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LMV225TLX/NOPB

Texas Instruments

LMV225TLX/NOPB by Texas Instruments

LMV225TLX/NOPB by Texas Instruments is a cellphone IC with 4 terminals, operating b/w -40 to 85°C. It features a very thin profile grid array package style and requires 2.7V nominal voltage. Ideal for RF and baseband circuits in telecom applications due to its low max supply current of 8mA.

Median Price

$1.066

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 46,500 parts In-Stock

1+ parts

$1.120

100+ parts

$0.925

1k+ parts

$0.500

10k+ parts

-

46,500

$1.120

$0.925

$0.500

-

Rochester

USA . 1,800 parts In-Stock

1+ parts

-

100+ parts

$0.976

1k+ parts

$0.810

10k+ parts

$0.723

1,800

-

$0.976

$0.810

$0.723

DigiKey

USA . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.220

10k+ parts

-

1,800

-

-

$1.220

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Verical

USA . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.013

10k+ parts

$0.903

1,800

-

-

$1.013

$0.903

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,144 parts In-Stock

1+ parts

$0.659

100+ parts

-

1k+ parts

-

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3,144

$0.659

-

-

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Vyrian

USA . 3,844 parts In-Stock

1+ parts

$0.694

100+ parts

-

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-

10k+ parts

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3,844

$0.694

-

-

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ComSIT Distribution GmbH

Germany . 13,500 parts In-Stock

1+ parts

-

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13,500

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Anansix

USA . 2,585 parts In-Stock

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2,585

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,371 parts In-Stock

1+ parts

$0.625

100+ parts

-

1k+ parts

-

10k+ parts

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3,371

$0.625

-

-

-

Parana Technologies

USA . 1,888 parts In-Stock

1+ parts

$5.485

100+ parts

-

1k+ parts

$6.217

10k+ parts

-

1,888

$5.485

-

$6.217

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DigiPath Technology Company

USA . 2,053 parts In-Stock

1+ parts

$6.040

100+ parts

-

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-

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2,053

$6.040

-

-

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ChromeModa Solutions

Germany . 2,208 parts In-Stock

1+ parts

$6.163

100+ parts

$5.054

1k+ parts

-

10k+ parts

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2,208

$6.163

$5.054

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-

IDEA Electronic Components Group

UK . 612 parts In-Stock

1+ parts

$6.163

100+ parts

-

1k+ parts

$5.547

10k+ parts

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612

$6.163

-

$5.547

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Perfect Parts

USA . 238,560 parts In-Stock

1+ parts

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100+ parts

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238,560

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Kepictronics

USA . 24,000 parts In-Stock

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24,000

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Alle Elektronik GmbH

Germany . 3,543 parts In-Stock

1+ parts

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3,543

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-

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S.R.D Solutions

India . 500 parts In-Stock

1+ parts

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500

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Overview

Unlock the full potential of your cellphone with the LMV225TLX/NOPB by Texas Instruments. Designed with precision and quality in mind, this innovative Cellphone IC offers unparalleled performance and reliability. Whether you're looking to enhance your device's RF and baseband circuit or optimize its power efficiency, this product is the perfect solution. With a wide operating temperature range and compact design, the LMV225TLX/NOPB is ideal for a variety of industrial applications. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your cellphone experience today with the LMV225TLX/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent insulation properties and physical protection for the internal components of the IC, enhancing its durability and reliability.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and improving manufacturability.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high temperature environments, ideal for cellphone applications.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Specifically designed for telecom applications, providing optimized performance for cellphones.

Nominal Supply Voltage: 2.7 V

Operates efficiently at a low supply voltage, conserving battery power in cellphones.

Technical Specifications

Cellphone ICs LMV225TLX/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

1.014 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Current:

8 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.014 mm

Trade Compliance

LMV225TLX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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