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MAX2021ETX+T

Analog Devices

MAX2021ETX+T by Analog Devices

Analog Devices' MAX2021ETX+T is a Cellphone IC with 36 terminals in a square package. Operating b/w -40 to 85 °C, it uses BICMOS technology and has a supply voltage of 5V. Ideal for baseband circuits, this IC has a max supply current of 0.315mA and terminal pitch of 0.5mm.

Median Price

$7.630

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

MAX2021ETX+T by Analog Devices
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Vyrian

USA . 1,516 parts In-Stock

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$7.630

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1,516

$7.630

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Digiode

USA . 1,265 parts In-Stock

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1,265

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Anansix

USA . 73 parts In-Stock

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73

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Distributors (Availability)

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Semicontronic

India . 2,003 parts In-Stock

1+ parts

$6.490

100+ parts

$6.328

1k+ parts

$6.295

10k+ parts

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2,003

$6.490

$6.328

$6.295

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MARBEL Systems

Belgium . 2,390 parts In-Stock

1+ parts

$8.361

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2,390

$8.361

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Texas Native Microelectronics

USA . 2,509 parts In-Stock

1+ parts

$9.610

100+ parts

$9.226

1k+ parts

$8.937

10k+ parts

$8.457

2,509

$9.610

$9.226

$8.937

$8.457

Kenton Components

USA . 200 parts In-Stock

1+ parts

$11.532

100+ parts

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$10.148

200

$11.532

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$10.148

Qasali Group International

UK . 18 parts In-Stock

1+ parts

$25.947

100+ parts

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$24.131

10k+ parts

$22.833

18

$25.947

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$24.131

$22.833

QUARKTWIN TECHNOLOGY LTD

USA . 19,980 parts In-Stock

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19,980

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Metaverse IC Inc.

Canada . 4,200 parts In-Stock

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4,200

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Corphita

USA . 1,097 parts In-Stock

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1,097

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance the performance of your cellphone devices with the MAX2021ETX+T by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality Cellphone ICs that are surface mountable and designed for superior power efficiency. With a wide range of applications in telecommunications, this product offers exceptional value to customers seeking reliable and efficient solutions. Experience the benefits of advanced technology and unmatched performance with the MAX2021ETX+T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier to mount and solder the IC onto circuit boards, saving time and improving efficiency in manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to integrate the IC into smaller electronic devices.

Power Supplies (V): 5

Operating at a standard supply voltage of 5V makes it compatible with many common electronic systems and power sources.

No. of Terminals: 36

Having 36 terminals allows for a sufficient number of connections for various functions and features, making the IC versatile in different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design provides efficient heat dissipation and space-saving features, ideal for compact devices with thermal constraints.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand demanding environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The IC can operate effectively in cold temperatures as low as -40 °C, ensuring consistent performance even in harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The annealed matte tin finish on the terminals ensures good solderability and reliable electrical connections during assembly and operation.

Terminal Position: QUAD

The quad terminal position simplifies the layout and routing of connections on the IC, improving signal integrity and ease of integration in circuit designs.

Maximum Seated Height: 0.8 mm

The low maximum seated height of only 0.8 mm allows for a compact and slim profile when the IC is mounted on a PCB, contributing to the overall miniaturization of the electronic device.

Width: 6 mm

The compact width of 6 mm enables efficient use of space on the circuit board, especially in applications where size constraints are a concern.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent overheating and ensures quality solder connections during the assembly process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the IC can undergo the solder reflow process effectively without causing damage to the components or connections.

Length: 6 mm

The small length of 6 mm contributes to the compact size of the IC, making it suitable for space-constrained electronic devices and circuit layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that the IC is designed to operate reliably in harsh industrial environments with wide temperature fluctuations, ensuring long-term durability and performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation, low power consumption, and robust performance, making the IC suitable for a wide range of applications.

Terminal Form: NO LEAD

The no lead terminal form eliminates the use of lead-based materials, contributing to environmental sustainability and compliance with regulations such as RoHS, while also enhancing the electrical performance and reliability of the connections.

Maximum Supply Current: 0.315 mA

With a maximum supply current of 0.315 mA, the IC operates with low power consumption, making it energy-efficient and suitable for battery-powered devices or applications with power constraints.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit telecom IC type, this product is optimized for processing and transmitting digital signals in telecommunications systems, ensuring efficient communication and data transfer capabilities.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic systems and circuits, ensuring compatibility and easy integration of the IC in various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for a high density of connections on the IC, enabling more features and functionalities to be packed into a compact space, suitable for applications with limited board space.

Technical Specifications

Cellphone ICs MAX2021ETX+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.315 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX2021ETX+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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