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CC1150-RTR1

Texas Instruments

CC1150-RTR1 by Texas Instruments

CC1150-RTR1 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it suitable for industrial telecom applications.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.130

10k+ parts

$1.060

150

-

$1.260

$1.130

$1.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,294 parts In-Stock

1+ parts

$1.330

100+ parts

-

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3,294

$1.330

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Vyrian

USA . 906 parts In-Stock

1+ parts

$1.400

100+ parts

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906

$1.400

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 353 parts In-Stock

1+ parts

$0.032

100+ parts

-

1k+ parts

-

10k+ parts

$0.031

353

$0.032

-

-

$0.031

Corphita

USA . 3,418 parts In-Stock

1+ parts

$1.260

100+ parts

-

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3,418

$1.260

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Advanced Electronics

New Zealand . 4,470 parts In-Stock

1+ parts

$11.109

100+ parts

$10.109

1k+ parts

$9.109

10k+ parts

-

4,470

$11.109

$10.109

$9.109

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Corohmni

South Africa . 224 parts In-Stock

1+ parts

$12.856

100+ parts

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224

$12.856

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Parana Technologies

USA . 1,442 parts In-Stock

1+ parts

$15.664

100+ parts

-

1k+ parts

$16.035

10k+ parts

-

1,442

$15.664

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$16.035

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DigiPath Technology Company

USA . 1,735 parts In-Stock

1+ parts

$17.248

100+ parts

$15.868

1k+ parts

-

10k+ parts

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1,735

$17.248

$15.868

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ChromeModa Solutions

Germany . 6,718 parts In-Stock

1+ parts

$17.600

100+ parts

$14.432

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-

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6,718

$17.600

$14.432

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IDEA Electronic Components Group

UK . 2,312 parts In-Stock

1+ parts

$17.600

100+ parts

$16.720

1k+ parts

$15.840

10k+ parts

-

2,312

$17.600

$16.720

$15.840

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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3,790

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,793 parts In-Stock

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1,793

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unleash the power of seamless connectivity with the CC1150-RTR1 by Texas Instruments. Crafted with precision and expertise, this cellphone IC promises unparalleled performance and reliability. Whether you're designing cutting-edge smartphones or innovative IoT devices, this product is your go-to solution. With a sleek square package shape and advanced CMOS technology, it offers unmatched value and efficiency. Elevate your projects with the CC1150-RTR1, a game-changer in the world of telecom ICs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product suitable for mass production.

No. of Terminals: 16

Having a sufficient number of terminals allows for connectivity to various components in a cellphone, increasing versatility.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability of the product under various environmental conditions.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V is ideal for compatibility with standard operating voltages in cellphones.

Technical Specifications

Cellphone ICs CC1150-RTR1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.95 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC1150-RTR1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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