIAL temp grade, and RF/BASEBAND circuit type. It has 18 terminals in MICROELECTRONIC ASSEMBLY package style for applications requiring reliable performance in harsh environments. Operating from -40 to 85 °C, it offers compact dimensions of 9.7mm width and 10.1mm length with a low profile of 2.7mm for space-constrained designs.
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Mouser Electronics
Rochester
$13.350
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Component Electronics Inc.
$38.460
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Vyrian
Bristol Electronics
Martec Srl
J2 Sourcing AB
Corohmni
$7.312
Aztec Data Supply Inc.
$13.590
Continental Prestige Electronics
$18.600
Netroflash
$18.031
$17.651
Argo Parts USA
Perfect Parts
AEC-Q100 refers to automotive-grade qualification, ensuring high reliability and quality, making it suitable for automotive applications where durability is crucial.
Rectangular shape allows for compact design and efficient space utilization in tight layouts.
Sufficient number of terminals to accommodate various connections and functionalities within the IC.
Microelectronic assembly offers high performance and reliability in a small form factor, ideal for applications where space is limited.
High maximum operating temperature allows for reliable performance in demanding environmental conditions.
Low minimum operating temperature enables functionality in cold environments or during temperature fluctuations.
Dual terminal position provides redundancy and enhances reliability of connections within the IC.
Low seated height contributes to a slim profile and efficient thermal management within the system.
Narrow width facilitates integration into compact designs and reduces overall footprint.
Optimal length to accommodate necessary components and functionalities while maintaining a compact size.
Industrial temperature grade ensures reliable performance in a wide range of operating conditions, suitable for industrial applications.
Lead-free terminal form complies with environmental regulations and offers improved soldering reliability and durability.
Integration of RF and baseband circuitry enhances communication performance and efficiency in telecom applications.
Stable supply voltage of 3V ensures consistent performance and efficient power consumption.
Optimal terminal pitch supports secure connections and ease of PCB layout during integration.
MSL 4 indicates a low moisture sensitivity level, ensuring reliability and stability during assembly and operation in humid environments.
Cellphone ICs MAX-7W-0 attributes and parameters. Explore more Cellphone ICs devices from U-blox Ag
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
MAX-7W-0 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Our world is moving fast, soon your car will drive itself and you will carry your doctor in your pocket. Your home will power the grid and you will be connected like never before. At u-blox we are setting the beat delivering the core technology to locate and wirelessly connect people, machines and everything else making us the agile and reliable partner that will take you beyond expectations. With our innovative products and services, we empower customers to locate their devices and connect them from silicon to cloud. Ever since three bright ETH doctorate students and their professor founded u-blox in 1997, two things have driven everything we do: a desire to innovate and a constant focus on giving our customers a real competitive edge.
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
Micro Commercial Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Onsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LMH6521SQE/NOPB
LMH6521SQE/NOPB by Texas Instruments is a cellphone IC with 2 channels, RF and baseband circuit. It operates in industrial temperature range (-40 to 85°C) with a supply voltage of 5V. With a max gain tolerance of 26dB, it is suitable for telecom applications requiring high performance.
CC1000-RTB1
CC1000-RTB1 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. This CMOS technology device has a small outline package style suitable for industrial applications.
LMV226UR/NOPB
Texas Instruments LMV226UR/NOPB is a cellphone IC with surface mount capability. It features grid array package style, 260°C peak reflow temperature, and 8mA max supply current. Ideal for RF and baseband circuits in telecommunications applications.
TLV320AC57IPT
TLV320AC57IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage, operating from -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a low-profile flatpack with gull wing terminals, suitable for industrial temperature grades.
SKY73208-11
Skyworks Solutions
SKY73208-11 by Skyworks Solutions is a cellphone IC with BICMOS technology. It operates b/w -40 to 85°C, has 36 terminals in a square package, and requires 3.3V supply voltage. Ideal for RF and baseband circuits, it features a compact size of 6x6mm for telecom applications.
CC1021RUZ
CC1021RUZ by Texas Instruments is a cellphone IC with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a supply voltage of 3V, it is surface mountable and has a terminal pitch of 0.65mm.
HMC421QS16TR
Analog Devices
Analog Devices' HMC421QS16TR is a cellphone IC with 16 terminals in a small outline package. It operates b/w -40 °C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
SI4713-B30-GM
Silicon Labs
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
CC1050/T&R
CC1050/T&R by Texas Instruments is a cellphone IC with 24 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuit for telecom applications. The package is small outline, thin profile, with 0.65mm terminal pitch suitable for surface mount assembly.
CC2511F32RSPG3
CC2511F32RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuit technology for telecom applications. With a compact size of 6x6mm and terminal pitch of 0.5mm, it is suitable for mobile device designs requiring low power consumption.
HMC601LP4
Analog Devices' HMC601LP4 is a 24-terminal cellphone IC in a square chip carrier package with a very thin profile. It operates b/w -40 to 85°C, suitable for industrial use. This RF front end circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
HMC832ALP6GETR
Analog Devices' HMC832ALP6GETR is a cellphone IC with 40 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications. It features RF and baseband circuits, operates at 3.3V, and has a compact size of 6x6mm with a terminal pitch of 0.5mm.
SARA-R510S-01B
U-blox Ag
RF AND BASEBAND CIRCUIT;
AFE8030EDIABJ
AFE8030EDIABJ by Texas Instruments is a cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with terminal finish of Tin Silver Copper. This RF and baseband circuit has a compact size of 17x17mm for telecom applications.
MAX2363ETMT
Analog Devices' MAX2363ETMT is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85 °C, consuming 0.09mA at 2.8V. Ideal for RF and baseband circuits, it has a terminal pitch of 0.5mm and measures 7x7mm with a height of 0.8mm for industrial applications.
ADRF5547BCPZN
Analog Devices' ADRF5547BCPZN is a 40-terminal cellphone IC with a square surface mount package. It operates b/w -40 to 105°C, ideal for industrial telecom applications. With a nominal voltage of 5V and RF front end circuit type, it offers high performance in a compact chip carrier package.
MAX4003EBL-T
MAX4003EBL-T by Maxim Integrated is a CELLPHONE IC with 8 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits. With a very thin profile of 0.67mm, it has a terminal pitch of 0.5mm ideal for telecom applications.
HMC686LP4
Analog Devices' HMC686LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. The RF and baseband circuit has a nominal voltage of 5V, making it ideal for surface mount designs.
MAX4003EUA+T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
BGA7H1BN6E6327XTSA1
Infineon Technologies
Infineon's BGA7H1BN6E6327XTSA1 is a cellphone IC with 6 terminals, operating temp. range of -40 to 85°C, and supply voltage of 2.8V. It features RF & baseband circuits in a very thin profile chip carrier package for telecom applications.
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MAX-7Q-0-000
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
MAX-7C-0-000
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; Terminal Pitch: 1.1 mm;
MAX-7W-0-000
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
MAX-7C-0
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;
MAX-7Q-0
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; Maximum Seated Height: 2.7 mm;
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