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ADL5360XCPZ-WP

Analog Devices

ADL5360XCPZ-WP by Analog Devices

ADL5360XCPZ-WP by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, ideal for RF front end circuits. This chip carrier has 36 terminals, measures 6x6 mm, and requires a nominal voltage of 3.3V for telecom applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 975 parts In-Stock

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Digiode

USA . 692 parts In-Stock

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Parana Technologies

USA . 113 parts In-Stock

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$7.604

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$7.071

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IDEA Electronic Components Group

UK . 244 parts In-Stock

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$8.176

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$7.767

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DigiPath Technology Company

USA . 841 parts In-Stock

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$12.755

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$12.244

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841

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$12.244

AZTECH Wire

Italy . 497 parts In-Stock

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One Stop Electronics

USA . 1,090 parts In-Stock

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Ampacity Inc.

Singapore . 686 parts In-Stock

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Semicontronic

India . 840 parts In-Stock

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$909.000

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$886.275

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$881.730

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Northwest PG Solutions

USA . 1,252 parts In-Stock

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Native Components

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Corphita

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Overview

Enhance the performance of your cellphone with the ADL5360XCPZ-WP by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that are perfect for a variety of applications. With a compact square package design and industrial-grade technology, this RF front end circuit offers exceptional value and benefits to customers. Upgrade your device today and experience the advantages of Analog Devices' superior products.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, reducing production time and costs.

Package Shape: SQUARE

Square packages are typically more space-efficient and provide better thermal performance compared to other shapes.

No. of Terminals: 36

Having a higher number of terminals allows for more connectivity options and functionality in the device.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is suitable for industrial applications that may experience high temperatures.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the IC can operate in extreme cold conditions as well.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile offers excellent thermal management and space-saving design.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is commonly used in various applications, making the IC compatible with a wide range of devices.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, this IC allows for high-density mounting and more compact PCB designs.

Technical Specifications

Cellphone ICs ADL5360XCPZ-WP attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

ADL5360XCPZ-WP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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