Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF3710IRGZR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
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$8.533
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$9.396
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$9.588
$7.862
IDEA Electronic Components Group
$9.109
$8.629
Corphita
$12.618
A-Z Elektronik GmbH
Authorized Procurement Solutions
Kepictronics
Plastic/Epoxy material makes the package lightweight and durable, ensuring longevity and ease of handling.
Surface mount technology allows for easy installation and reduces the likelihood of mechanical failures compared to through-hole mounting.
Square package shape provides uniform layout and efficient use of space on the circuit board.
Operating at 5 volts makes this cellphone IC compatible with a wide range of devices and power sources.
Having 48 terminals allows for versatile connectivity and functionality within the cellphone circuit.
The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.
Being able to operate at up to 85°C makes this cellphone IC suitable for a variety of environments and applications.
With a minimum operating temperature of -40°C, this cellphone IC can withstand extreme cold conditions without malfunctioning.
The use of nickel, palladium, gold, and silver terminal finish ensures reliable connections and resistance to corrosion.
Quad terminal position provides stability and ease of soldering during installation on the circuit board.
With a maximum seated height of 1mm, this cellphone IC fits compactly within the device, optimizing space utilization.
The width of 7mm makes this cellphone IC suitable for smaller devices where space is limited.
The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the manufacturing process.
Operating at a peak reflow temperature of 260°C ensures proper solder flow and joint integrity.
The length of 7mm complements the width and seated height to create a compact and efficient package design.
Being classified as industrial grade means this cellphone IC can withstand harsh environmental conditions and extended usage.
The terminal form without lead helps minimize environmental impact and ensures compliance with regulations regarding hazardous substances.
Combining RF and baseband circuitry in one IC enhances system integration and performance for better overall functionality.
Operating at a nominal supply voltage of 5 volts ensures compatibility with standard power sources, simplifying device integration.
The 0.5mm terminal pitch enables high-density mounting and allows for more terminals to be packed into a smaller area on the circuit board.
Having an MSL of 3 means this cellphone IC can withstand moderate exposure to moisture during storage and handling without compromising performance.
Cellphone ICs TRF3710IRGZR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
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TRF3710IRGZR Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Copper Wire Revision B 16/Dec/2014 Copper Wire Base Metal 19/Jun/2014
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H750VBT6
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Zetex Plc
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
1N4148
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
AD6654BBC
Analog Devices
AD6654BBC by Analog Devices is a Cellphone IC with 256 terminals in a square grid array package. It operates b/w -25 °C to 85°C, with a nominal voltage of 1.8V. This BASEBAND CIRCUIT IC is designed for telecom applications, featuring surface mount capability and TIN LEAD SILVER terminal finish.
LENA-R8001-00C
U-blox Ag
RF AND BASEBAND CIRCUIT;
TRF370333IRGERG4
Texas Instruments
TRF370333IRGERG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square package style suitable for industrial use.
TLV320AC57N
TLV320AC57N by Texas Instruments is a BASEBAND CIRCUIT for cellphones. It operates b/w -40 to 85°C, with 20 terminals in a RECTANGULAR package style. Nominal voltage is 3V, making it suitable for industrial telecom applications.
CC1151IRHBRG4Q1
CC1151IRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, data rate of 0.25 Mbps, and RF/baseband circuit for telecom applications. This AEC-Q100 qualified chip carrier has a compact square shape and is suitable for industrial use.
A7682E
Simcom Wireless Solutions
A7682E by Simcom Wireless Solutions is a Cellphone IC with 85 terminals in a square package. It operates b/w -40°C to 85°C, with a seated height of 2.4mm and nominal voltage of 3.8V. This RF and baseband circuit is ideal for mobile communication devices due to its compact size and temperature range suitability.
TLV320AC57CDWR
TLV320AC57CDWR by Texas Instruments is a cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It operates b/w 0-70°C, suitable for baseband circuits in telecom applications due to its small outline package and gull wing terminal form.
TLV320AC56CDWR
TLV320AC56CDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It is a BASEBAND CIRCUIT for telecom applications, operating b/w 0-70°C in small outline package style.
MAX2351ETI
Analog Devices' MAX2351ETI is a Cellphone IC with BICMOS tech, 28 terminals in a square chip carrier package. Operating temp range -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Dimensions: 5x5mm, terminal pitch 0.5mm, max seated height 0.9mm.
NINA-B222-03B
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 4;
LENA-R8001M10-00C
TCM4400EPETR
TCM4400EPETR by Texas Instruments is a cellphone IC with 80 terminals in a square flatpack package. It operates b/w -25°C to 85°C, with a nominal voltage of 3V. This baseband circuit has gull wing terminals and is suitable for telecom applications.
MAX2607EUT+T
MAX2607EUT+T by Analog Devices is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 2.75V. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and gull wing terminal form.
SARA-U201-03B-00
SARA-U201-03B-00 by U-blox Ag is a CELLPHONE IC with 96 terminals, RECTANGULAR package shape, and 3.25mm seated height. Ideal for TELECOM CIRCUITS, it operates b/w -20 to 65°C with a supply voltage of 3.8V, making it suitable for commercial applications.
HMC683LP6CE
Analog Devices' HMC683LP6CE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at 5V supply voltage. The compact 0.9mm height and 0.5mm terminal pitch make it ideal for space-constrained designs.
ADF4360-8BCPZRL7
Analog Devices' ADF4360-8BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates in industrial temperature range (-40 to 85°C) and has a square package suitable for surface mount applications. Ideal for baseband circuits in telecommunications due to its compact size (4x4mm) and low profile design (1mm).
CC2511F16RSPRG3
CC2511F16RSPRG3 by Texas Instruments is a cellphone IC with 36 terminals in a square package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features a very thin profile, making it ideal for industrial telecom applications.
ADRF5515ABCPZN
RF FRONT END CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
CC2420ZRTCR
CC2420ZRTCR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V. This RF and baseband circuit has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.
MAX2306ETI+T
Analog Devices' MAX2306ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating at -40 to 85 °C, it has a supply voltage of 3/3.3V and max current of 0.0415mA. Ideal for baseband circuits, this IC is designed for telecom applications requiring industrial temperature grade performance.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
TRF370317IRGER
TRF370317IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits in industrial telecom applications.
TRF370317IRGET
TRF370317IRGET by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits, it features nickel palladium gold finish and no-lead terminal form.
TRF3710IRGZT
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
TRF370317IRGERG4
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
TRF370315IRGET
TRF3701IRHCR
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
TRF3040PHP
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
TRF370317IRGETG4
TRF3701CRHC
RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
TRF3702IRHC
TRF3702IRHCG4
TRF3701IRHCG4
TRF3701CRHCR
TRF3702IRHCR
TRF3040PTR
TRF3702IRHCRG4
TRF3701IRHCRG4
TRF3040
TRF3040PT
TRF3701IRHC
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