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CC110LRTKR

Texas Instruments

CC110LRTKR by Texas Instruments

CC110LRTKR by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V and terminal finish of NiPdAu. Ideal for RF and baseband circuits, it has a compact size of 4x4mm and is suitable for industrial temperature grades.

Median Price

$2.025

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 498 parts In-Stock

1+ parts

-

100+ parts

$1.810

1k+ parts

$1.620

10k+ parts

$1.530

498

-

$1.810

$1.620

$1.530

DigiKey

USA . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.100

10k+ parts

-

498

-

-

$2.100

-

Verical

USA . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.025

10k+ parts

$1.913

498

-

-

$2.025

$1.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 550 parts In-Stock

1+ parts

$1.919

100+ parts

-

1k+ parts

-

10k+ parts

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550

$1.919

-

-

-

Vyrian

USA . 6,111 parts In-Stock

1+ parts

-

100+ parts

-

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6,111

-

-

-

-

Cyclops Electronics Ltd

UK . 3,300 parts In-Stock

1+ parts

-

100+ parts

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3,300

-

-

-

-

DigiKey Marketplace

USA . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

498

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 711 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

$0.374

711

$0.390

-

-

$0.374

Northwest PG Solutions

USA . 1,582 parts In-Stock

1+ parts

$0.429

100+ parts

-

1k+ parts

-

10k+ parts

$0.378

1,582

$0.429

-

-

$0.378

Corphita

USA . 3,636 parts In-Stock

1+ parts

$1.818

100+ parts

-

1k+ parts

-

10k+ parts

-

3,636

$1.818

-

-

-

Parana Technologies

USA . 1,059 parts In-Stock

1+ parts

$15.929

100+ parts

-

1k+ parts

$16.285

10k+ parts

-

1,059

$15.929

-

$16.285

-

ChromeModa Solutions

Germany . 3,095 parts In-Stock

1+ parts

$17.898

100+ parts

$14.676

1k+ parts

-

10k+ parts

-

3,095

$17.898

$14.676

-

-

IDEA Electronic Components Group

UK . 678 parts In-Stock

1+ parts

$17.898

100+ parts

$17.003

1k+ parts

$16.108

10k+ parts

-

678

$17.898

$17.003

$16.108

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Kepictronics

USA . 16,000 parts In-Stock

1+ parts

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16,000

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GreenTree Electronics

Israel . 15,000 parts In-Stock

1+ parts

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15,000

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-

-

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A-Z Elektronik GmbH

Germany . 14,238 parts In-Stock

1+ parts

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100+ parts

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14,238

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-

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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8,000

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-

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Lixinc

USA . 5,634 parts In-Stock

1+ parts

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5,634

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-

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Alle Elektronik GmbH

Germany . 4,692 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,692

-

-

-

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

-

100+ parts

$16.137

1k+ parts

-

10k+ parts

-

1,876

-

$16.137

-

-

Overview

Unlock the potential of your cellphone with the CC110LRTKR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that are designed to enhance performance and reliability. With a focus on innovation, this product offers seamless integration, optimized power supplies, and a compact package design. Whether you're looking to improve connectivity, enhance signal processing, or boost overall efficiency, the CC110LRTKR is the perfect solution for your next project. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal conductivity and durability for the package, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto the PCB, saving time and effort during production.

Power Supplies (V): 1.8/3.6

Support for multiple power supply voltages enables flexibility in configuring the IC for different operating conditions.

No. of Terminals: 20

Having 20 terminals allows for a sufficient number of connections for various functions and interfaces within the cellphone IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the IC suitable for use in diverse environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows the IC to function reliably in cold temperatures, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position offers improved connectivity and signal integrity for the IC, contributing to enhanced performance.

Width: 4 mm

Compact width dimension enables space-efficient placement of the IC on the PCB, allowing for more components to be added in a limited area.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the IC can withstand the reflow soldering process during assembly without damage.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates that the IC can operate reliably in harsh industrial environments with varying temperature conditions.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuitry in the IC makes it suitable for cellphone applications requiring high-speed data processing and communication.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent power delivery to the IC, preventing voltage fluctuations that can impact performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC is moderately moisture-sensitive during storage and handling, requiring standard precautions for moisture protection.

Technical Specifications

Cellphone ICs CC110LRTKR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC110LRTKR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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