Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CC2510F16RSPRG3 by Texas Instruments is a cellphone IC with 36 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 2.5/3.3V ideal for RF and baseband circuits. This CMOS technology chip carrier has a very thin profile, suitable for industrial telecom applications.
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$14.710
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$16.528
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$15.702
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$24.000
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Native Components
Surface mount technology allows for easy and efficient installation on PCBs, saving time and space.
The square package shape provides a compact form factor, ideal for space-constrained applications.
Support for multiple power supply voltages allows for flexibility in system design and compatibility with various power sources.
Having a high number of terminals enables connectivity to a wide range of components and peripherals.
The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal management and space-saving benefits.
With a high maximum operating temperature, this product can withstand tough environmental conditions and extended usage.
The low minimum operating temperature ensures reliable operation in cold environments without risk of damage.
The use of nickel, palladium, and gold terminal finish provides excellent conductivity, corrosion resistance, and solderability.
Quad terminal position facilitates easy soldering and enhances electrical performance through stable connections.
The low maximum seated height allows for a slim and compact design, suitable for thin devices and space-constrained layouts.
A narrow width contributes to the overall compactness and efficiency of the product's form factor.
The short maximum time at peak reflow temperature reduces the risk of heat-related damage during soldering processes.
The high peak reflow temperature enables reliable soldering connections and ensures product durability under thermal stresses.
The compact length of 6 mm contributes to the overall small footprint and space-saving design of the product.
Industrial temperature grade ensures reliability and performance consistency in harsh operating environments.
CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making it an efficient choice for cellular ICs.
The no-lead terminal form complies with environmental regulations such as RoHS and provides a lead-free and eco-friendly solution.
Combining RF and baseband circuit functionalities in a single IC offers integrated and efficient communication processing for cellular applications.
The 3 V nominal supply voltage is common in mobile devices, ensuring compatibility and efficient power management.
The fine terminal pitch of 0.5 mm enables high-density integration and precise connections in compact electronic designs.
MSL 3 indicates that the product can withstand moderate exposure to moisture during storage and assembly processes.
Cellphone ICs CC2510F16RSPRG3 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
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CC2510F16RSPRG3 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
EU2B-YS3303C
Idec
ROTARY SWITCH;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
Changzhou Starsea Electronics
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Daco Semiconductor
AD8348ARU-REEL7
Analog Devices
AD8348ARU-REEL7 by Analog Devices is a Cellphone IC with 28 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. Package style is SMALL OUTLINE, THIN PROFILE, SHRINK PITCH made of PLASTIC/EPOXY material.
HMC686LP4
Analog Devices' HMC686LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. The RF and baseband circuit has a nominal voltage of 5V, making it ideal for surface mount designs.
CC1070-RTR1
Texas Instruments
CC1070-RTR1 by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
LMH6521SQE
LMH6521SQE by Texas Instruments is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
MC13142D
NXP Semiconductors
MC13142D by NXP Semiconductors is a cellphone IC with 16 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications. The small outline package style with gull wing terminals makes it suitable for industrial-grade usage.
TRF370315IRGER
TRF370315IRGER by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications, and terminal finish of nickel palladium gold. The package style is chip carrier with very thin profile, suitable for industrial use.
TLV321AC37CPT
TLV321AC37CPT by Texas Instruments is a 48-terminal cellphone IC with CMOS technology. It operates b/w 0-70°C, has a nominal voltage of 3V, and features a low-profile flatpack package style. Ideal for baseband circuits in telecom applications due to its fine pitch and gull wing terminal form.
LMV225SDX
LMV225SDX by Texas Instruments is a Cellphone IC with 6 terminals, operating temperature range of -40 to 85°C. It features a small outline package style and is suitable for RF and baseband circuits in telecom applications.
MAX4003EBL+
Maxim Integrated
MAX4003EBL+ by Maxim Integrated is a CELLPHONE IC with 8 terminals in a GRID ARRAY package. Operating temp range -40 to 85°C, suitable for RF and baseband circuits. Features very thin profile, fine pitch, and terminal finish of TIN SILVER COPPER.
CC1020RSST
The Texas Instruments CC1020RSST is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features RF and baseband circuits, operates at 3V supply voltage with data rate of 0.1536 Mbps.
HMC689LP4TR
Analog Devices' HMC689LP4TR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial applications. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom systems.
MAX2044ETP+T
Analog Devices' MAX2044ETP+T is a Cellphone IC with 20 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3.3/5V. Ideal for RF and baseband circuits, it features BICMOS technology and a terminal pitch of 0.65mm.
TRF4400PW
TRF4400PW by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
HMC600LP4ETR
Analog Devices' HMC600LP4ETR is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
AD6659BCPZRL7-80
AD6659BCPZRL7-80 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style with 64 terminals and matte tin finish. This RF and baseband circuit has a max supply current of 0.119mA, suitable for industrial temperature grade applications.
MAX19995ETX+
MAX19995ETX+ by Analog Devices is a 36-terminal cellphone IC with BICMOS technology. It operates b/w -40 to 85 °C, has a package style of chip carrier, and matte tin terminal finish. Ideal for RF front end circuits in telecom applications due to its compact square shape and industrial temperature grade.
MAX2309ETI+T
MAX2309ETI+T by Analog Devices is a cellphone IC with 28 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3/3.3V. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and low supply current of 0.0415mA.
HMC497LP4TR
Analog Devices' HMC497LP4TR is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, operates at 5V, and has a terminal pitch of 0.5mm for telecom applications.
HMC497LP4E
Analog Devices' HMC497LP4E is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, operates at 5V supply voltage, and has a terminal pitch of 0.5mm.
MAX2608EUT+T
Analog Devices' MAX2608EUT+T is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This baseband circuit has a nominal voltage of 2.75V and peak reflow temperature of 260°C, making it ideal for telecom applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2510F32RHHR
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
CC2591RGVR
RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
CC2591RGVRG4
CC2510F8RSPR
CC2510F8RHHT
CC2510F8RSP
CC2510F16RHHR
CC2511F16RSP
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
CC2510F16RSPG3
CC2510F32RSP
CC2510F32RSPG3
CC2510F8RHHR
CC2510F32RHH
CC2510F16RSP
CC2510F16RSPR
CC2510F32RSPR
CC2510F32RSPRG3
CC2510F32RHHT
CC2510F16RHH
CC2510F16RHHT
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