Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SI4720-B20-GM by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -20°C to 85°C, with a nominal voltage of 3.3V. This RF and baseband circuit has a very thin profile, matte tin finish, and quad terminal position for compact mobile device applications.
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Allows for easy mounting onto PCBs, saving space and providing better thermal performance.
Square package shape is versatile and helps with efficient placement on the PCB.
Provides sufficient connectivity options for the cellphone ICs to interface with other components.
Ensures reliable operation even in high temperature environments.
Wide range of operating temperature ensures adaptability in various conditions.
Matte tin finish provides good solderability and conductivity for stable connections.
Quad terminal position allows for secure and stable mounting on the PCB.
Low profile design enables compact and sleek cellphone designs.
Small width facilitates space-saving integration into cellphone circuits.
High peak reflow temperature ensures reliable solder joints during assembly.
Lead-free terminal form is environmentally friendly and compliant with regulations.
Optimal supply voltage for efficient power consumption and performance.
Narrow terminal pitch allows for high density integration on PCBs.
MSL 3 indicates moderate sensitivity to moisture, ensuring reliability during storage and handling.
Cellphone ICs SI4720-B20-GM attributes and parameters. Explore more Cellphone ICs devices from Silicon Labs
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SI4720-B20-GM Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
CRCW06031K00FKEAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06031K00FKEAHP is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.33 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 75 V.
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
2N7002,215
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
TLV320AC56DWR
TLV320AC56DWR by Texas Instruments is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features a small outline package style, Gull Wing terminal form, and 3V supply voltage. Ideal for telecom applications as a baseband circuit due to its industrial temperature grade and compact rectangular shape.
LARA-R202-02B
U-blox Ag
LARA-R202-02B by U-blox Ag is a Cellphone IC with TS 16949 screening. Features RF and baseband circuit for telecom, operates at -20 to 65°C, and requires 3.8V supply voltage. Ideal for compact devices due to its small size of 24x26mm and low seated height of 2.87mm.
CC1110F8RSP
CC1110F8RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, making it suitable for industrial applications. This RF and baseband circuit has a nominal voltage of 3V and terminal pitch of 0.5mm, ideal for telecom devices.
AD6432AST
AD6432AST by Analog Devices is a Cellphone IC with 44 terminals, operating at -25 to 85 °C. It has a supply voltage of 3/3.3 V and uses BIPOLAR technology for BASEBAND CIRCUIT applications in telecom devices. The package is SQUARE, FLATPACK, LOW PROFILE made of PLASTIC/EPOXY with GULL WING terminals.
ADF4360-7BCPZRL7
ADF4360-7BCPZRL7 by Analog Devices is a cellphone IC with a square package shape and 24 terminals. It operates at a voltage of 3.3V and has an industrial temperature grade. This baseband circuit is suitable for telecom applications.
ADRV9029-LB/PCBZ
RF AND BASEBAND CIRCUIT;
HMC601LP4E
Analog Devices' HMC601LP4E is a 24-terminal cellphone IC in a square chip carrier package. With an operating temperature range of -40 to 85°C, it's ideal for industrial telecom applications requiring RF front end circuits. The IC operates at a nominal voltage of 3.3V and features matte tin over nickel terminal finish.
MAX2029ETP+T
MAX2029ETP+T by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 20 terminals in a square package, and requires 5V supply voltage. Ideal for baseband circuits due to its small size (5x5mm) and quad terminal position.
TRF4400PWRG4
TRF4400PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
ADRF5545ABCPZN-R7
Analog Devices' ADRF5545ABCPZN-R7 is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
CC2420RTC
CC2420RTC by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8V and 1.8/3.3V. Ideal for RF and baseband circuits due to its CMOS technology and compact size (7x7mm).
ADF4360-8BCPZRL
Analog Devices' ADF4360-8BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85 °C.
TCM320AC56IN
TCM320AC56IN by Texas Instruments is a 20-terminal IC for cellphones. It operates at temperatures from -40 to 85°C, with a supply voltage of 5V. Featuring companding law MU-LAW and a filter, it is ideal for baseband circuit applications in the telecom industry.
ADF7021BCPZ-RL
Analog Devices' ADF7021BCPZ-RL is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with power supplies of 2.5/3.3V. Ideal for baseband circuits, it has a very thin profile and matte tin terminal finish for industrial applications.
TRF3705IRGER
TRF3705IRGER by Texas Instruments is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features RF and baseband circuits in a square chip carrier package suitable for telecom applications. The IC has a terminal pitch of 0.5mm, no-lead terminal form, and MSL level of 2 for industrial-grade usage.
AD8348ARU
AD8348ARU by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is RECTANGULAR, SMALL OUTLINE, THIN PROFILE, SHRINK PITCH made of PLASTIC/EPOXY material with GULL WING terminals.
MAX2308ETI+
MAX2308ETI+ by Analog Devices is a Cellphone IC with 28 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3/3.3V. Ideal for BASEBAND CIRCUIT applications due to its low supply current and compact size.
LMV225SD
LMV225SD by Texas Instruments is a Cellphone IC with 6 terminals, small outline package style, and industrial temperature grade. It operates b/w -40 to 85°C and has a nominal voltage of 2.7V. Ideal for RF and baseband circuits in telecommunications applications.
CC1000PW
CC1000PW by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry for telecom applications, and CMOS technology in a small outline package suitable for industrial use.
ADRV9029-MB/PCBZ
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SI4713-B30-GM
Silicon Labs
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SI4721-B20-GM
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI4711-B30-GM
SI4711-B30-GMR
SI4713-B30-GMR
SI4721-B20-GMR
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
SI4710-B30-GM
SI4710-B30-GMR
SI4712-B30-GMR
SI4713
SI4713 by Silicon Labs is a cellphone IC with 20 terminals in a square package. It features CMOS technology, 0.6mm seated height, and 0.5mm terminal pitch. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and surface mount capability.
SI4705-D50-GMR
BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
SI4705-D50-GM
BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
SI4720-B20-GMR
SI4705
SI4711
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N20;
Skyworks Solutions
SI4720-B20-GM
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
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