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LMH6522SQE/NOPB

Texas Instruments

LMH6522SQE/NOPB by Texas Instruments

LMH6522SQE/NOPB by Texas Instruments is a 54-terminal cellphone IC with 4 channels, RF and baseband circuit for telecom applications. It operates b/w -40 to 85°C, has a gain tolerance of 25.74 dB, and draws a max supply current of 485 mA.

Median Price

$19.238

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,861 parts In-Stock

1+ parts

$17.857

100+ parts

$15.598

1k+ parts

$10.757

10k+ parts

-

3,861

$17.857

$15.598

$10.757

-

DigiKey

USA . 28 parts In-Stock

1+ parts

$25.500

100+ parts

$17.893

1k+ parts

$16.846

10k+ parts

-

28

$25.500

$17.893

$16.846

-

Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$25.500

100+ parts

$17.900

1k+ parts

$17.230

10k+ parts

-

14

$25.500

$17.900

$17.230

-

Rochester

USA . 9,125 parts In-Stock

1+ parts

-

100+ parts

$15.390

1k+ parts

$13.770

10k+ parts

$12.960

9,125

-

$15.390

$13.770

$12.960

Verical

USA . 5,688 parts In-Stock

1+ parts

-

100+ parts

$19.238

1k+ parts

$17.212

10k+ parts

$16.200

5,688

-

$19.238

$17.212

$16.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,280 parts In-Stock

1+ parts

$14.193

100+ parts

-

1k+ parts

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10k+ parts

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1,280

$14.193

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-

-

Vyrian

USA . 4,292 parts In-Stock

1+ parts

$14.940

100+ parts

-

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-

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4,292

$14.940

-

-

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Anansix

USA . 2,361 parts In-Stock

1+ parts

-

100+ parts

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2,361

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-

-

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

1+ parts

-

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-

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5

-

-

-

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Prism Electronics

USA . 5 parts In-Stock

1+ parts

-

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5

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-

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Holdelec - ElecDif-Pro

France . 5 parts In-Stock

1+ parts

-

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5

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,186 parts In-Stock

1+ parts

$11.677

100+ parts

$1,084.368

1k+ parts

$10.509

10k+ parts

-

1,186

$11.677

$1,084.368

$10.509

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DigiPath Technology Company

USA . 2,078 parts In-Stock

1+ parts

$12.858

100+ parts

$11.829

1k+ parts

-

10k+ parts

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2,078

$12.858

$11.829

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ChromeModa Solutions

Germany . 2,814 parts In-Stock

1+ parts

$13.120

100+ parts

$10.758

1k+ parts

-

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2,814

$13.120

$10.758

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IDEA Electronic Components Group

UK . 1,269 parts In-Stock

1+ parts

$13.120

100+ parts

$12.464

1k+ parts

$11.808

10k+ parts

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1,269

$13.120

$12.464

$11.808

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Corphita

USA . 1,531 parts In-Stock

1+ parts

$13.446

100+ parts

-

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10k+ parts

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1,531

$13.446

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Perfect Parts

USA . 594 parts In-Stock

1+ parts

-

100+ parts

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594

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Overview

Elevate your cellphone performance with the LMH6522SQE/NOPB by Texas Instruments. This cutting-edge RF and baseband circuit offers unmatched quality and reliability, setting the standard in the industry. With its compact package shape and surface mount design, this Telecom IC provides seamless integration and optimal performance. Experience crystal-clear signals and improved efficiency with its 4 channels and maximum gain tolerance of 25.74 dB. Trust Texas Instruments to deliver top-notch products that exceed expectations. Upgrade your device today with the LMH6522SQE/NOPB for unparalleled value and superior results.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and secure mounting of the IC onto PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, optimizing space on the PCB.

No. of Terminals: 54

With a high number of terminals, this IC can support multiple functions and complex circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance under varying environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function in cold environments without any issues.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability, enhancing the reliability and lifespan of the IC.

Terminal Position: QUAD

The quad terminal position facilitates easy routing of traces on the PCB, improving signal integrity.

Maximum Supply Current: 485 mA

With a high maximum supply current, this IC can handle power-hungry applications without overheating or failing.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in many electronic devices, making it compatible with a wide range of systems.

Technical Specifications

Cellphone ICs LMH6522SQE/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Maximum Gain Tolerance:

25.74 dB

JESD-30 Code:

R-XQCC-N54

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC54,.2X.39,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

485 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.5 mm

Trade Compliance

LMH6522SQE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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