Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
SI4720-B20-GM by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -20°C to 85°C, with a nominal voltage of 3.3V. This RF and baseband circuit has a very thin profile, matte tin finish, and quad terminal position for compact mobile device applications.
Median Price
$3.090
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
< 1k
Symmetry
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Digiode
$2.936
Nova Conductors
$5.310
Chip Stock
Vyrian
Corphita
$2.781
Ampacity Inc.
$5.720
AZTECH Wire
$14.008
Advanced Electronics
$14.223
$12.943
$11.663
QUARKTWIN TECHNOLOGY LTD
Lixinc
Authorized Procurement Solutions
Metaverse IC Inc.
Netroflash
$5.204
$5.044
$4.938
Allows for easy mounting onto PCBs, saving space and providing better thermal performance.
Square package shape is versatile and helps with efficient placement on the PCB.
Provides sufficient connectivity options for the cellphone ICs to interface with other components.
Ensures reliable operation even in high temperature environments.
Wide range of operating temperature ensures adaptability in various conditions.
Matte tin finish provides good solderability and conductivity for stable connections.
Quad terminal position allows for secure and stable mounting on the PCB.
Low profile design enables compact and sleek cellphone designs.
Small width facilitates space-saving integration into cellphone circuits.
High peak reflow temperature ensures reliable solder joints during assembly.
Lead-free terminal form is environmentally friendly and compliant with regulations.
Optimal supply voltage for efficient power consumption and performance.
Narrow terminal pitch allows for high density integration on PCBs.
MSL 3 indicates moderate sensitivity to moisture, ensuring reliability during storage and handling.
Cellphone ICs SI4720-B20-GM attributes and parameters. Explore more Cellphone ICs devices from Silicon Labs
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SI4720-B20-GM Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
ST3485EBDR
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
Secos
Loras Industries
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
SKY85747-11
Skyworks Solutions
SKY85747-11 by Skyworks Solutions is a cellphone IC with 24 terminals in a rectangular package. It operates b/w -40°C to 85°C, with a max supply current of 500mA at 5V. This RF and baseband circuit is ideal for telecom applications due to its compact size and heat sink design.
LT5526EUF#PBF
Linear Technology
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
AD6649BCPZ
Analog Devices
AD6649BCPZ by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V. This RF and baseband circuit has a terminal pitch of 0.5mm and low supply current of 0.3mA, making it ideal for telecom applications.
TRF3702IRHCG4
Texas Instruments
TRF3702IRHCG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square chip carrier package suitable for surface mounting.
MAX2676EWT+
MAX2676EWT+ by Analog Devices is a CELLPHONE IC with BICMOS tech. It operates at -40 to 85 °C, has 3.3V supply, and RF/BASEBAND circuits. The package is GRID ARRAY, 0.69mm height, and 1.27mm length for telecom applications.
MAX2608EUT+
MAX2608EUT+ by Analog Devices is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. This baseband circuit has a nominal voltage of 2.75V and peak reflow temperature of 260°C, making it ideal for telecom applications.
HMC485MS8GETR
Analog Devices' HMC485MS8GETR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
MAX2387EGC+T
MAX2387EGC+T by Analog Devices is a cellphone IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It integrates RF and baseband circuits, operates at 2.7V, and has a terminal pitch of 0.5mm for compact designs.
TCM320AC57CN
Texas Instruments TCM320AC57CN is a 20-terminal IC with 5V power supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a filter. Ideal for cellphone applications due to its BASEBAND CIRCUIT technology and compact IN-LINE package style.
HMC377QS16GE
Analog Devices' HMC377QS16GE is a cellphone IC with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
HMC687LP4ETR
Analog Devices' HMC687LP4ETR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial telecom applications. With matte tin finish and 5V supply voltage, it's ideal for RF and baseband circuits requiring surface mount assembly.
MAX2010ETI+T
MAX2010ETI+T by Analog Devices is a Cellphone IC with 28 terminals, BICMOS technology, and 5V supply voltage. It operates b/w -40 to 85 °C, suitable for RF and baseband circuits in telecom applications due to its compact square package style and low supply current of 0.0121mA.
ADL5387ACPZ-R2
ADL5387ACPZ-R2 by Analog Devices is a 24-terminal cellphone IC with 5V power supply, operating from -40 to 85°C. It features a square surface mount package style and matte tin terminal finish. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.
LMV228URX/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
AD6636BBCZ
Analog Devices' AD6636BBCZ is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.8V, making it ideal for telecom applications.
MAX2308ETI+
MAX2308ETI+ by Analog Devices is a Cellphone IC with 28 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3/3.3V. Ideal for BASEBAND CIRCUIT applications due to its low supply current and compact size.
HMC686LP4
Analog Devices' HMC686LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. The RF and baseband circuit has a nominal voltage of 5V, making it ideal for surface mount designs.
RYZ024A000FZ00#HD0
Renesas Electronics
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
ADS58C20IPFPR
Texas Instruments ADS58C20IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.
ADF4360-6BCPZRL
Analog Devices' ADF4360-6BCPZRL is a Cellphone IC with 24 terminals, operating at -40 to 85 °C. It features a 3.3V supply, BICMOS technology, and matte tin finish. This square chip carrier is ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SI4713-B30-GM
Silicon Labs
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SI4721-B20-GM
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI4711-B30-GM
SI4711-B30-GMR
SI4713-B30-GMR
SI4721-B20-GMR
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
SI4710-B30-GM
SI4710-B30-GMR
SI4712-B30-GMR
SI4713
SI4713 by Silicon Labs is a cellphone IC with 20 terminals in a square package. It features CMOS technology, 0.6mm seated height, and 0.5mm terminal pitch. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and surface mount capability.
SI4705-D50-GMR
BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
SI4705-D50-GM
BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
SI4720-B20-GMR
SI4705
SI4711
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N20;
SI4720-B20-GM
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved