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SA638

NXP Semiconductors

SA638 by NXP Semiconductors

SA638 by NXP Semiconductors is a Cellphone IC with 24 terminals, operating at temperatures from -40 to 85°C. It features BICMOS technology, GULL WING terminals, and supports RF and baseband circuits. The package is small outline, thin profile, with shrink pitch and made of plastic/epoxy for surface mount applications.

Median Price

$191.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 63 parts In-Stock

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$191.950

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63

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Digiode

USA . 3,236 parts In-Stock

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3,236

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Anansix

USA . 1,774 parts In-Stock

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1,774

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Vyrian

USA . 1,002 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,993 parts In-Stock

1+ parts

$9.610

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$9.610

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AZTECH Wire

Italy . 641 parts In-Stock

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$11.430

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641

$11.430

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Continental Prestige Electronics

USA . 2,102 parts In-Stock

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$191.950

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$188.111

2,102

$191.950

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$188.111

Netroflash

USA . 1,000 parts In-Stock

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$191.950

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$182.352

10k+ parts

$178.513

1,000

$191.950

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$182.352

$178.513

Ampacity Inc.

Singapore . 660 parts In-Stock

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$589.000

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660

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One Stop Electronics

USA . 809 parts In-Stock

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$950.000

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809

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Argo Parts USA

USA . 3,971 parts In-Stock

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Corphita

USA . 2,765 parts In-Stock

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UNI Independent Distributors

Spain . 41 parts In-Stock

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Overview

Elevate your cellphone's performance with the SA638 by NXP Semiconductors. Crafted with precision and expertise, this Cellphone IC offers unparalleled reliability and efficiency. Whether you're upgrading your device or seeking optimal performance, this small outline, thin profile package is the perfect solution. Experience seamless connectivity and enhanced functionality with this RF and Baseband Circuit. Trust NXP Semiconductors to deliver quality and innovation for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures the IC is suitable for various applications.

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving time and effort in the manufacturing process.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space on the PCB, ideal for devices with limited real estate.

Power Supplies (V): 3

Operates efficiently at a standard voltage, making it compatible with a wide range of systems.

No. of Terminals: 24

Sufficient terminals for connecting various components, offering flexibility in design and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Streamlined design with a small footprint, optimizing space utilization in compact devices.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, ensuring stable performance in demanding environments.

Minimum Operating Temperature: -40 °C

Functions effectively in cold temperatures, suitable for use in a variety of climates and conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a corrosion-resistant and reliable connection for long-lasting performance.

Terminal Position: DUAL

Dual terminal position allows for increased connectivity options, enhancing versatility in circuit design.

Maximum Seated Height: 1.2 mm

Low profile design enables installation in slim devices, without compromising on performance.

Width: 4.4 mm

Compact width facilitates placement in tight spaces, suitable for miniaturized electronic applications.

Length: 7.8 mm

Optimal length to fit standard PCB layouts, making integration seamless in electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability in harsh operating conditions.

Technology: BICMOS

Utilizes advanced BICMOS technology for efficient power management and high-speed performance.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical support and ease of soldering during assembly.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Integrated RF and baseband circuitry for seamless communication in telecommunications applications.

Nominal Supply Voltage: 3 V

Operates at a standard supply voltage, making it compatible with a wide range of systems.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for compact layout design, maximizing space efficiency on the PCB.

Technical Specifications

Cellphone ICs SA638 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA638 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5935-01-543-6787, 5935015436787

NIIN

015436787

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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